公开(公告)号：US07704846B2

公开(公告)日：2010-04-27

申请号：US11546358

申请日：2006-10-12

申请人： Seung-Hyun Cho ,  Il-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

发明人： Seung-Hyun Cho ,  Il-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

IPC分类号： H01L21/20

CPC分类号： H05K1/188 ,  H01L23/5389 ,  H01L23/642 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K3/323 ,  H05K2201/0347 ,  H05K2201/0355 ,  H01L2224/05599

摘要： A method for manufacturing a substrate embedded with a passive device, comprising the steps of (a) molding the passive device and (b) mounting the molded passive device in a cavity formed on the substrate, is disclosed. The substrate embedded with a passive device and the manufacturing method thereof in accordance with the present invention can prevent warpage of the substrate caused by disproportioned properties of materials.

摘要翻译： 公开了一种用于制造嵌入无源器件的衬底的方法，包括以下步骤：（a）模制无源器件，和（b）将模制的无源器件安装在形成在衬底上的空腔中。 嵌入无源器件的衬底及其根据本发明的制造方法可以防止由材料的不均衡性质引起的衬底翘曲。

公开(公告)号：US20090184420A1

公开(公告)日：2009-07-23

申请号：US12213466

申请日：2008-06-19

申请人： Jin-Won Choi ,  Chang-Sup Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

发明人： Jin-Won Choi ,  Chang-Sup Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

IPC分类号： H01L23/488 ,  H01L21/44 ,  H05K3/00 ,  H05K1/00

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0568 ,  H05K2203/0571 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： A post bump and a method of forming the post bump are disclosed. The method of forming the post bump can include: forming a resist layer, in which an aperture is formed in correspondence to a position of an electrode pad, over a substrate, on which the electrode pad is formed; forming a metal post by filling a part of the aperture with a metallic material; filling a remaining part of the aperture with solder; reflowing the solder by applying heat; and removing the resist layer. This method can be utilized to prevent deviations in the plated solder and prevent the unnecessary flowing of the solder over the sides of the metal post during reflowing, so that the amount of solder used can be minimized.

摘要翻译： 公开了一种后凸块和形成凸块的方法。 形成后凸块的方法可以包括：在其上形成有电极焊盘的基板上形成抗蚀剂层，其中形成有孔对应于电极焊盘的位置; 通过用金属材料填充孔的一部分来形成金属柱; 用焊料填充孔的剩余部分; 通过加热回流焊料; 并除去抗蚀剂层。 该方法可以用于防止电镀焊料中的偏差，并且防止在回流期间焊料在金属柱的侧面上不必要的流动，使得可以使所使用的焊料的量最小化。

公开(公告)号：US20090087950A1

公开(公告)日：2009-04-02

申请号：US12010544

申请日：2008-01-25

申请人： Soon-Jin Cho ,  Jin-Won Choi ,  Seung-Hyun Cho ,  Chung-Woo Cho ,  Dong-Gyu Lee ,  Seok-Hwan Ahn

发明人： Soon-Jin Cho ,  Jin-Won Choi ,  Seung-Hyun Cho ,  Chung-Woo Cho ,  Dong-Gyu Lee ,  Seok-Hwan Ahn

IPC分类号： H01L21/58

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/00014

摘要： A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.

摘要翻译： 公开了一种晶片封装方法。 本发明的一个方面是提供一种晶片封装方法，包括： 将带附着到载体的一侧上，所述载体具有形成在其中的通孔; 将晶片附接到暴露在通孔内的带上，使得晶片的至少一个电极露出; 以及在所述载体上执行封装处理以使所述晶片被封装。

公开(公告)号：US20070045821A1

公开(公告)日：2007-03-01

申请号：US11508306

申请日：2006-08-23

申请人： Seung-Hyun Cho ,  Han Kim ,  Soon-Oh Jung

发明人： Seung-Hyun Cho ,  Han Kim ,  Soon-Oh Jung

IPC分类号： H01L23/12

CPC分类号： H01L23/147 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/09354 ,  H05K2201/09781 ,  H01L2924/00

摘要： A printed circuit board for inhibiting warpage is disclosed. The printed circuit board has a core layer, which is formed by an insulating material; a circuit pattern layer, which is formed in the upper part of the core layer and has a central area, in which a circuit pattern is formed, and a fringe, which surrounds the central area and is made of a material of high stiffness; an insulating layer, which is formed in the upper part of the circuit pattern layer; and a solder resist, which is formed in the upper part of the insulating layer. The printed circuit board with a dual type inner structure in accordance with the present invention has an effect of inhibiting warpage by having an inner structure in which the rim is made of a material that is hardly warped and a vertex in which the rim is shaped round.

