公开(公告)号：US08729692B2

公开(公告)日：2014-05-20

申请号：US13353128

申请日：2012-01-18

申请人： Kwang Soo Kim ,  Young Hoon Kwak ,  Young Ki Lee

发明人： Kwang Soo Kim ,  Young Hoon Kwak ,  Young Ki Lee

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/473 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.

摘要翻译： 本文公开了一种功率模块封装，包括：第一散热板，包括顺序地形成的第一流路，第二流路和第三流路，第一流路和第三流路形成为具有台阶 之间; 以及形成在所述第一散热板下方的第二散热板，具有一个面和另一个面，在其一个面上形成有半导体器件安装槽，并且包括第四流路，其一端连接到所述第二流路 并且另一端连接到第三流动路径，其中通过第一流动路径引入的冷却材料基于第二流动路径分配到第三流动路径和第四流动路径。

公开(公告)号：US20130233599A1

公开(公告)日：2013-09-12

申请号：US13484188

申请日：2012-05-30

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Bum Seok Suh

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Bum Seok Suh

IPC分类号： H05K1/05

CPC分类号： H01L23/3735 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a substrate for a power module. The substrate may include a metal base substrate, an insulating layer formed on the metal base substrate and including a plurality of insulating adhesion layers and a ceramic filler layer formed on a joining interface between the plurality of insulating adhesion layers, and a circuit layer formed on the insulating layer.

摘要翻译： 本文公开了一种用于功率模块的基板。 基板可以包括金属基底基板，形成在金属基底基板上的绝缘层，并且包括多个绝缘粘合层和形成在多个绝缘粘合层之间的接合界面上的陶瓷填充层，以及形成在 绝缘层。

公开(公告)号：US20130062743A1

公开(公告)日：2013-03-14

申请号：US13304230

申请日：2011-11-23

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Young Hoon Kwak

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Young Hoon Kwak

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/473 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L25/071 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/40227 ,  H01L2224/48227 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a heat dissipation plate including a first heat dissipation plate and a second heat dissipation plate disposed to be spaced apart from each other; insulating layers formed on the heat dissipation plate; metal layers formed on the insulating layers, semiconductor devices mounted on the metal layers; and lead spacers formed to connect the metal layer of the first heat dissipation plate side or the metal layer of the second heat dissipation plate side with the semiconductor layers, wherein the semiconductor devices formed on the metal layers of the first heat dissipation plate side and the semiconductor devices formed on the metal layer of the second heat dissipation plate side are disposed in a multi-layered type.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：散热板，包括第一散热板和设置成彼此间隔开的第二散热板; 形成在散热板上的绝缘层; 形成在绝缘层上的金属层，安装在金属层上的半导体器件; 以及将所述第一散热板侧的金属层或所述第二散热板侧的金属层与所述半导体层连接的引线间隔件，其中，形成在所述第一散热板侧的所述金属层和 形成在第二散热板侧的金属层上的半导体器件设置为多层型。

公开(公告)号：US20120319260A1

公开(公告)日：2012-12-20

申请号：US13484160

申请日：2012-05-30

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

摘要翻译： 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。

公开(公告)号：US08911310B2

公开(公告)日：2014-12-16

申请号：US13900931

申请日：2013-05-23

申请人： Young Ki Lee

发明人： Young Ki Lee

IPC分类号： F42B6/08

CPC分类号： F42B6/08

摘要： Disclosed is an arrowhead in which a plurality of expandable blades can be quickly and reliably retracted or expanded without using an additional means to bundle the expanding blades, thereby enhancing the penetrating capability or killing capability of an arrow. Particularly, a portion of a shaft forming the arrowhead is provided with a rack gear portion installed thereon and a lower end of each of the expanding blades is provided with a pinion gear portion, such that the rack gear portion and the pinion gear portion engage with each other and such a rack-pinion action controls the operation of retracting or expanding the expanding blades.

