公开(公告)号：US10586788B2

公开(公告)日：2020-03-10

申请号：US15484499

申请日：2017-04-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Lutz Höppel ,  Norwin von Malm

IPC: H01L25/16 ,  H01L33/62 ,  H01L23/00 ,  H01L29/861 ,  H01L33/54 ,  H01L33/56 ,  H01L23/31 ,  H01L21/56 ,  H01L21/683

Abstract: A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged; arranging a protection diode on the first contact and the second contact; galvanically growing a first pin on the first electrical contact and a second pin on the second electrical contact; and embedding the first pin, the second pin, and the protection diode in a molded body.

公开(公告)号：US10461120B2

公开(公告)日：2019-10-29

申请号：US15663936

申请日：2017-07-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm

IPC: H01L27/15 ,  H01L33/38 ,  H01L33/20 ,  H01L33/00 ,  H01L33/50 ,  H01L27/12 ,  H01L33/62

Abstract: A display device with a semiconductor layer sequence includes an active region provided for generating radiation and a plurality of pixels. The display device also includes a carrier. The active region is arranged between a first semiconductor layer and a second semiconductor layer. The semiconductor layer sequence includes a recess, which extends from a major face of the semiconductor layer sequence facing the carrier through the active region into the first semiconductor layer and is provided for electrical contacting of the first semiconductor layer. The carrier includes a number of switches, which are each provided for controlling at least one pixel.

公开(公告)号：US20190281679A1

公开(公告)日：2019-09-12

申请号：US16347269

申请日：2017-11-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm

IPC: H05B33/08 ,  H01L25/16 ,  H01L23/66 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H05B37/02

Abstract: A multipixel LED component includes a plurality of emission zones; a plurality of conversion elements adapted to convert radiation emitted from the emission zones into radiation of another wavelength range; a controller including a plurality of current sources and a transmitter adapted for wireless data transmission; and two electrical contact structures through which the LED component is energized, wherein the controller mechanically fixedly connects to the emission zones, each of the current sources is assigned to one of the emission zones biuniquely, the transmitter receives signals to control the current sources, the current sources are controllable according to the signals, each current source operates the emission zone assigned to it, and the number of emission zones is greater than the number of contact structures.

公开(公告)号：US10230024B2

公开(公告)日：2019-03-12

申请号：US15744400

申请日：2016-08-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： David O'Brien ,  Norwin von Malm

IPC: C09K11/56 ,  C09K11/54 ,  C09K11/70 ,  C09K11/62 ,  H01L33/50 ,  H01L51/50 ,  C09K11/08 ,  H01L23/00

Abstract: A method of producing an optoelectronic component including a conversion element includes: A) providing a layer sequence having an active layer, wherein the active layer is configured to emit electromagnetic primary radiation; B) providing quantum dots, wherein the quantum dots are functionalized with an organic group and/or the quantum dots dissolved or dispersed in a first solvent and/or are present as a powder; C*) providing a mixture including a precursor of an inorganic matrix material and of a second solvent; D) mixing the mixture obtained in step C*) with the quantum dots of step B); E) drying the mixture; and F) sintering the mixture to form the conversion element.

公开(公告)号：US20180182943A1

公开(公告)日：2018-06-28

申请号：US15735990

申请日：2016-06-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm ,  Frank Singer

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/38 ,  F21V8/00 ,  H01L33/00

CPC classification number: H01L33/62 ,  G02B6/0073 ,  G02B6/0083 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/486 ,  H01L33/60 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: A component comprising a support and a semiconductor body arranged on the support, the support formed by a molded body and a metal layer. The metal layer has a first subregion and a second subregion laterally spaced apart by an intermediate space and thereby electrically separated. The molded body fills the intermediate space and has a surface extending in lateral directions free from the subregions of the metal layer and forms the rear side of the support. The support has a side face formed by a surface of the molded body extending in vertical directions, at least one of the subregions formed such that electrical contact can be made by way of the side face.

