公开(公告)号：US20190148612A1

公开(公告)日：2019-05-16

申请号：US16250408

申请日：2019-01-17

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Youl LEE ,  Kwang Ki CHOI

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/60 ,  H01L33/48

Abstract: Embodiments provide a light emitting device package including a substrate, a light emitting structure disposed under the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, first and second electrodes connected to the first and second conductive semiconductor layers, a first pad connected to the first electrodes in first-first through-holes penetrating the second conductive semiconductor layer and the active layer, and a first insulation layer disposed between the first pad and the second conductive semiconductor layer and between the first pad and the active layer to cover the first electrodes in a first-second through-hole, and a second pad connected to the second electrode through a second through-hole penetrating the first insulation layer and electrically spaced apart from the first pad. The second pad does not overlap the first insulation layer in the first-second through-hole in a thickness direction of the light emitting structure.

公开(公告)号：US20180277719A1

公开(公告)日：2018-09-27

申请号：US15542340

申请日：2015-11-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Youl LEE

IPC: H01L33/46 ,  H01L33/06 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/40 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L33/06 ,  H01L33/22 ,  H01L33/32 ,  H01L33/36 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L33/502 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0025

Abstract: A light-emitting device package of embodiments comprises: a substrate; a light-emitting structure which is arranged below the substrate and comprises a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first electrode which is connected to the first conductive type semiconductor layer; a first insulation layer which is arranged on the side section of the light-emitting structure and the side and lower sections of the first electrode; a first pad which passes through the first insulation layer and is connected to the first conductive type semiconductor layer; a second electrode which passes through the first insulation layer, the first conductive type semiconductor layer and the active layer and is connected to the second conductive type semiconductor layer; a second pad which is connected to the second electrode; and a protective layer which extends from the top of the first insulation layer arranged on the side section of the light-emitting structure to the top of the first insulation layer arranged on the top of the first electrode, and is arranged so as to cover a bent part of the first insulation layer.

公开(公告)号：US20180254396A1

公开(公告)日：2018-09-06

申请号：US15972736

申请日：2018-05-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Youl LEE ,  Kwang Ki CHOI

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/38 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/20 ,  H01L33/38 ,  H01L33/382 ,  H01L33/387 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/16

Abstract: Embodiments provide a light emitting device package including a substrate, a light emitting structure disposed under the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, first and second electrodes connected to the first and second conductive semiconductor layers, a first pad connected to the first electrodes in first-first through-holes penetrating the second conductive semiconductor layer and the active layer, and a first insulation layer disposed between the first pad and the second conductive semiconductor layer and between the first pad and the active layer to cover the first electrodes in a first-second through-hole, and a second pad connected to the second electrode through a second through-hole penetrating the first insulation layer and electrically spaced apart from the first pad. The second pad does not overlap the first insulation layer in the first-second through-hole in a thickness direction of the light emitting structure.

公开(公告)号：US20160284941A1

公开(公告)日：2016-09-29

申请号：US15077161

申请日：2016-03-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Jae Won SEO ,  Sang Youl LEE ,  Sung Ho JUNG ,  Jin Kyung CHOI

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/56 ,  H01L33/42

CPC classification number: H01L33/46 ,  H01L33/0079 ,  H01L33/38 ,  H01L33/405 ,  H01L33/42 ,  H01L33/44 ,  H01L33/56 ,  H01L33/62

Abstract: A light emitting device and a light emitting device package are provided. The light emitting device may include a substrate, a light emitting structure provided under the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a first insulating layer configured to expose the second conductive semiconductor layer and provided on a lower edge of the light emitting structure, a first light permeable electrode layer provided under the second conductive semiconductor layer exposed by the first insulating layer, a second light permeable electrode layer provided under the first insulating layer and the first light permeable electrode layer, and a reflective layer provided under the second light permeable electrode layer.

