公开(公告)号：US09966426B2

公开(公告)日：2018-05-08

申请号：US14853967

申请日：2015-09-14

申请人： QUALCOMM Incorporated

发明人： Niranjan Sunil Mudakatte ,  Daeik Daniel Kim ,  David Francis Berdy ,  Changhan Hobie Yun ,  Je-Hsiung Jeffrey Lan ,  Chengjie Zuo ,  Mario Francisco Velez ,  Robert Paul Mikulka ,  Jonghae Kim

IPC分类号： H01L23/057 ,  H01L23/48 ,  H01L23/495 ,  H01L49/02 ,  H01L23/522 ,  H01L27/08 ,  H01L23/00

CPC分类号： H01L28/60 ,  H01L23/5223 ,  H01L24/13 ,  H01L27/0805 ,  H01L28/87 ,  H01L28/91 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13109 ,  H01L2224/94 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10337 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2224/03

摘要： An augmented capacitor structure includes a substrate and a first capacitor plate of a first conductive layer on the substrate. The augmented capacitor structure also includes an insulator layer on a surface of the first capacitor plate facing away from the substrate and a second capacitor plate. The second capacitor plate includes a second conductive layer on the insulator layer, supported by the first capacitor plate as a first capacitor. A second capacitor electrically is coupled in series with the first capacitor. The first capacitor plate is shared by the first capacitor and the second capacitor as a shared first capacitor plate. An extended first capacitor plate includes a first dummy portion of a third conductive layer and a first dummy via bar extending along the surface of the shared first capacitor plate. The first dummy portion extends along and is supported by the first dummy via bar.

公开(公告)号：US09906318B2

公开(公告)日：2018-02-27

申请号：US14682023

申请日：2015-04-08

申请人： QUALCOMM Incorporated

发明人： Chengjie Zuo ,  Daeik Daniel Kim ,  David Francis Berdy ,  Changhan Hobie Yun ,  Je-Hsiung Jeffrey Lan ,  Robert Paul Mikulka ,  Mario Francisco Velez ,  Jonghae Kim ,  Matthew Michael Nowak ,  Ryan Scott C. Spring ,  Xiangdong Zhang

IPC分类号： H04J1/00 ,  H04J1/08 ,  H03H7/46 ,  H04B1/00

CPC分类号： H04J1/08 ,  H03H7/465 ,  H03H2240/00 ,  H03H2250/00 ,  H04B1/0057 ,  H04B1/006 ,  H04B1/0064

摘要： An apparatus is disclosed that includes a frequency multiplexer circuit coupled to an input node and configured to receive an input signal via the input node. The frequency multiplexer circuit comprises a first filter circuit, a second filter circuit, and a third filter circuit. The apparatus also includes a switching circuit that is configurable to couple at least two of a first output of the first filter circuit, a second output of the second filter circuit, or a third output of the third filter circuit to a single output port.

公开(公告)号：US20170331445A1

公开(公告)日：2017-11-16

申请号：US15151351

申请日：2016-05-10

申请人： QUALCOMM Incorporated

发明人： Yunfei Ma ,  Chengjie Zuo ,  David Francis Berdy ,  Daeik Daniel Kim ,  Changhan Hobie Yun ,  Je-Hsiung Jeffrey Lan ,  Mario Francisco Velez ,  Niranjan Sunil Mudakatte ,  Robert Paul Mikulka ,  Jonghae Kim

IPC分类号： H03H7/38 ,  H03H7/40

CPC分类号： H03H7/38 ,  H03H7/40 ,  H04B1/0458

摘要： A tunable matching network is disclosed. In a particular example, the matching network includes at least one first inductor in a signal path of the matching network. The matching network includes at least one second inductor outside of the signal path. The matching network includes one or more switches coupled to the at least one second inductor. The one or more switches are configured to selectively enable mutual coupling of the at least one first inductor and the at least one second inductor.

