摘要:
The present invention relates to a method for producing a composited particle in which an inorganic particle is not released, a composited particle produced by this method, and an aqueous dispersion for CMP containing this composited particle. The method for producing a composited particle of the present invention comprises forming a preliminary particle by adhering one or more types of inorganic particles on at least a part of the surface area of a polymer particle, then, polycondensing at least one selected from among organosilicon compounds and organometal compounds in the presence of the above-mentioned preliminary particle.
摘要:
The present invention provides an aqueous dispersion composition for chemical mechanical polishing which is useful for the manufacture of semiconductor devices, and which for polishing of different types of working films and barrier metal layers formed on semiconductor substrates, can achieve efficient polishing particularly of barrier metal surfaces and can give adequately flattened and high precision finished surfaces. The aqueous dispersion composition for chemical mechanical polishing has properties such that, when polishing a copper film, a tantalum layer and/or tantalum nitride layer a and an insulating film under the same conditions, the ratio (RCu/RTa) between the polishing rate of the copper film (RCu) and the polishing rate of the tantalum layer and/or tantalum nitride layer (RTa) is no greater than 1/20, and the ratio (RCu/RIn) between the polishing rate of the copper film (RCu) and the polishing rate of the insulating film (RIn) is from 5 to ⅕. RCu/RTa is preferably no greater than {fraction (1/30)}, especially no greater than {fraction (1/40)} and most preferably no greater than {fraction (1/50)}, while RCu/RIn is preferably 4¼, especially 3⅓ and more preferably 2½.
摘要:
Water-laden solid matter is provided which is obtained by adding 40 to 300 weight parts of water to 100 weight parts of inorganic oxide particles synthesized by fumed process or metal evaporation oxidation process, slurry for polishing is provided which is manufactured by using the water-laden solid matter, and a method for manufacturing a semiconductor device using the above slurry. Said water-laden solid matter is within a range of 0.3 to 3 g/cm3 in bulk density and within a range of 0.5 to 100 mm&phgr; in average particle size when manufactured granular. Said slurry for polishing is manufactured from the water-laden solid matter, and the average particle size thereof after being dispersed in water is within a range of 0.05 to 1.0 &mgr;m.
摘要翻译:提供含水固体物质,其通过向通过热解法或金属蒸发氧化法合成的100重量份的无机氧化物颗粒中加入40至300重量份的水而获得,提供了通过使用水 - 负载固体物质,以及使用上述浆料制造半导体器件的方法。 所述含水固体物质的体积密度为0.3〜3g / cm 3,制粒时的平均粒径为0.5〜100mmφ的范围。 用于抛光的所述浆料由含水固体物质制成,其在分散在水中的平均粒径在0.05-1.0μm的范围内。
摘要:
The present invention provides aqueous dispersion slurry of inorganic particles which is so stable as not to increase in viscosity, gel or sediment even if stored for a long time and therefore can be used as raw materials for, for example, cosmetics, paint, coating materials and lapping slurry for semiconductor wafers, and production method of such aqueous dispersion slurry. The aqueous dispersion slurry according to the present invention has the number of particles whose a particle diameter of 1.3 .mu.m or more is 180,000 or less per mL in terms of 30 wt % in concentration, and the average particle diameter thereof is in a range of 0.05-0.9 .mu.m. The number of particles having aparticle diameter of 1.3 .mu.m or more is counted by using Particle Sensor KS-60, which is a light extinction type sensor for detecting particles, and Particle Counter KL-11, which is a particle counter, both of which made by the same manufacturer, Rion Electro Corp. The average particle diameter is measured by using Laser Particle Analyzer System Par-III made by Otsuka Denshi Co., Ltd.
摘要:
A process for preparing poly-.alpha.-amino acid particles comprising polymerizing an .alpha.-amino acid-N-carboxy anhydride using a polymerization initiator in an organic solvent in which both the solubility of the .alpha.-amino acid-N-carboxy anhydride and the solubility of the produced poly-.alpha.-amino acid are 0.1 g/100 ml or less at 25.degree. C. Polyamino acid particles having a high molecular weight and a small bulk specific gravity can be manufactured very easily without requiring specific procedures. The polyamino acid particles can be used as a coating material for papers, resins, rubbers, and fibers; particles for cosmetics; particles for diagnostic drugs; fillers for chromatography; and an encapsulating material for drugs, fertilizers, and perfumes.
