公开(公告)号：US12119347B2

公开(公告)日：2024-10-15

申请号：US18332298

申请日：2023-06-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keomyoung Shin ,  Pankwi Park ,  Seunghun Lee

IPC: H01L27/088 ,  H01L29/06 ,  H01L29/08 ,  H01L29/26 ,  H01L29/78

CPC classification number: H01L27/0886 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/26 ,  H01L29/785

Abstract: An integrated circuit (IC) device includes a fin-type active region extending lengthwise in a first direction, a plurality of nanosheets overlapping each other in a second direction on a fin top surface of the fin-type active region, and a source/drain region on the fin-type active region and facing the plurality of nanosheets in the first direction. The plurality of nanosheets include a first nanosheet, which is closest to the fin top surface of the fin-type active region and has a shortest length in the first direction, from among the plurality of nanosheets. The source/drain region includes a source/drain main region and a first source/drain protruding region protruding from the source/drain main region. The first source/drain protruding region protrudes from the source/drain main region toward the first nanosheet and overlaps portions of the plurality of nanosheets in the second direction.

公开(公告)号：US20240321886A1

公开(公告)日：2024-09-26

申请号：US18605400

申请日：2024-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghee Cho ,  Myungil Kang ,  Kyungho Kim ,  Kyowook Lee ,  Seunghun Lee

IPC: H01L27/092 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L27/092 ,  H01L29/0673 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/775 ,  H01L29/78696

Abstract: A stacked integrated circuit device includes a plurality of transistors including a pair of pull-up transistors in a first layer, a pair of pull-down transistors in a second layer that is at a different vertical level than the first layer, and a pair of pass-gate transistors in the first or second layer, a contact configured to electrically connect a source/drain region of one of the pull-up transistors, a source/drain region of one of the pull-down transistors, and a source/drain region of one of the pass-gate transistors to one another, a gate contact configured to connect a gate electrode of the other pull-up transistor to a gate electrode of the other pull-down transistor, and an upper wire on the contact and the gate contact, the upper wire extending in a first horizontal direction and being connected to the contact and the gate contact.

公开(公告)号：US20240297215A1

公开(公告)日：2024-09-05

申请号：US18658794

申请日：2024-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungkeun Lim ,  Unki Kim ,  Yuyeong Jo ,  Yihwan Kim ,  Jinbum Kim ,  Pankwi Park ,  Ilgyou Shin ,  Seunghun Lee

IPC: H01L29/06 ,  H01L21/02 ,  H01L29/66 ,  H01L29/78

CPC classification number: H01L29/0638 ,  H01L21/0245 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/785

Abstract: A semiconductor device includes; an active region; an isolation region defining the active region; a barrier layer on the active region; an upper semiconductor layer on the barrier layer; and a gate structure covering an upper surface, a lower surface, and side surfaces of the upper semiconductor layer in a first direction. The first direction is a direction parallel to an upper surface of the active region, and the barrier layer is disposed between the gate structure and the active region.

公开(公告)号：US11735632B2

公开(公告)日：2023-08-22

申请号：US17546690

申请日：2021-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seokhoon Kim ,  Dongmyoung Kim ,  Kanghun Moon ,  Hyunkwan Yu ,  Sanggil Lee ,  Seunghun Lee ,  Sihyung Lee ,  Choeun Lee ,  Edward Namkyu Cho ,  Yang Xu

IPC: H01L29/08 ,  H01L29/78 ,  H01L27/088 ,  H01L29/06

CPC classification number: H01L29/0847 ,  H01L27/0886 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/785 ,  H01L29/7853

Abstract: A semiconductor device includes a substrate, a fin structure on the substrate, a gate structure on the fin structure, a gate spacer on at least on side surface of the gate structure, and a source/drain structure on the fin structure, wherein a topmost portion of a bottom surface of the gate spacer is lower than a topmost portion of a top surface of the fin structure, and a topmost portion of a top surface of the source/drain structure is lower than the topmost portion of the top surface of the fin structure.

公开(公告)号：US20230215866A1

公开(公告)日：2023-07-06

申请号：US18120547

申请日：2023-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaemun Kim ,  Gyeom Kim ,  Dahye Kim ,  Jinbum Kim ,  Kyungin Choi ,  Ilgyou Shin ,  Seunghun Lee

IPC: H01L27/088 ,  H01L21/8234 ,  H01L21/02

CPC classification number: H01L27/0886 ,  H01L21/823431 ,  H01L21/0245 ,  H01L21/823481 ,  H01L21/823475

Abstract: An integrated circuit device includes: a fin-type active area protruding from a substrate, extending in a first direction parallel to an upper surface of the substrate, and including a first semiconductor material; an isolation layer arranged on the substrate and covering a lower portion of a sidewall of the fin-type active area, the isolation layer including an insulation liner conformally arranged on the lower portion of the sidewall of the fin-type active area, and an insulation filling layer on the insulation liner; a capping layer surrounding an upper surface and the sidewall of the fin-type active area, including a second semiconductor material different from the first semiconductor material, and with the capping layer having an upper surface, a sidewall, and a facet surface between the upper surface and the sidewall; and a gate structure arranged on the capping layer and extending in a second direction perpendicular to the first direction.