公开(公告)号：US20170062120A1

公开(公告)日：2017-03-02

申请号：US14841132

申请日：2015-08-31

申请人： QUALCOMM Incorporated

发明人： Changhan Hobie Yun ,  Mario Francisco Velez ,  Chengjie Zuo ,  Daeik Daniel Kim ,  David Francis Berdy ,  Je-Hsiung Jeffrey Lan ,  Jonghae Kim ,  Niranjan Sunil Mudakatte ,  Robert Paul Mikulka

IPC分类号： H01F27/28 ,  H01F41/14 ,  H01F41/04 ,  H01F27/245

CPC分类号： H01F27/2804 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/245 ,  H01F41/042 ,  H01F41/046 ,  H01F41/14 ,  H01F41/32 ,  H01F2027/2809 ,  H01L23/645 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/165 ,  H01L2924/00012

摘要： A substrate includes a first dielectric layer, a magnetic core at least partially in the first dielectric layer, where the magnetic core comprises a first non-horizontal thin film magnetic (TFM) layer. The substrate also includes a first inductor that includes a plurality of first interconnects, where the first inductor is positioned in the substrate to at least partially surround the magnetic core. The magnetic core may further include a second non-horizontal thin film magnetic (TFM) layer. The magnetic core may further include a core layer. The magnetic core may further include a third thin film magnetic (TFM) layer, and a fourth thin film magnetic (TFM) layer that is substantially parallel to the third thin film magnetic (TFM) layer.

摘要翻译： 衬底包括第一介电层，至少部分地在第一介电层中的磁芯，其中磁芯包括第一非水平薄膜磁性（TFM）层。 衬底还包括包括多个第一互连件的第一电感器，其中第一电感器定位在衬底中以至少部分地围绕磁芯。 磁芯还可以包括第二非水平薄膜磁性（TFM）层。 磁芯还可以包括芯层。 磁芯还可以包括第三薄膜磁性（TFM）层和基本上平行于第三薄膜磁性（TFM）层的第四薄膜磁性（TFM）层。

公开(公告)号：US20160358709A1

公开(公告)日：2016-12-08

申请号：US15242007

申请日：2016-08-19

申请人： QUALCOMM Incorporated

发明人： Daeik Daniel Kim ,  Chengjie Zuo ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Robert Paul Mikulka ,  Xiangdong Zhang ,  Jonghae Kim ,  Je-Hsiung Lan

IPC分类号： H01F41/04 ,  H01F27/28

CPC分类号： H01F41/041 ,  H01F17/0013 ,  H01F27/2804 ,  H01F41/042 ,  H01F2017/0053 ,  H01F2017/0073 ,  H01F2027/2809

摘要： A method includes forming a first conductive spiral and a second conductive spiral of a spiral inductor coupled to a substrate. The second conductive spiral overlays the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate. The second thickness is greater than the first thickness. The portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral.

摘要翻译： 一种方法包括形成耦合到衬底的螺旋电感器的第一导电螺旋和第二导电螺旋。 第二导电螺旋覆盖第一导电螺旋。 螺旋电感器的最内圈的第一部分在垂直于衬底的方向上具有第一厚度。 最内圈的第一部分包括第一导电螺旋的第一部分，并且不包括第二导电螺旋。 最内圈的第二部分包括第二导电螺旋的第一部分。 螺旋电感器的最外圈的一部分在垂直于衬底的方向上具有第二厚度。 第二厚度大于第一厚度。 最外圈的部分包括第一导电螺旋的第二部分和第二导电螺旋的第二部分。

公开(公告)号：US20160093750A1

公开(公告)日：2016-03-31

申请号：US14498359

申请日：2014-09-26

申请人： QUALCOMM Incorporated

发明人： Daeik Daniel Kim ,  Jonghae Kim ,  Chengjie Zuo ,  Sang-June Park ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  David Francis Berdy ,  Matthew Michael Nowak ,  Robert Paul Mikulka

IPC分类号： H01L29/93

CPC分类号： H01L29/93 ,  H01L27/0629 ,  H01L29/94

摘要： An apparatus includes a varactor having a first contact that is located on a first side of a substrate. The varactor includes a second contact that is located on a second side of the substrate, and the second side is opposite the first side. The apparatus further includes a signal path between the first contact and the second contact.