摘要翻译： 公开了一种用于抑制翘曲的印刷电路板。 印刷电路板具有由绝缘材料形成的芯层; 电路图案层，其形成在芯层的上部并具有形成电路图案的中心区域和围绕中心区域并由高刚度材料制成的边缘; 绝缘层，其形成在电路图案层的上部; 以及形成在绝缘层的上部的阻焊剂。 根据本发明的具有双重内部结构的印刷电路板具有通过具有内部结构来抑制翘曲的效果，其中边缘由几乎不翘曲的材料制成，并且边缘形成圆顶的顶点 。

公开(公告)号：US20070018335A1

公开(公告)日：2007-01-25

申请号：US11483844

申请日：2006-07-11

申请人： Seung-Hyun Cho ,  Soon-Jin Cho ,  Jae-Joon Lee ,  Se-Jong Oh

发明人： Seung-Hyun Cho ,  Soon-Jin Cho ,  Jae-Joon Lee ,  Se-Jong Oh

IPC分类号： H01L23/48

CPC分类号： H01L23/13 ,  H01L23/562 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A flip chip BGA board is disclosed, in which each of the corners of the board is removed to minimize warpage of the board due to heat applied during the manufacturing process. Embodiments of the invention allow the production of thin boards by preventing warpage of the board, and may provide a board high in reliability since the risk of the chip being separated from the board is reduced.

摘要翻译： 公开了一种倒装芯片BGA板，其中去除板的每个拐角以最小化由于在制造过程中施加的热而引起的板的翘曲。 本发明的实施例允许通过防止板的翘曲来生产薄板，并且可以提供高可靠性的板，因为芯片与板分离的风险降低。

公开(公告)号：US20050202267A1

公开(公告)日：2005-09-15

申请号：US10522852

申请日：2002-11-29

申请人： Jin-Wook Ha ,  Jin-Heon Ha ,  Jee-Nyu Hong ,  Seung-Hyun Cho

发明人： Jin-Wook Ha ,  Jin-Heon Ha ,  Jee-Nyu Hong ,  Seung-Hyun Cho

IPC分类号： C09K9/02 ,  G02B5/23 ,  G03C1/685 ,  B32B27/30

CPC分类号： C09K9/02 ,  C09K2211/1029 ,  C09K2211/1033 ,  C09K2211/1088 ,  G02B5/23 ,  G03C1/685 ,  Y10T428/31935

摘要： Disclosed is a coating composition for a plastic photochromic lens and the plastic photochromic lens coated with the same. The coating composition includes a spiropyran photovariable color compound and/or spirooxazine photovariable color compound dissolved in toluene, and an acryl based binder. The plastic photochromic lens coated with the coating composition has advantages of short variable time, and good adhesion of the coating composition to the plastic lens and UV prevention effect without an undesirable haze phenomenon.

摘要翻译： 公开了一种用于塑料光致变色透镜的涂料组合物和用其涂覆的塑料光致变色透镜。 涂料组合物包括溶于甲苯的螺吡喃光变色化合物和/或螺恶嗪光变色剂，以及丙烯酸类粘合剂。 涂覆有涂料组合物的塑料光致变色镜片具有时间短，涂料组合物对塑料透镜的良好粘附性和防紫外线效果的优点，而没有不期望的雾度现象。

公开(公告)号：US20120064641A1

公开(公告)日：2012-03-15

申请号：US13153789

申请日：2011-06-06

申请人： Mi-Youn Yang ,  Jun-Ho Lee ,  Seung-Hyun Cho

发明人： Mi-Youn Yang ,  Jun-Ho Lee ,  Seung-Hyun Cho

IPC分类号： H01L33/00

CPC分类号： H01L27/1259 ,  H01L27/3244 ,  H01L2251/568

摘要： A method of fabricating an organic electroluminescent device (OELD) according to the present invention has steps of repairing a pixel region by irradiating a laser on a drain contact hole of a passivation layer in a pixel region in need of the repair; and disabling the connection between an organic electroluminescent diode and a drain electrode of a driving thin film transistor (TFT), where the pixel region of the OELD has i) the driving TFT comprising the drain electrode, ii) the passivation layer covering the driving TFT, while comprising the drain contact hole exposing the drain electrode of the driving TFT, and iii) the organic electroluminescent diode connected to the drain electrode of the driving TFT via the drain contact hole.

