公开(公告)号：US11189758B2

公开(公告)日：2021-11-30

申请号：US16519809

申请日：2019-07-23

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Yukiko Yokote ,  Tadaaki Ikeda

IPC: H01L33/50 ,  H01L33/10 ,  F21K9/68 ,  F21K9/61 ,  H01L25/075

Abstract: A light-emitting device has a longitudinal direction and a width direction perpendicular to the longitudinal direction, and includes a first light-emitting element, a second light-emitting element having a peak emission wavelength different from a peak emission wavelength of the first light-emitting element and being aligned with the first light-emitting element in the longitudinal direction, a light-transmissive member covering a first element light extracting surface and a second element light extracting surface such that a portion of a light-guide member is located between the light-transmissive member and each of the first element light extracting surface and the second element light extracting surface, a first reflective member surrounding the first light-emitting element, the second light-emitting element, and the light-guide member in a top view, and a first inclined member between the first light-emitting element and the first reflective member in the longitudinal direction and having an inclined surface inclined relative to the light-transmissive member. The first inclined member is spaced apart from the light-transmissive member.

公开(公告)号：US11018286B2

公开(公告)日：2021-05-25

申请号：US16691612

申请日：2019-11-22

Applicant: NICHIA CORPORATION

Inventor： Shimpei Sasaoka ,  Takuya Nakabayashi

IPC: H01L33/62 ,  H05K1/03 ,  H01L33/38 ,  H01L33/48 ,  H01L33/56 ,  H01L33/54

Abstract: A light emitting device including a molded package having leads including a pair of a first lead and a second lead, a molded resin, and a recess, where an upper surface of the leads is partially exposed from a bottom surface of the recess. The device further including a light emitting component mounted on the bottom surface, and at least one sealing member located in the recess to cover the light emitting component. At least one of the first lead and the second lead has a groove on an upper surface thereof, where the groove is positioned so as to correspond to a corner on the bottom surface of the recess in a cross sectional view. A portion of the molded resin located within the groove is exposed from the bottom surface. A surface of the corner is composed of a curved surface, and the sealing member covers the corner.

公开(公告)号：US10707384B2

公开(公告)日：2020-07-07

申请号：US16027950

申请日：2018-07-05

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Tadaaki Ikeda

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L33/44 ,  H01L33/50 ,  H01L25/075

Abstract: A light-emitting device includes a substrate including a base member having an upper surface having a substantially rectangular shape, a lower surface opposite to the upper surface, a first longer lateral surface, a second longer lateral surface opposite to the first longer lateral surface, a first shorter lateral surface, and a second shorter lateral surface opposite to the first shorter lateral surface, first wirings disposed on the upper surface, and second wirings disposed on the lower surface and each electrically connected with a respective one of the first wirings; at least one light-emitting element; and a light-reflective covering member covering lateral surfaces of the light-emitting element and the upper surface of the base member. The base member has at least one first recess open at the upper surface and the first longer lateral surface. Surfaces defining the at least one first recess are covered with the covering member.

公开(公告)号：US10333043B2

公开(公告)日：2019-06-25

申请号：US16217365

申请日：2018-12-12

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Akira Hori

IPC: H01L33/48 ,  H01L33/64 ,  H01L33/50 ,  H01L33/62 ,  H01L33/56 ,  H01L33/60 ,  H01L33/32 ,  H01L33/54 ,  H01L25/075

Abstract: A light emitting device includes a substrate, a light emitting element, a light transmissive member and a sealing member. The substrate has a first main surface, a second main surface that is opposite from the first main surface, and a mounting surface that is adjacent to at least the second main surface. The substrate includes an insulating base material, and a pair of connection terminals. The insulating base material defines a concave component opening on the second main surface and the mounting surface. The connection terminals are disposed on the first main surface, and respectively have element connection sections with convex shapes. The light emitting element has a pair of electrodes which connect to the element connection sections of the pair of connection terminals. The light transmissive member is disposed on an upper surface of the light emitting element. The sealing member is in contact with at least a part of a side surface of the light emitting element, covers a side surface of the light transmissive member, and is formed substantially in the same plane as the substrate on the mounting surface.

