公开(公告)号：US11342314B2

公开(公告)日：2022-05-24

申请号：US17151904

申请日：2021-01-19

Applicant: NICHIA CORPORATION

Inventor： Daisuke Kasai ,  Tadao Hayashi ,  Toru Hashimoto

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/50 ,  F21V8/00

Abstract: A light-emitting module includes a light-emitting element unit including a light-emitting element, a light-transmissive member covering a main light-emitting surface of the light-emitting element, and a first light-reflective member covering lateral surfaces of the light-emitting element; a light-transmissive light-guiding plate having a first main surface and a second main surface having a recess accommodating the light-emitting element unit; a second light-reflective member covering the second main surface and the light-emitting element unit; and a light-transmissive bonding member disposed in contact with inner lateral surfaces of the recess and outer lateral surfaces of the light-emitting element unit. At least a portion of the first light-reflective member is located outside the recess in a cross-sectional view, and is in contact with the light-transmissive bonding member. The light-transmissive bonding member has an inclined surface forming an acute angle with a corresponding outer lateral surface of the first light-reflective member.

公开(公告)号：US11143807B2

公开(公告)日：2021-10-12

申请号：US16942742

申请日：2020-07-29

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi ,  Ryohei Yamashita ,  Yusaku Achi ,  Mamoru Imada

IPC: G02B6/00 ,  F21V8/00 ,  H01L33/50 ,  H01L25/075 ,  G02F1/13357 ,  H01L33/58 ,  G02F1/1335

Abstract: A method of manufacturing a light emitting module according to the present disclosure includes: preparing a light guide plate that comprises a first main surface serving as a light-emitting surface and a second main surface opposite to the first main surface; respectively providing light emitting elements on the second main surface so as to correspond to each of a plurality of optically functional portions provided on the first main surface of the light guide plate; and forming wires electrically connecting the plurality of light emitting elements.

公开(公告)号：US11022746B2

公开(公告)日：2021-06-01

申请号：US16829787

申请日：2020-03-25

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi

IPC: F21V8/00

Abstract: Provided is a linear light source including: a light-transmissive base having a first main surface that has a rectangular shape with long sides and short sides, a second main surface located opposite to the first main surface, a first (long) side surface, and a second (short) side surface; a plurality of light emitting devices, each including a light emitting element, a light-transmissive member and a sealing member. An upper surface of each of the light emitting devices includes an upper surface of the light-transmissive member. A first bonding member bonds the first main surface of the light-transmissive base and the upper surfaces of the light emitting devices. A width of the light-transmissive base is the same as a width of the light emitting devices in a first direction orthogonal to a first side surface of the light-transmissive base.

公开(公告)号：US11011682B2

公开(公告)日：2021-05-18

申请号：US16731290

申请日：2019-12-31

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi

IPC: H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/54

Abstract: A composite board is provided with a board and a covering member. The board includes a base made of ceramics, first wiring provided on an upper surface of the base, and second wiring provided on a lower surface of the base and electrically connected to the first wiring. The covering member covers the base such that the first wiring and the second wiring are exposed.

公开(公告)号：US10930624B2

公开(公告)日：2021-02-23

申请号：US16529309

申请日：2019-08-01

Applicant: NICHIA CORPORATION

Inventor： Daisuke Kasai ,  Tadao Hayashi ,  Toru Hashimoto

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/50 ,  F21V8/00

Abstract: A light-emitting module includes a light-emitting element unit including a light-emitting element, a light-transmissive member covering a main light-emitting surface of the light-emitting element, and a first light-reflective member covering lateral surfaces of the light-emitting element; a light-transmissive light-guiding plate having a first main surface and a second main surface having a recess accommodating the light-emitting element unit; a second light-reflective member covering the second main surface and the light-emitting element unit; and a light-transmissive bonding member disposed in contact with inner lateral surfaces of the recess and outer lateral surfaces of the light-emitting element unit. At least a portion of the first light-reflective member is located outside the recess in a cross-sectional view, and is in contact with the light-transmissive bonding member. The light-transmissive bonding member has an inclined surface forming an acute angle with a corresponding outer lateral surface of the first light-reflective member.