公开(公告)号：US20230006052A1

公开(公告)日：2023-01-05

申请号：US17656023

申请日：2022-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： HAEJUN YU ,  Kyungin Choi ,  Sungmin Kim ,  Seunghun Lee ,  Jinbum Kim

IPC: H01L29/423 ,  H01L27/092 ,  H01L29/786 ,  H01L29/06 ,  H01L29/417

Abstract: A semiconductor device includes first and second channels, first and second gate structures, first and second source/drain layers, first and second fin spacers, and first and second etch stop patterns. The first channels are disposed vertically on a first region of a substrate. The second channels are disposed vertically on a second region of the substrate. The first gate structure is formed on the first region and covers the first channels. The second gate structure is formed on the second region and covers the second channels. The first and second source/drain layers contact the first and second channels, respectively. The first and second fin spacers contact sidewalls and upper surfaces of the first and second source/drain layers, respectively. The first and second etch stop patterns are formed on the first and second fin spacers, respectively, and do not contact the first and second source/drain layers, respectively.

公开(公告)号：US20220208790A1

公开(公告)日：2022-06-30

申请号：US17410325

申请日：2021-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seokhyeon Yoon ,  Junyoung Park ,  Woocheol Shin ,  Seunghun Lee

IPC: H01L27/12 ,  H01L29/06 ,  H01L29/786 ,  H01L29/08

Abstract: An integrated circuit device includes: a semiconductor on insulator (SOI) substrate layer including a base substrate layer, an insulating substrate layer, and a cover substrate layer; a semiconductor substrate layer; a plurality of first fin-type active areas and a plurality of second fin-type active areas each defined by a plurality of trenches, and extending in a first horizontal direction, in above the SOI substrate layer and the semiconductor substrate layer, respectively; a plurality of nanosheet stacked structures comprising nanosheets extending in parallel with each other and spaced apart from upper surfaces of the plurality of first fin-type active areas and the plurality of second fin-type active areas; a plurality of first source/drain regions extending into the SOI substrate layer; and a plurality of second source/drain regions extending into the semiconductor substrate layer. Lower surfaces of the first and second source/drain regions may not be coplanar with each other.

公开(公告)号：US20210151319A1

公开(公告)日：2021-05-20

申请号：US17006799

申请日：2020-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyeom Kim ,  Dongwoo Kim ,  Jihye Yi ,  JinBum Kim ,  Sangmoon Lee ,  Seunghun Lee

IPC: H01L21/02 ,  H01L21/285 ,  H01L21/768 ,  H01L21/8234 ,  H01L29/08 ,  H01L29/165 ,  H01L29/417 ,  H01L29/66

Abstract: A semiconductor device is provided. The semiconductor device includes: an active region on a semiconductor substrate; a channel region on the active region; a source/drain region adjacent to the channel region on the active region; a gate structure overlapping the channel region, on the channel region; a contact structure on the source/drain region; a gate spacer between the contact structure and the gate structure; and a contact spacer surrounding a side surface of the contact structure. The source/drain region includes a first epitaxial region having a recessed surface and a second epitaxial region on the recessed surface of the first epitaxial region, and the second epitaxial region includes an extended portion, extended from a portion overlapping the contact structure in a vertical direction, in a horizontal direction and overlapping the contact spacer in the vertical direction.

公开(公告)号：US09773908B2

公开(公告)日：2017-09-26

申请号：US15138914

申请日：2016-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongwoo Kim ,  Seunghun Lee ,  Sunjung Kim ,  Hyunjung Lee ,  Bonyoung Koo

IPC: H01L21/02 ,  H01L29/78 ,  H01L29/08 ,  H01L29/165

CPC classification number: H01L29/7848 ,  H01L29/0847 ,  H01L29/165 ,  H01L29/7853

Abstract: A semiconductor device can include a substrate and a fin body that protrudes from a surface of the substrate. The fin body can include a lower portion having a first lattice structure and an upper portion, separated from the lower portion by a boundary, the upper portion having a second lattice structure that is different than the first lattice structure. An epitaxially grown epitxial layer can be on the lower and upper portions.

公开(公告)号：US12094975B2

公开(公告)日：2024-09-17

申请号：US18360457

申请日：2023-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangmoon Lee ,  Kyungin Choi ,  Seunghun Lee

IPC: H01L31/113 ,  H01L29/06 ,  H01L29/417 ,  H01L29/66 ,  H01L29/78 ,  H01L31/119

CPC classification number: H01L29/785 ,  H01L29/0649 ,  H01L29/41791 ,  H01L29/6681

Abstract: An active pattern structure includes a lower active pattern protruding from an upper surface of a substrate in a vertical direction substantially perpendicular to an upper surface of the substrate, a buffer structure on the lower active pattern, at least a portion of which may include aluminum silicon oxide, and an upper active pattern on the buffer structure.