公开(公告)号：US5502137A

公开(公告)日：1996-03-26

申请号：US344905

申请日：1994-11-25

Applicant: James C. Matayabas, Jr. ,  Peter B. MacKenzie ,  John A. Hyatt

Inventor： James C. Matayabas, Jr. ,  Peter B. MacKenzie ,  John A. Hyatt

IPC: C08G65/14 ,  C08G65/20 ,  C08G65/28 ,  C08G65/322 ,  C08G65/08

CPC classification number: C08G65/14 ,  C08G65/20 ,  C08G65/322

Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of tetrahydrofuran, an acidic catalyst and a nucleophilic initiator compound. The polyether compounds comprise m units of residue (1), n units of residue (2), and p units of residue (3) wherein (i) residues (1), (2) and (3) have the structures: ##STR1## (ii) the total value of m+n+p is 5 to 70; (iii) the value of n/(m+n+p) is in the range of 0.2 to 0.4, i.e., residue (2) constitutes from 20 to 40 mole percent of the total moles of residues (1), (2) and (3); and (iv) at least 98 percent of the terminal groups have the structure: ##STR2##

Abstract translation: 公开了在四氢呋喃，酸性催化剂和亲核引发剂化合物的存在下通过3,4-环氧-1-丁烯的反应或聚合获得的新型聚醚化合物。 聚醚化合物包括m个残基（1），n个残基（2）单元和p个残基（3）单元，其中（i）残基（1），（2）和（3）具有以下结构：

公开(公告)号：US09101931B2

公开(公告)日：2015-08-11

申请号：US11966560

申请日：2007-12-28

Applicant: Lakshmi Supriya ,  James C. Matayabas, Jr. ,  Nirupama Chakrapani

Inventor： Lakshmi Supriya ,  James C. Matayabas, Jr. ,  Nirupama Chakrapani

IPC: B01J19/00 ,  B01L3/00 ,  B29C65/00

CPC classification number: B01L3/502707 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00619 ,  B01L3/502715 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/046 ,  B01L2300/0627 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0822 ,  B01L2300/0867 ,  B01L2300/089 ,  B01L2300/16 ,  B01L2300/161 ,  B01L2300/165 ,  B01L2400/0406 ,  B01L2400/0688 ,  B05D3/12 ,  B05D5/00

Abstract: A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

Abstract translation: 微电子封装包括可以包括用于分析流体的MEMS和CMOS电路的管芯。 提供了将流体引导到管芯的限定的路径。 定义的路径不是在封装衬底中图案化凹陷或物理通道，而是包括可以将液体流引导到用于生物传感器类型应用的管芯的涂层。 所定义的路径可以包括对流体具有亲和性的润湿涂层。 类似地，所定义的路径可以包括去潮涂层，其倾向于排斥路径周围的流体。

公开(公告)号：US08901716B2

公开(公告)日：2014-12-02

申请号：US12774681

申请日：2010-05-05

Applicant: James C. Matayabas, Jr.

Inventor： James C. Matayabas, Jr.

IPC: H01L23/58 ,  H05B6/00 ,  H01L23/532 ,  H01L21/768 ,  H05K3/46 ,  B29C47/00 ,  B29C45/14 ,  B29D7/00 ,  H01L21/56

CPC classification number: H01L23/53295 ,  H01L21/563 ,  H01L21/76828 ,  H01L23/5329 ,  H01L2924/0002 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2203/104 ,  Y10T428/25 ,  H01L2924/00

Abstract: An embodiment of the present invention is a technique to provide a dielectric film material with controllable coefficient of thermal expansion (CTE). A first compound containing a first liquid crystalline component is formed. The first compound is cast into a first film. The first film is oriented in an magnetic or electromagnetic field in a first direction. The first film is cured at a first temperature.

Abstract translation: 本发明的一个实施方案是提供具有可控制的热膨胀系数（CTE）的电介质膜材料的技术。 形成含有第一液晶成分的第一化合物。 第一种化合物被铸成第一片。 第一膜在第一方向上的磁场或电磁场中取向。 第一个膜在第一个温度下固化。

公开(公告)号：US07816171B2

公开(公告)日：2010-10-19

申请号：US11866795

申请日：2007-10-03

Applicant: Paul A. Koning ,  James C. Matayabas, Jr.

Inventor： Paul A. Koning ,  James C. Matayabas, Jr.

IPC: H01L21/00

CPC classification number: H05K3/005 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/15311 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4664 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/1189 ,  H05K2203/122 ,  H01L2924/00

Abstract: Dielectric materials comprising release agents are described. Also described are a process for improving the processability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.

Abstract translation: 描述了包含脱模剂的介电材料。 还描述了一种改善热压花期间介电材料的加工性能的方法，通过热压花制备的基材和包含改进的基材的集成电路封装。

公开(公告)号：US07671120B2

公开(公告)日：2010-03-02

申请号：US11326954

申请日：2006-01-06

Applicant: James C. Matayabas, Jr.

Inventor： James C. Matayabas, Jr.

