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公开(公告)号：US20090087950A1
公开(公告)日：2009-04-02
申请号：US12010544
申请日：2008-01-25
申请人： Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
发明人： Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
IPC分类号： H01L21/58
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05147 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/00014
摘要： A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.
摘要翻译： 公开了一种晶片封装方法。 本发明的一个方面是提供一种晶片封装方法，包括： 将带附着到载体的一侧上，所述载体具有形成在其中的通孔; 将晶片附接到暴露在通孔内的带上，使得晶片的至少一个电极露出; 以及在所述载体上执行封装处理以使所述晶片被封装。
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公开(公告)号：US07736952B2
公开(公告)日：2010-06-15
申请号：US12010544
申请日：2008-01-25
申请人： Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
发明人： Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05147 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/00014
摘要： A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.
摘要翻译： 公开了一种晶片封装方法。 本发明的一个方面是提供一种晶片封装方法，包括： 将带附着到载体的一侧上，所述载体具有形成在其中的通孔; 将晶片附接到暴露在通孔内的带上，使得晶片的至少一个电极露出; 以及在所述载体上执行封装处理以使所述晶片被封装。
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3.发明申请公开(公告)号：US20090026169A1
公开(公告)日：2009-01-29
申请号：US12010195
申请日：2008-01-22
申请人： Chung-Woo Cho , Soon-Jin Cho , Byung-Bae Seo , Ki-Young Yoo , Seok-Hwan Ahn
发明人： Chung-Woo Cho , Soon-Jin Cho , Byung-Bae Seo , Ki-Young Yoo , Seok-Hwan Ahn
CPC分类号： H05K3/0008 , H05K1/0269 , H05K3/0035 , H05K3/4644 , H05K3/4679 , H05K2201/0108 , H05K2201/09918
摘要： A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the image of the substrate; forming a via hole by removing a part of the insulation layer that corresponds the location information of the pad; and forming a via by filling the via hole with a conductive material, provides improved process conformity, even if the substrate has partial or nonlinear deformation, by considering the location information of the pad in the via hole forming. The improved conformity may allow more flexibility to substrate design and more integrity for circuitries on printed circuit board.
摘要翻译： 公开了印刷电路板制造系统及其制造方法。 一种制造印刷电路板的方法，包括：提供包括衬垫和覆盖所述衬垫的绝缘层的衬底; 获取所述基板的图像; 通过分析衬底的图像来获取衬垫的位置信息; 通过去除与衬垫的位置信息相对应的绝缘层的一部分来形成通孔; 并且通过用导电材料填充通孔形成通孔，通过考虑通孔形成中的焊盘的位置信息，即使衬底具有部分或非线性变形也提供了改进的工艺一致性。 改进的一致性可以允许对印刷电路板上的电路板的基板设计和更完整性的更大的灵活性。
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公开(公告)号：US20110138616A1
公开(公告)日：2011-06-16
申请号：US12929260
申请日：2011-01-11
申请人： Chung-Woo Cho , Soon-Jin Cho , Byung-Bae Seo , Ki-Young Yoo , Seok-Hwan Ahn
发明人： Chung-Woo Cho , Soon-Jin Cho , Byung-Bae Seo , Ki-Young Yoo , Seok-Hwan Ahn
IPC分类号： H05K3/00
CPC分类号： H05K3/0008 , H05K1/0269 , H05K3/0035 , H05K3/4644 , H05K3/4679 , H05K2201/0108 , H05K2201/09918
摘要： A printed circuit board manufacturing system that uses a substrate that includes a pad and an insulation layer covering the pad. The system includes an image sensor part acquiring an image of the substrate, a control part generating a control signal to form a via hole, and a laser applying part applying a laser, considering the control signal, to the part of the insulation layer that corresponds to the location information of the pad.