摘要翻译： 公开了一种箭头，其中可以快速且可靠地缩回或扩展多个可扩展叶片，而不需要使用附加装置来捆扎扩张刀片，从而增强箭头的穿透能力或杀伤能力。 特别地，形成箭头的轴的一部分设置有安装在其上的齿条部分，并且每个扩展叶片的下端设置有小齿轮部分，使得齿条部分和小齿轮部分与 彼此并且这种齿条 - 小齿轮动作控制缩回或扩大扩张刀片的操作。

公开(公告)号：US08686295B2

公开(公告)日：2014-04-01

申请号：US12614407

申请日：2009-11-07

申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K7/20

CPC分类号： H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

公开(公告)号：US08610146B2

公开(公告)日：2013-12-17

申请号：US12238663

申请日：2008-09-26

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.

摘要翻译： 本发明提供一种LED封装体，其具有形成有一个以上的通孔的金属基板; 绝缘层，其形成在包括所述通孔的内表面的所述金属基板的表面上; 多个金属图案，形成在绝缘层上并且彼此电隔离; 以及安装在多个金属图案中的金属图案上的LED芯片。

公开(公告)号：US08586128B2

公开(公告)日：2013-11-19

申请号：US12467513

申请日：2009-05-18

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： B05D5/12

CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

公开(公告)号：US20110316035A1

公开(公告)日：2011-12-29

申请号：US12897936

申请日：2010-10-05

申请人： Sang Hyun Shin ,  Tae Hoon Kim ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park ,  Ki Ho Seo

发明人： Sang Hyun Shin ,  Tae Hoon Kim ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park ,  Ki Ho Seo

IPC分类号： H01L33/48 ,  H01L33/64

CPC分类号： H05K3/0061 ,  H01L23/4006 ,  H01L33/641 ,  H01L33/642 ,  H01L2023/4062 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/05 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2203/0315 ,  H01L2924/00

摘要： Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided.

摘要翻译： 本发明公开了一种散热基板，其特征在于，具备包括金属层的基底基板，在所述金属层的一个面上形成的绝缘层，以及在所述绝缘层上形成的电路层，形成在所述绝缘层的另一面的散热层 所述金属层，用于将所述基底基板和所述散热层彼此连接的连接器，形成在所述基底基板的厚度方向上并且所述连接器被插入的开口的开口以及形成在所述基底基板中的任一个或两者上的阳极氧化层 金属层的另一表面和侧表面，并且其中金属层和散热层通过阳极氧化层彼此绝缘，从而防止静电或电压冲击向金属层传递。 还提供了制造散热基板的方法。

公开(公告)号：US07829219B2

公开(公告)日：2010-11-09

申请号：US11314210

申请日：2005-12-21

申请人： Hui Chan Yun ,  Jong Seob Kim ,  Ho Seok Yang ,  Young Ki Lee ,  Dong Hak Kwak

发明人： Hui Chan Yun ,  Jong Seob Kim ,  Ho Seok Yang ,  Young Ki Lee ,  Dong Hak Kwak

IPC分类号： H01M4/60 ,  H01M4/62

CPC分类号： H01M4/131 ,  H01M4/623 ,  H01M4/628 ,  H01M10/052 ,  H01M2004/028

摘要： A cathode for lithium secondary batteries coated with a slurry including an active material, a binder and a solvent, and further including a polymerization inhibitor, is disclosed. Gelation of the slurry is prevented during production of the cathode so that adhesion of the slurry is enhanced, thus achieving improved coating properties of the cathode and facilitating the coating of the slurry.

摘要翻译： 公开了一种涂覆有包含活性材料，粘合剂和溶剂的浆料的锂二次电池的阴极，并且还包括阻聚剂。 在阴极生产过程中防止浆料的凝胶化，从而提高了浆料的粘附性，从而实现了阴极的改善的涂层性能并且有利于浆料的涂覆。