Abstract translation: 提供一种发光器件和发光器件封装。 发光器件可以包括衬底，设置在衬底下方并且包括第一导电半导体层，有源层和第二导电半导体层的发光结构，被配置为暴露第二导电半导体层并提供的第一绝缘层 在所述发光结构的下边缘上设置有由所述第一绝缘层露出的所述第二导电半导体层下方的第一透光性电极层，设置在所述第一绝缘层下方的第二透光性电极层和所述第一透光性电极层， 以及设置在第二透光性电极层下方的反射层。

公开(公告)号：US20160111614A1

公开(公告)日：2016-04-21

申请号：US14885427

申请日：2015-10-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Youl LEE ,  Kwang Ki CHOI

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/20 ,  H01L33/38 ,  H01L33/382 ,  H01L33/387 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/16

Abstract: Embodiments provide a light emitting device package including a substrate, a light emitting structure disposed under the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, first and second electrodes connected to the first and second conductive semiconductor layers, a first pad connected to the first electrodes in first-first through-holes penetrating the second conductive semiconductor layer and the active layer, and a first insulation layer disposed between the first pad and the second conductive semiconductor layer and between the first pad and the active layer to cover the first electrodes in a first-second through-hole, and a second pad connected to the second electrode through a second through-hole penetrating the first insulation layer and electrically spaced apart from the first pad. The second pad does not overlap the first insulation layer in the first-second through-hole in a thickness direction of the light emitting structure.

Abstract translation: 实施例提供一种发光器件封装，包括衬底，设置在衬底下方并包括第一导电半导体层，有源层和第二导电半导体层的发光结构，连接到第一和第二导电半导体的第一和第二电极 层，连接到穿过第二导电半导体层和有源层的第一第一通孔中的第一电极的第一焊盘以及设置在第一焊盘和第二导电半导体层之间以及第一焊盘和第二焊盘之间的第一绝缘层， 所述有源层覆盖第一第二通孔中的第一电极，以及通过贯穿所述第一绝缘层并与所述第一焊盘电隔离的第二通孔连接到所述第二电极的第二焊盘。 第二衬垫在发光结构的厚度方向上不与第一通孔中的第一绝缘层重叠。

公开(公告)号：US20140110730A1

公开(公告)日：2014-04-24

申请号：US14139452

申请日：2013-12-23

Applicant: LG Innotek Co., Ltd.

Inventor： Sang Youl LEE ,  Jung Hyeok BAE ,  Ji Hyung MOON ,  Jun O Song

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/382 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed are a light emitting device. The light emitting device includes first and second light emitting cells on a conductive support member and having a hole. The first and second light emitting cells includes first and second semiconductor layers, and an active layer. First and second conducive layers are between the first light emitting cell and the conductive support member, and a third and fourth conductive layers are between the second light emitting cell and the conductive support member. First insulating layer is between the second and fourth conductive layers and the conductive support member. Second insulating layer is disposed in the hole. The second conductive layer is electrically connected to the first light emitting cells through the hole and the third conductive layer.

Abstract translation: 公开了一种发光器件。 发光器件包括在导电支撑构件上并具有孔的第一和第二发光单元。 第一和第二发光单元包括第一和第二半导体层以及有源层。 第一和第二导电层位于第一发光单元和导电支撑构件之间，第三和第四导电层位于第二发光单元和导电支撑构件之间。 第一绝缘层位于第二和第四导电层之间以及导电支撑构件之间。 第二绝缘层设置在孔中。 第二导电层通过孔和第三导电层电连接到第一发光单元。

公开(公告)号：US20130292642A1

公开(公告)日：2013-11-07

申请号：US13934021

申请日：2013-07-02

Applicant: LG Innotek Co., Ltd.