摘要:
Novel magnetic polymer particles which resists precipitation in an aqueous medium. The novel magnetic polymer particles can be widely used as carriers for diagnostics and immobilized enzymes, carriers for bacterial isolation, carriers for cell segregation, carriers for isolation and purification of ribonucleic acids and proteins, carriers for drug deliveries, and are usable as material for magnetic toners, magnetic inks, and magnetic coatings. The process for manufacturing the magnetic polymer particles comprising; dispersing a monomer mixture including a hydrophobic monomer containing more than 50% by weight of (meth)acrylic ester and a superparamagnetic substance in an aqueous medium to prepare an suspension, and polymerizing the monomers.
摘要:
Here is disclosed an IC for controlling the spindle motor of a small hard disk drive unit, characteristic in being provided with a voltage detection circuit for a control circuit driving power source, responsive to the voltage at the connecting terminal of the control circuit driving power source for generating a signal to control the operation of the spindle motor; a voltage detection circuit for a motor driving power source, responsive to the voltage at the connecting terminal of the motor driving power source for controlling the operation of the motor; and further provided with a logic circuit for keeping valid the output signal of the voltage detecting circuit for said motor driving power source from the time the voltage at the motor driving power source terminal rises above a prescribed voltage higher than the upper limit of the prescribed voltage range of the control circuit power source until the time it falls below another prescribed voltage lower than the lower limit of said prescribed voltage range.The IC can be used in a single voltage mode, in which a single voltage power source corresponding to the control circuit driving power source is connected to the control circuit power source terminal and the motor driving power source terminal, or in a dual voltage mode, in which power sources of two different voltages can be connected to these power source terminals, it increases the freedom of design.
摘要:
A process for the preparation of highly crosslinked polymer particles from polymerizable vinyl monomers comprising 15% by weight or more of a crosslinking vinyl monomer. The process comprises: providing an organic solvent, a mixture of organic solvents, or a mixture of at least one organic solvent and water which can dissolve the polymerizable vinyl monomers but cannot dissolve the polymer which is produced by the polymerization of the polymerizable vinyl monomers, the solubility in water of the polymerizable vinyl monomer being not more than 30% by weight, dispersing the polymerizable vinyl monomers into the organic solvent, the mixture of organic solvents, or the mixture of the at least one organic solvent and water, and polymerizing the polymerizable vinyl monomers in the presence of a dispersion stabilizer and a radical polymerization initiator. The crosslinked polymer particles have a comparatively uniform particle size within the particle size range of 0.1-10 .mu.m. They are useful as a slip property improver for plastic films, a spacer for liquid crystal display devices, a carrier for chromatography, and a standard sample for microscopic examination.
摘要:
It is an object of the invention to provide an aqueous dispersion for CMP that produces no scratches on polishing surfaces and that polishes with an adequate rate, when used for polishing of copper and the like. The aqueous dispersion of the invention contains water and polymer particles composed of a polymer with a specific functional group, and it may also contain a complexing agent, a compound that forms a passivation film on polishing surfaces and/or an oxidizing agent. The specific functional group is a functional group that can react with the metals of polishing surfaces or that can form a cation, and it is preferably selected from among amino, pyridyl and acrylamide groups. The polymer can be obtained using a initiator and/or monomer possessing the specific functional group. The polymer may also have a crosslinked structure.
摘要:
The aqueous dispersion comprising (A) abrasive grains, (B) at least one compound selected from the group consisting of 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1, 3-butanediol, 2,2-dibromo-2-nitroethanol, and 2,2-dibromo-3-nitrilopropionamide, and (C) an organic component other than the compounds of component (B) is disclosed. The aqueous dispersion has no problem of rotting even if stored or used in a neutral pH region and produces an excellent polished surface with almost no dishing or scratches, when applied particularly to the STI process for manufacturing of semiconductor devices.