摘要翻译： 根据本发明的制造有机电致发光器件（OELD）的方法具有通过在需要修复的像素区域中的钝化层的漏极接触孔上照射激光来修复像素区域的步骤; 以及禁止驱动薄膜晶体管（TFT）的有机电致发光二极管和漏电极之间的连接，其中OELD的像素区域具有i）包括漏电极的驱动TFT，ii）覆盖驱动TFT的钝化层 同时包括暴露驱动TFT的漏电极的漏极接触孔，以及iii）经由漏极接触孔连接到驱动TFT的漏电极的有机电致发光二极管。

公开(公告)号：US20110012261A1

公开(公告)日：2011-01-20

申请号：US12923453

申请日：2010-09-22

申请人： Jin-Won Choi ,  Chang-Suo Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

发明人： Jin-Won Choi ,  Chang-Suo Ryu ,  Seung-Hyun Cho ,  Seung-Wan Kim

IPC分类号： H01L23/48

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0568 ,  H05K2203/0571 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post.

摘要翻译： 在用于电连接到外部装置的基板的电极焊盘上形成的凸块，所述柱凸起包括形成在所述电极焊盘上的金属柱; 以及形成在所述金属柱上并形成为圆顶的焊料，所述圆顶占据由沿所述金属柱的轴向方向从所述金属柱的周边延伸的假想线限定的空间。

公开(公告)号：US07704682B2

公开(公告)日：2010-04-27

申请号：US10903055

申请日：2004-07-30

申请人： Seung-Hyun Cho ,  Byoungwhi Kim ,  Hyeong-Ho Lee

发明人： Seung-Hyun Cho ,  Byoungwhi Kim ,  Hyeong-Ho Lee

IPC分类号： G02B6/02

CPC分类号： G02B6/02123 ,  G02B6/02114 ,  G02B6/02138 ,  G03F7/001

摘要： The method of manufacturing the optical fiber having the Bragg grating includes the steps of applying heat from a heat source to a predetermined portion of the optical fiber and thus diffusing impurities existing in a core of the optical fiber into a cladding of the optical fiber, so as to adjust an effective refractive index for a guided mode in the fiber corresponding to a predetermined wavelength, exposing UV light from an optical source to a phase mask having a periodic surface relief structure, and fabricating the Bragg grating having a predetermined period in the optical fiber using diffraction and interference of the UV light due to the periodic surface relief structure of the phase mask.

摘要翻译： 制造具有布拉格光栅的光纤的方法包括以下步骤：将来自热源的热量施加到光纤的预定部分，从而将存在于光纤的芯中的杂质扩散到光纤的包层中，因此 为了调整对应于预定波长的光纤中的导模的有效折射率，将来自光源的UV光曝光到具有周期性表面浮雕结构的相位掩模，并且在光学器件中制造具有预定周期的布拉格光栅 纤维使用由于相位掩模的周期性表面浮雕结构引起的紫外光的衍射和干涉。

公开(公告)号：US07614313B2

公开(公告)日：2009-11-10

申请号：US11524326

申请日：2006-09-21

申请人： Yoon-Young Kim ,  Seung-Hyun Cho ,  Ik-Kyu Kim ,  Chan-Il Park

发明人： Yoon-Young Kim ,  Seung-Hyun Cho ,  Ik-Kyu Kim ,  Chan-Il Park

IPC分类号： G01L3/02

CPC分类号： B06B1/08 ,  G01D5/485 ,  G01H1/10 ,  G01L3/102 ,  G01L3/104 ,  G01N29/2412 ,  G01N2203/0021 ,  G01N2203/0055

摘要： A method and apparatus for generating and measuring a torsional wave in a rod, shaft or pipe using magnetostriction are provided. The magnetostrictive transducer includes at least one strip attached to a predetermined position of a rod member, an insulator disposed around the strip, a coil wound around the insulator, and magnets providing a bias magnetic field to the strip, wherein a plurality of strips are attached to the rod member at predetermined intervals in a circumferential direction, and one pole of the magnet is close to an end of a first strip among the plurality of strips, and another pole of the magnet is close to an end of a second strip among the plurality of strips.

摘要翻译： 提供了一种使用磁致伸缩来产生和测量杆，轴或管道中的扭转波的方法和装置。 所述磁致伸缩换能器包括至少一个连接到杆构件的预定位置的条，设置在所述条周围的绝缘体，围绕所述绝缘体缠绕的线圈以及向所述带提供偏置磁场的磁体，其中附接有多个条带 在圆周方向上以预定间隔延伸到杆构件，并且磁体的一个极接近多个条带中的第一条带的端部，并且磁体的另一个极靠近第二条带的端部 多个条。