Inventor： Sang Youl LEE

IPC: H01L33/20

CPC classification number: H01L33/0025 ,  H01L21/78 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/12 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/42

Abstract: A light emitting device includes a substrate having a top surface and an bottom surface and a light emitting structure on the substrate, disposed closer to the substrate top surface than the substrate bottom surface, having an n-type conductive type semiconductor layer, a p-type conductive type semiconductor layer, and an active layer. The light emitting device also includes a transparent electrode layer, a first electrode, and a second electrode. The substrate has side surfaces extending from the substrate bottom surface to the substrate top surface, the side surfaces inclined outwardly as the substrate extends in a direction from the substrate bottom surface to the substrate top surface. The transparent electrode layer overlaps more than 50% of a total area of the substrate bottom surface, and a part of light generated by the light emitting structure is emitted to outside via the transparent electrode layer.

Abstract translation: 一种发光器件包括：具有顶表面和底表面的衬底和在衬底上的发光结构，该衬底设置成比衬底底表面更靠近衬底顶表面，具有n型导电型半导体层， 型导电型半导体层和有源层。 发光装置还包括透明电极层，第一电极和第二电极。 衬底具有从衬底底表面延伸到衬底顶表面的侧表面，当衬底沿着从衬底底表面到衬底顶表面的方向延伸时，侧表面向外倾斜。 透明电极层与基板底面的总面积重叠超过50％，由发光结构体产生的光的一部分经由透明电极层发射到外部。

公开(公告)号：US20210066563A1

公开(公告)日：2021-03-04

申请号：US16981238

申请日：2019-03-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Youl LEE ,  Ki Man KANG ,  Ji Hyung MOON ,  Yoon Min JO

IPC: H01L33/62 ,  H01L25/075 ,  G09G3/32

Abstract: Disclosed in an embodiment are a semiconductor device and a light-emitting device package including same, the semiconductor device comprising: a substrate; a plurality of semiconductor structures arranged in a matrix shape in the central area of the substrate; passivation layers arranged on upper surfaces and lateral surfaces of the semiconductor structures and on the edge area of the substrate; a plurality of first wiring lines which are arranged at lower parts of the plurality of semiconductor structures and electrically connected thereto, and which include first end parts extending from the central area to the edge area of the substrate; a plurality of second wiring lines which are arranged at the lower parts of the plurality of semiconductor structures and electrically connected thereto, and which include second end parts extending from the central area to the edge area of the substrate; a plurality of first pads penetrating the passivation layer so as to be connected to the plurality of first end parts; and a plurality of second pads penetrating the passivation layers so as to be connected to the plurality of second end parts, wherein the plurality of semiconductor structures include a plurality of first semiconductor structures, which are arranged in a first area of the central area, and a plurality of second semiconductor structures, which are arranged in a second area of the central area, and the size of the plurality of first semiconductor structures differs from the size of the plurality of second semiconductor structures.

公开(公告)号：US20210043577A1

公开(公告)日：2021-02-11

申请号：US16979734

申请日：2019-04-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Youl LEE ,  Ki Man KANG ,  Eun Dk LEE

IPC: H01L23/538 ,  H01L25/075 ,  H01L33/62

Abstract: Disclosed in an embodiment is a semiconductor device package comprising a substrate and a plurality of semiconductor structures arranged to be spaced apart at the center of the substrate, wherein the semiconductor structure is arranged on the substrate and includes a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer arranged between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and the ratio of the maximum height of the outermost surface of the first conductive type semiconductor layer to the length of the spacing distance between the adjacent semiconductor structures is 1:3 to 1:60.

公开(公告)号：US20210020807A1

公开(公告)日：2021-01-21

申请号：US16978074

申请日：2019-03-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Tae MOON ,  Ji Hyung MOON ,  Sang Youl LEE

IPC: H01L33/38 ,  H01L33/30

Abstract: In an embodiment, disclosed is a semiconductor device comprising: a semiconductor structure which comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first electrode which is electrically connected to the first conductive semiconductor layer; and a second electrode which is electrically connected to the second conductive semiconductor layer, wherein an area ratio between an area of an upper surface of the second conductive semiconductor layer and an area of an outer surface of the active layer is 1:0.0005 to 1:0.01.