公开(公告)号：US10593844B2

公开(公告)日：2020-03-17

申请号：US15170411

申请日：2016-06-01

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi ,  Teruhito Azuma

IPC: H01L33/60 ,  H01L33/54 ,  H01L33/56 ,  H01L33/50 ,  H01L33/48

Abstract: A light emitting device includes a light transmissive member; a first reflector covering outer peripheral faces of the light transmissive member; a light emitting element disposed under the light transmissive member; a light guiding member covering at least a portion of the light transmissive member, a portion of a lower face of the first reflector, and at least some portions of lateral faces of the light emitting element; and a second reflector covering a portion of the lower face of the first reflector that is exposed from the light guiding member and is located outward of the light guiding member.

公开(公告)号：US09653659B2

公开(公告)日：2017-05-16

申请号：US14561626

申请日：2014-12-05

Applicant: NICHIA CORPORATION

Inventor： Takeshi Ikegami ,  Tadao Hayashi ,  Hiroto Tamaki

IPC: H01L33/50

CPC classification number: H01L33/502 ,  H01L33/486 ,  H01L33/501 ,  H01L33/505 ,  H01L33/508 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041

Abstract: Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and reducing unevenness in light distribution color, and a method of manufacturing the same. A light emitting device 100 includes a light emitting element 20 with a supporting body which is composed of a semiconductor light emitting element 1 and a supporting body 10, and a phosphor layer 7 which continuously covers an upper surface and side surfaces of the semiconductor light emitting element 1, and side surfaces of the supporting body 10. The phosphor layer 7 is configured such that at least a lower portion of the side surface of the supporting body 10 is thinner than the upper surface and the side surface of the semiconductor light emitting element 1. Such a configuration of the phosphor layer can be formed by applying a spray-coating of a slurry containing phosphor particles and a thermosetting resin in a solvent on the semiconductor light emitting element 1 side of the light emitting element 20 which has the supporting body.

公开(公告)号：US09117987B2

公开(公告)日：2015-08-25

申请号：US14445165

申请日：2014-07-29

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi ,  Takuya Nakabayashi

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L25/0756 ,  H01L25/50 ,  H01L33/005 ,  H01L33/08 ,  H01L33/10 ,  H01L33/50 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate; a light emitting element flip-chip mounted on the substrate; a phosphor-containing member provided at least above the light emitting element and separated from the light emitting element; and a first reflecting member configured to cover the phosphor-containing member, at least one of a side faces of the light emitting device having an opening for extracting light emitted from the light emitting element and light wavelength-converted by the phosphor-containing member.

Abstract translation: 半导体器件包括衬底; 安装在基板上的发光元件倒装芯片; 设置在所述发光元件的至少上方且与所述发光元件分离的含磷光体构件; 以及第一反射部件，被配置为覆盖含荧光体的部件，所述发光器件的侧面中的至少一个具有用于提取从所述发光元件发射的光的开口和由所述含荧光体构件波长转换的光。

公开(公告)号：US11201271B2

公开(公告)日：2021-12-14

申请号：US16780021

申请日：2020-02-03

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi ,  Teruhito Azuma

IPC: H01L33/60 ,  H01L33/54 ,  H01L33/56 ,  H01L33/50 ,  H01L33/48

Abstract: A method for manufacturing a light emitting device includes: forming a first reflector that covers outer peripheral faces of a light transmissive member; forming a light guiding member covering at least a portion of the light transmissive member, a portion of a lower face of the first reflector, and at least some portions of lateral faces of a light emitting element disposed under the light transmissive member; and forming a second reflector covering a portion of the lower face of the first reflector that is exposed from the light guiding member and located outward of the light guiding member.

公开(公告)号：US10896998B2

公开(公告)日：2021-01-19

申请号：US16733989

申请日：2020-01-03

Applicant: NICHIA CORPORATION

Inventor： Tadao Hayashi

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/48 ,  H01L33/60 ,  H01L33/64 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device includes: providing a light emitting element including a light extraction surface, an electrode-formed surface on a side opposite to the light extraction surface, lateral surfaces positioned between the light extraction surface and the electrode-formed surface, and a pair of electrodes on the electrode-formed surface; providing a covering member including a lens portion and a first recess on a side different from the lens portion; disposing the light emitting element on a bottom surface of the first recess, with the light extraction surface and the bottom surface of the first recess facing each other; and forming a reflective member in the first recess to cover the lateral surfaces of the light emitting element while at least a part of the pair of electrodes is exposed from the reflective member.