MANUFACTURING METHOD OF OXIDE SEMICONDUCTOR
    21.
    发明申请
    MANUFACTURING METHOD OF OXIDE SEMICONDUCTOR 审中-公开
    氧化物半导体的制造方法

    公开(公告)号:US20150187575A1

    公开(公告)日:2015-07-02

    申请号:US14580566

    申请日:2014-12-23

    Abstract: A method of forming an oxide semiconductor includes a step of depositing an oxide semiconductor layer over a substrate by using a sputtering apparatus in which in a target containing indium, an element M (aluminum, gallium, yttrium, or tin), zinc, and oxygen, the substrate which faces a surface of the target, and a magnet unit comprising a first magnet and a second magnet on a rear surface side of the target are provided. In the method, deposition is performed under a condition that a maximum intensity of a horizontal magnetic field is greater than or equal to 350 G and less than or equal to 2000 G in a plane where a vertical distance toward the substrate from a surface of the magnet unit is 10 mm.

    Abstract translation: 形成氧化物半导体的方法包括通过使用溅射装置在衬底上沉积氧化物半导体层的步骤,其中在含有铟的元素M(铝,镓,钇或锡),锌和氧元素 设置面向靶的表面的基板,以及在靶的背面侧具有第一磁体和第二磁体的磁体单元。 在该方法中,在水平磁场的最大强度大于或等于350G且小于或等于2000G的条件下,在从基板的表面垂直距离的平面中进行沉积 磁体单位为10 mm。

    Semiconductor device
    28.
    发明授权

    公开(公告)号:US10600918B2

    公开(公告)日:2020-03-24

    申请号:US15211218

    申请日:2016-07-15

    Abstract: Provided is a semiconductor device having a structure with which a decrease in electrical characteristics that becomes more significant with miniaturization can be suppressed. The semiconductor device includes a first oxide semiconductor film, a gate electrode overlapping with the first oxide semiconductor film, a first gate insulating film between the first oxide semiconductor film and the gate electrode, and a second gate insulating film between the first gate insulating film and the gate electrode. In the first gate insulating film, a peak appears at a diffraction angle 2θ of around 28° by X-ray diffraction. A band gap of the first oxide semiconductor film is smaller than a band gap of the first gate insulating film, and the band gap of the first gate insulating film is smaller than a band gap of the second gate insulating film.

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