公开(公告)号：US20180122990A1

公开(公告)日：2018-05-03

申请号：US15565106

申请日：2016-04-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm

IPC: H01L33/38 ,  H01L33/62 ,  H01L33/54 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0224

CPC classification number: H01L33/38 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/022408 ,  H01L33/54 ,  H01L33/62

Abstract: A device and a method for producing a device are disclosed. In an embodiment the device includes a carrier and a semiconductor body arranged in a vertical direction on the carrier. The carrier includes at least one metal layer for electrically contacting the semiconductor body, a non-metallic molding layer, at least one electrically insulating insulation layer, wherein the insulation layer is arranged in the vertical direction between the semiconductor body and the molding layer and internal anchoring structures, wherein at least two layers of the metal layer, the molding layer and the insulation layer are anchored to one another by the internal anchoring structures.

公开(公告)号：US09748309B2

公开(公告)日：2017-08-29

申请号：US15147499

申请日：2016-05-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm

IPC: H01L29/20 ,  H01L27/15 ,  H01L33/38 ,  H01L33/00 ,  H01L33/50 ,  H01L27/12 ,  H01L33/20 ,  H01L33/62

CPC classification number: H01L27/156 ,  H01L27/124 ,  H01L27/1259 ,  H01L27/15 ,  H01L33/005 ,  H01L33/20 ,  H01L33/382 ,  H01L33/50 ,  H01L33/505 ,  H01L33/62 ,  H01L2933/0066

Abstract: A display device with a semiconductor layer sequence includes an active region provided for generating radiation and a plurality of pixels. The display device also includes a carrier. The active region is arranged between a first semiconductor layer and a second semiconductor layer. The semiconductor layer sequence includes at least one recess, which extends from a major face of the semiconductor layer sequence facing the carrier through the active region into the first semiconductor layer and is provided for electrical contacting of the first semiconductor layer. The carrier includes a number of switches, which are each provided for controlling at least one pixel.

公开(公告)号：US20170207373A1

公开(公告)日：2017-07-20

申请号：US15473918

申请日：2017-03-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Britta Göötz ,  Wolfgang Mönch ,  Norwin von Malm

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/58

CPC classification number: H01L33/507 ,  H01L27/15 ,  H01L27/153 ,  H01L27/156 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In an embodiment, the component includes a carrier, a multi-pixel semiconductor chip that emits electromagnetic radiation during operation, wherein the semiconductor chip is arranged on the carrier, and wherein the semiconductor chip has a plurality of individually activatable pixels capable of generating primary radiation and a wavelength conversion element for at least partially converting the primary radiation emitted from the semiconductor chip into electromagnetic secondary radiation, wherein an active zone of the multi-pixel semiconductor chip extends continuously over the plurality of pixels, and wherein the wavelength conversion element is implemented in one piece.

公开(公告)号：US09705058B2

公开(公告)日：2017-07-11

申请号：US14893922

申请日：2014-05-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm ,  Andreas Plöβl

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/38 ,  H01L27/146 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L27/14618 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14687 ,  H01L33/382 ,  H01L33/483 ,  H01L33/60 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: An optoelectronic semiconductor chip includes a semiconductor body that has a semiconductor layer sequence and at least one opening that extends through a second semiconductor layer into a first semiconductor layer. The chip also includes a support, which includes at least one recess, and a metallic connecting layer between the semiconductor body and the support. The metallic connecting layer includes a first region and a second region. The first region is connected to the first semiconductor layer in an electrically conductive manner through the opening and the second region is connected to the second semiconductor layer in an electrically conductive manner. A first contact is connected to the first region in an electrically conductive manner through the recess or a second contact is connected to the second region in an electrically conductive manner through the recess.

公开(公告)号：US09614131B2

公开(公告)日：2017-04-04

申请号：US14650545

申请日：2013-12-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Britta Göötz ,  Wolfgang Mönch ,  Norwin von Malm

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/58

CPC classification number: H01L33/507 ,  H01L27/15 ,  H01L27/153 ,  H01L27/156 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: An optoelectronic semiconductor component has a carrier and at least one semiconductor chip for emitting electromagnetic radiation. The semiconductor chip has two or more individually controllable elements. The semiconductor component additionally has a wavelength conversion element for at least partial conversion of the primary radiation emitted by the semiconductor chip into a secondary electromagnetic radiation. Each of the elements is suitable for generating primary radiation. The wavelength conversion element is structured into subregions. At least one individually controllable element of the semiconductor chip is associated with each subregion of the wavelength conversion element.