摘要翻译： 一种印刷电路板制造系统，其使用包括衬垫和覆盖该衬垫的绝缘层的衬底。 该系统包括获取基板的图像的图像传感器部分，产生控制信号以形成通孔的控制部分和考虑到控制信号的施加激光的激光施加部分到对应于绝缘层的部分 到垫的位置信息。
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公开(公告)号：US08535547B2
公开(公告)日：2013-09-17
申请号：US12010195
申请日：2008-01-22
申请人： Chung-Woo Cho , Soon-Jin Cho , Byung-Bae Seo , Ki-Young Yoo , Seok-Hwan Ahn
发明人： Chung-Woo Cho , Soon-Jin Cho , Byung-Bae Seo , Ki-Young Yoo , Seok-Hwan Ahn
IPC分类号： H01B13/00
CPC分类号： H05K3/0008 , H05K1/0269 , H05K3/0035 , H05K3/4644 , H05K3/4679 , H05K2201/0108 , H05K2201/09918
摘要： A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the image of the substrate; forming a via hole by removing a part of the insulation layer that corresponds the location information of the pad; and forming a via by filling the via hole with a conductive material, provides improved process conformity, even if the substrate has partial or nonlinear deformation, by considering the location information of the pad in the via hole forming. The improved conformity may allow more flexibility to substrate design and more integrity for circuitries on printed circuit board.
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公开(公告)号：US20070018335A1
公开(公告)日：2007-01-25
申请号：US11483844
申请日：2006-07-11
申请人： Seung-Hyun Cho , Soon-Jin Cho , Jae-Joon Lee , Se-Jong Oh
发明人： Seung-Hyun Cho , Soon-Jin Cho , Jae-Joon Lee , Se-Jong Oh
IPC分类号： H01L23/48
CPC分类号： H01L23/13 , H01L23/562 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/056 , H01L2224/1147 , H01L2224/16 , H01L2924/15162 , H01L2924/15311 , H01L2924/00014
摘要： A flip chip BGA board is disclosed, in which each of the corners of the board is removed to minimize warpage of the board due to heat applied during the manufacturing process. Embodiments of the invention allow the production of thin boards by preventing warpage of the board, and may provide a board high in reliability since the risk of the chip being separated from the board is reduced.
摘要翻译： 公开了一种倒装芯片BGA板，其中去除板的每个拐角以最小化由于在制造过程中施加的热而引起的板的翘曲。 本发明的实施例允许通过防止板的翘曲来生产薄板，并且可以提供高可靠性的板，因为芯片与板分离的风险降低。
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公开(公告)号：US20090027864A1
公开(公告)日：2009-01-29
申请号：US12007687
申请日：2008-01-14
申请人： Chung-Woo Cho , Jong-Jin Lee , Soon-Jin Cho , Yong-Duk Lee , Ki-Young Yoo , Woo-Young Lee , Chin-Kwan Kim , Jong-Yong Kim , Dong-Ju Jeon
发明人： Chung-Woo Cho , Jong-Jin Lee , Soon-Jin Cho , Yong-Duk Lee , Ki-Young Yoo , Woo-Young Lee , Chin-Kwan Kim , Jong-Yong Kim , Dong-Ju Jeon
CPC分类号： H05K3/3452 , H05K3/0032 , H05K2201/09845 , H05K2203/0594 , Y10T29/49165
摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. A printed circuit board, which includes an insulation layer, a circuit pattern formed on a surface of the insulation layer that includes at least one pad, and a solder resist which covers the circuit pattern, and in which an opening is formed that exposes a portion of a side and a surface of the pad, can ensure a sufficient amount of attachment area for the pads and the solder resist, to strengthen the adhesion of the pads. Also, the adhesion can be increased between the electronic components and the printed circuit board, and heat release characteristics can be improved.
摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 一种印刷电路板，其包括绝缘层，形成在绝缘层的包括至少一个焊盘的表面上的电路图案和覆盖电路图案的阻焊剂，并且其中形成有露出部分的开口 的焊盘的侧面和表面，可以确保焊盘和阻焊剂的足够的附着面积，以增强焊盘的附着力。 此外，可以在电子部件和印刷电路板之间增加粘附性，并且可以提高散热特性。
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公开(公告)号：US20080225501A1
公开(公告)日：2008-09-18
申请号：US12076274
申请日：2008-03-14
申请人： Chung-Woo Cho , Chang-Sup Ryu , Soon-Jin Cho , Seung-Chul Kim
发明人： Chung-Woo Cho , Chang-Sup Ryu , Soon-Jin Cho , Seung-Chul Kim
CPC分类号： H05K3/421 , H05K3/108 , H05K3/423 , H05K2201/09545 , H05K2201/09563 , H05K2201/096 , Y10T29/49165
摘要： A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board, which includes a first insulation layer, a first via that penetrates the first insulation layer, and a first pad formed on one surface of the first insulation layer, where a whole of or a portion of the first pad is buried in the first via, has a portion of or the whole of the pad buried in the via, so that the contact area between the pad and the via may be increased, and the printed circuit board can be given greater reliability.