摘要翻译： 一种装置包括具有位于衬底的第一侧上的第一接触的变容二极管。 变容二极管包括位于衬底的第二侧上的第二接触件，第二侧面与第一侧相对。 该装置还包括在第一触点和第二触点之间的信号路径。

公开(公告)号：US09202789B2

公开(公告)日：2015-12-01

申请号：US14254764

申请日：2014-04-16

申请人： QUALCOMM Incorporated

发明人： Daeik Daniel Kim ,  Mario Francisco Velez ,  Jonghae Kim ,  Matthew Michael Nowak ,  Chengjie Zuo ,  Changhan Hobie Yun ,  David Francis Berdy ,  Robert Paul Mikulka

IPC分类号： H01L23/48 ,  H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L23/04 ,  H01L23/538 ,  H05K9/00

CPC分类号： H01L23/552 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/32 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01R12/7076 ,  H01R12/714 ,  H05K1/181 ,  H05K9/0032 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014

摘要： Some novel features pertain to an integrated device package (e.g., die package) that includes a package substrate, a die, an encapsulation layer and a first set of metal layers. The package substrate includes a first surface and a second surface. The die is coupled to the first surface of the package substrate. The encapsulation layer encapsulates the die. The first set of metal layers is coupled to a first exterior surface of the encapsulation layer. In some implementations, the first set of metal layers is configured to operate as a die-to-wire connector of the integrated device package. In some implementations, the integrated device package includes a second set of metal layers coupled to the second surface of the package substrate. In some implementations, the integrated device package includes a second set of metal layers coupled to a second exterior surface of the encapsulation layer.

摘要翻译： 一些新颖特征涉及包括封装衬底，管芯，封装层和第一组金属层的集成器件封装（例如管芯封装）。 封装衬底包括第一表面和第二表面。 模具耦合到封装衬底的第一表面。 封装层封装模具。 第一组金属层耦合到封装层的第一外表面。 在一些实施方案中，第一组金属层被配置为作为集成器件封装的管芯到线连接器工作。 在一些实施方案中，集成器件封装包括耦合到封装衬底的第二表面的第二组金属层。 在一些实施方案中，集成器件封装包括耦合到封装层的第二外表面的第二组金属层。

公开(公告)号：US20150304059A1

公开(公告)日：2015-10-22

申请号：US14682023

申请日：2015-04-08

申请人： QUALCOMM Incorporated

发明人： Chengjie Zuo ,  Daeik Daniel Kim ,  David Francis Berdy ,  Changhan Hobie Yun ,  Je-Hsiung Jeffrey Lan ,  Robert Paul Mikulka ,  Mario Francisco Velez ,  Jonghae Kim ,  Matthew Michael Nowak ,  Ryan Scott C. Spring ,  Xiangdong Zhang

IPC分类号： H04J1/08

CPC分类号： H04J1/08 ,  H03H7/465 ,  H03H2240/00 ,  H03H2250/00 ,  H04B1/0057 ,  H04B1/006 ,  H04B1/0064

摘要： An apparatus is disclosed that includes a frequency multiplexer circuit coupled to an input node and configured to receive an input signal via the input node. The frequency multiplexer circuit comprises a first filter circuit, a second filter circuit, and a third filter circuit. The apparatus also includes a switching circuit that is configurable to couple at least two of a first output of the first filter circuit, a second output of the second filter circuit, or a third output of the third filter circuit to a single output port.

摘要翻译： 公开了一种装置，其包括耦合到输入节点并经配置以经由输入节点接收输入信号的频率复用器电路。 频率复用器电路包括第一滤波器电路，第二滤波器电路和第三滤波器电路。 该装置还包括可配置为将第一滤波器电路的第一输出，第二滤波器电路的第二输出或第三滤波器电路的第三输出中的至少两个耦合到单个输出端口的开关电路。