IPC: C08K5/24

CPC classification number: H01L23/3737 ,  C08G77/12 ,  C08G77/20 ,  C08K3/013 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/02 ,  C08K2201/001 ,  C08L83/00 ,  C08L83/04 ,  H01L23/36 ,  H01L23/42 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2224/0401

Abstract: A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil, at least one conductive filler, and at least one hydrogen terminated silicone oil. The hydrogen terminated silicone oil is used to reduce a shear modulus G′ of the cured thermal interface material.

Abstract translation: 可用作热材料的可固化材料包括至少一种乙烯基封端的硅油，至少一种导电填料和至少一种氢封端的硅油。 氢封端的硅油用于降低固化的热界面材料的剪切模量G'。

公开(公告)号：US07666768B2

公开(公告)日：2010-02-23

申请号：US11541112

申请日：2006-09-29

Applicant: Nachiket R. Raravikar ,  Daewoong Suh ,  Leonel Arana ,  James C. Matayabas, Jr.

Inventor： Nachiket R. Raravikar ,  Daewoong Suh ,  Leonel Arana ,  James C. Matayabas, Jr.

IPC: H01L21/20

CPC classification number: H01L21/76898 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method, apparatus and various material-architectures in an electrically conductive through die via formed of a composite material with a continuous phase of matrix metal and a dispersed phase of graphitic structures of carbon, wherein bulk material properties of the composite material differ from similar bulk material properties of the matrix metal.

Abstract translation: 导电通孔模具中的方法，装置和各种材料结构，其由具有基体金属的连续相的复合材料和碳的石墨结构的分散相形成，其中复合材料的散装材料性质与类似体积不同 基体金属的材料性质。

公开(公告)号：US07465605B2

公开(公告)日：2008-12-16

申请号：US11304403

申请日：2005-12-14

Applicant: Nachiket R. Raravikar ,  James C. Matayabas, Jr.

Inventor： Nachiket R. Raravikar ,  James C. Matayabas, Jr.

IPC: H01L51/40

CPC classification number: B81C1/00206 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B32/174 ,  C01B2202/02 ,  C01B2202/06 ,  C01B2202/08 ,  H01L23/373 ,  H01L23/433 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10S977/742 ,  Y10S977/745 ,  Y10S977/746 ,  Y10T428/25 ,  H01L2924/00

Abstract: An embodiment of the present invention is a technique to functionalize carbon nanotubes in situ. A carbon nanotube (NT) array is grown or deposited on a substrate. The NT array is functionalized in situ with a polymer by partial thermal degradation of the polymer to form a NT structure. The functionalization of the NT structure is characterized. The functionalized NT structure is processed according to the characterized functionalization.

Abstract translation: 本发明的一个实施方案是用于原位官能化碳纳米管的技术。 碳纳米管（NT）阵列生长或沉积在基底上。 NT阵列与聚合物原位官能化，聚合物通过部分热降解形成NT结构。 特征是NT结构的功能化。 功能化的NT结构根据表征的功能化进行处理。

公开(公告)号：US07179689B2

公开(公告)日：2007-02-20

申请号：US11282255

申请日：2005-11-18

Applicant: James C. Matayabas, Jr. ,  Gudbjorg H. Oskarsdottir ,  Mitesh C. Patel

Inventor： James C. Matayabas, Jr. ,  Gudbjorg H. Oskarsdottir ,  Mitesh C. Patel

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.

公开(公告)号：US07170188B2

公开(公告)日：2007-01-30

申请号：US10882783

申请日：2004-06-30

Applicant: James C. Matayabas, Jr. ,  Gudbjorg H. Oskarsdottir ,  Mitesh C. Patel

Inventor： James C. Matayabas, Jr. ,  Gudbjorg H. Oskarsdottir ,  Mitesh C. Patel

IPC: H01L23/28

CPC classification number: H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.

Abstract translation: 描述了半导体封装的应力和翘曲的装置和方法的许多实施例。 在一个实施例中，半导体管芯设置在衬底之上。 封装材料设置在基板和半导体管芯上方，其中封装材料具有低热膨胀系数和高热膨胀系数的组合。

公开(公告)号：US5393867A

公开(公告)日：1995-02-28

申请号：US181735

申请日：1994-01-18

Applicant: James C. Matayabas, Jr. ,  Falling: Stephen N.

Inventor： James C. Matayabas, Jr. ,  Falling: Stephen N.

IPC: C08G65/14 ,  C08G65/26 ,  C08G65/28 ,  C08G59/68

CPC classification number: C08G65/266 ,  C08G65/14

Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of a palladium(O) catalyst and a nucleophilic initiator compound. The polyether compounds comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, m/(n+m) is greater than 0.30 and up to 0.75, and residues (1) and (2) have the structures: ##STR1##

Abstract translation: 公开了在钯（O）催化剂和亲核引发剂化合物存在下，通过3,4-环氧-1-丁烯的反应或聚合得到的新型聚醚化合物。 聚醚化合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2至70，m /（n + m）大于0.30且至多为0.75，以及 残基（1）和（2）具有以下结构：（1）OCH2CHCHCH2。 （2）