摘要翻译： 公开了印刷电路板及其制造方法。 印刷电路板包括第一绝缘层，穿过第一绝缘层的第一通孔和形成在第一绝缘层的一个表面上的第一焊盘，其中第一焊盘的整体或一部分被埋在 第一通孔具有埋在通孔中的焊盘的一部分或全部，从而可以增加焊盘和通孔之间的接触面积，并且可以赋予印刷电路板更高的可靠性。
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公开(公告)号：US20100271792A1
公开(公告)日：2010-10-28
申请号：US12612158
申请日：2009-11-04
申请人： Jin-Won Choi , Soon-Jin Cho , Hueng-Jae Oh , Seung-Wan Kim , Seon-Jae Mun
发明人： Jin-Won Choi , Soon-Jin Cho , Hueng-Jae Oh , Seung-Wan Kim , Seon-Jae Mun
CPC分类号： B23K1/0016 , B23K2101/42 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/92125 , H01L2924/00014 , H05K3/243 , H05K3/3452 , H05K2201/0367 , H05K2201/0989 , H05K2203/054 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： An electronic component package and a method of manufacturing the same are disclosed. The method can include: providing a board, on which a multiple number of pads are formed; forming a solder resist layer, in which an opening superimposing over all of the pads is formed, on the board; forming metal posts over the pads, respectively; mounting an electronic component on the board by bonding the electrodes to the metal posts; and forming an underfill resin layer in the opening such that the underfill resin layer is interposed between the electronic component and the board. The solder resist layer may function as a dam that prevents the underfill resin layer from leaking in lateral directions during the subsequent underfill process so that the additional processes, such as dispensing, etc., that were required for forming a separate dam can be omitted, and the process time and costs can be reduced.
摘要翻译： 公开了一种电子部件封装及其制造方法。 该方法可以包括：提供一个板，其上形成多个焊盘; 形成阻焊层，其中在所述板上形成叠加在所有焊盘上的开口; 分别在焊盘上形成金属柱; 通过将电极粘合到金属柱上来将电子部件安装在电路板上; 并且在开口中形成底部填充树脂层，使得底部填充树脂层插入在电子部件和板之间。 阻焊层可以用作防止底部填充树脂层在随后的底部填充过程中在侧向泄漏的坝，从而可以省略形成单独的坝所需的附加过程，例如分配等， 并且可以减少处理时间和成本。
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公开(公告)号：US20090136656A1
公开(公告)日：2009-05-28
申请号：US12213700
申请日：2008-06-23
申请人： Dong-Jin Park , Seung-Hyun Jung , Seung-Chul Kim , Soon-Jin Cho
发明人： Dong-Jin Park , Seung-Hyun Jung , Seung-Chul Kim , Soon-Jin Cho
IPC分类号： H05K3/02
CPC分类号： H05K3/427 , H05K3/0035 , H05K3/0038 , H05K3/421 , H05K2201/0175 , H05K2201/0394 , H05K2201/09563 , H05K2203/1152
摘要： A method of manufacturing a printed circuit board is disclosed. The method may include: stacking an anti-plating layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove, by removing a portion of the anti-plating layer and a portion of the copper clad laminate; stacking a seed layer over a surface of the intaglio groove; forming a plating layer, by plating an inside of the intaglio groove; and removing the anti-plating layer and the copper foil.
摘要翻译： 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上堆叠防镀层，对于包括层叠在绝缘层的一侧上的铜箔的覆铜层压板; 通过去除所述防镀层的一部分和所述覆铜层压板的一部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽的表面上; 通过电镀凹版凹槽的内部形成镀层; 并且去除防镀层和铜箔。
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