公开(公告)号：US10270011B2

公开(公告)日：2019-04-23

申请号：US15468540

申请日：2017-03-24

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Takeshi Ikegami ,  Tadaaki Ikeda ,  Tadao Hayashi ,  Hiroto Tamaki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L25/13 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54

Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.

公开(公告)号：US10193045B2

公开(公告)日：2019-01-29

申请号：US15975121

申请日：2018-05-09

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Akira Hori

IPC: H01L33/48 ,  H01L33/64 ,  H01L33/56 ,  H01L33/32 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device includes a substrate, light emitting elements, a sealing member, a light transmissive member and a heat dissipation terminal. The sealing member is in contact with at least a part of a side surface of each of the light emitting elements, is formed substantially in the same plane as the substrate, and a width of the sealing member between adjacent ones of the light emitting elements is larger than a width of the sealing member on an outside of an outermost one of the light emitting elements. The light transmissive member covers upper surfaces of the light emitting elements and a part of an upper surface of the sealing member, side surfaces of the light transmissive member being covered with the sealing member. The heat dissipation terminal is arranged generally in the center on a second main surface of the substrate and has a recess portion.

公开(公告)号：US10096758B2

公开(公告)日：2018-10-09

申请号：US15494801

申请日：2017-04-24

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Yoshitaka Bando ,  Hiroto Tamaki

IPC: H01L23/495 ,  H01L33/62 ,  H01L21/48

Abstract: A lead frame includes a plurality of units connected together. Each unit includes a pair of lead portions spaced apart from and opposite to each other. The lead portions are configured to mount a semiconductor element and to be electrically connected to a pair of electrodes of the semiconductor element. Each lead portion includes two hook-shaped portions respectively extending from the lead portion. The hook-shaped portions of one lead portion are arranged to surround tip portions of the hook-shaped portions of the other lead portion respectively, at both sides respective to a center line of the unit.

公开(公告)号：US10096751B2

公开(公告)日：2018-10-09

申请号：US15479854

申请日：2017-04-05

Applicant: NICHIA CORPORATION

Inventor： Tadaaki Ikeda ,  Takuya Nakabayashi

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  C09K11/61 ,  C09K11/77 ,  C09K11/08 ,  C09K11/02 ,  C08K3/34

Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, which emits blue light, and a light transmissive member having a first principal face bonded to the light emitting element and a second principal face opposite the first principal face. The light transmissive member has a light transmissive base material and wavelength conversion substances, which are contained in the base material and which absorb the light from the light emitting element and emit light. The wavelength conversion substances are localized in the base material towards the first principal face, and include a first phosphor which emits green to yellow light and a second phosphor which emits red light. The first phosphor is more localized towards the first principal face than the second phosphor. The second phosphor is a manganese-activated fluoride phosphor.

公开(公告)号：US10050186B2

公开(公告)日：2018-08-14

申请号：US15143677

申请日：2016-05-02

Applicant: NICHIA CORPORATION

Inventor： Shimpei Sasaoka ,  Takuya Nakabayashi

IPC: H01L33/62 ,  H01L33/54 ,  H05K1/03 ,  H01L33/38 ,  H01L33/48 ,  H01L33/56

Abstract: A light emitting device includes a molded package and one or more light emitting components. The molded package includes a recess, two leads, and a molded resin part. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the two leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the two leads includes a groove at an upper surface thereof. The groove is filled with a part of the molded resin part. The part of the molded resin part includes a first portion and a second portion. The first portion is exposed from the bottom surface of the recess. The second portion connects with a bottom surface of the side wall.

公开(公告)号：US09722160B2

公开(公告)日：2017-08-01

申请号：US14924831

申请日：2015-10-28

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi

IPC: H01L33/62 ,  F21S8/10 ,  H01L25/075 ,  H05K1/11 ,  B60Q1/14 ,  B60Q1/16 ,  H01L33/08 ,  H01L33/10 ,  H01L33/54 ,  H01L33/38 ,  H05K1/02 ,  F21Y105/12 ,  F21Y105/10

CPC classification number: H01L33/62 ,  B60Q1/1423 ,  B60Q1/16 ,  B60Q2300/42 ,  B60Q2300/45 ,  F21S41/143 ,  F21S41/18 ,  F21S41/663 ,  F21Y2105/10 ,  F21Y2105/12 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/10 ,  H01L33/38 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/0287 ,  H05K1/111 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.