Abstract:
Disclosed is a nonvolatile memory having a memory cell array including a plurality of cell strings, each cell string including memory cells stacked in a direction perpendicular to a substrate, a ground selection transistor between the memory cells and the substrate, and a string selection transistor between the memory cells and a bit line. The memory also includes an address decoder connected to the memory cells, the string selection transistors, and the ground selection transistors, and configured to apply a ground voltage to the string selection lines, word lines, and ground selection line. Further, the memory includes a read/write circuit connected to the string selection transistors through bit lines, and at least one first memory cell maintains a threshold voltage higher than a threshold voltage distribution corresponding to an erase state.
Abstract:
According to example embodiments of inventive concepts, a nonvolatile memory device includes a memory cell array including a plurality of memory cells; a word line driver configured to at least one of select and unselect a plurality of word lines connected with the plurality of memory cells, respectively, and to supply voltages to the plurality of word lines; and a read/write circuit configured to apply bias voltages to a plurality of bit lines connected with the plurality of memory cells. The read/write circuit may be configured to adjust levels of the bias voltages applied to the plurality of bit lines according to location of a selected word line among the plurality of word lines.
Abstract:
Nonvolatile memory devices utilize vertically-stacked strings of nonvolatile memory cells (e.g., NAND-type strings) that can be selectively coupled to common source lines within a substrate. This selective coupling may be provided by lateral ground select transistors having different threshold voltages that account for different lateral spacings between the vertically-stacked strings of nonvolatile memory cells and the common source lines.
Abstract:
A semiconductor device includes a first semiconductor structure including a first substrate, and a lower bonding structure on the first substrate, and a second semiconductor structure including a second substrate, and an upper bonding structure bonded to the lower bonding structure. The second semiconductor structure includes via patterns on the second substrate, a source contact pad including a material different from that of the second substrate, a source contact plug electrically connected to the source contact pad, a source contact via on the source contact pad, and an interconnection line that electrically connects the via patterns to the source contact plug. Lower surfaces of the via patterns are farther from the first substrate than a lower surface of the source contact via, and an upper surface of the second substrate is farther from the first substrate than an upper surface of the source contact pad.
Abstract:
A semiconductor device includes a first semiconductor structure including circuit elements on a first substrate, a lower interconnection structure on the circuit elements, and a lower bonding structure on the lower interconnection structure; and a second semiconductor structure including a second substrate on the first semiconductor structure, separation insulating patterns separating the second substrate, and disposed to be spaced apart from each other, gate electrodes stacked to be spaced apart from each other, separation regions passing through the gate electrodes, and disposed to be spaced apart from each other, channel structures passing through the gate electrodes, an upper interconnection structure below the gate electrodes, and an upper bonding structure bonded to the lower bonding structure, wherein the separation insulating patterns include first separation insulating patterns on the separation regions, and second separation insulating patterns between the channel structures and passing through the second substrate.
Abstract:
An integrated circuit device comprising a base structure, a gate stack on the base structure and comprising a plurality of gate electrodes spaced apart from each other, a first upper insulating layer on the gate stack, a plurality of channel structures that penetrate the gate stack, each of the plurality of channel structures comprises a respective alignment key protruding from the gate stack, a second upper insulating layer that overlaps the respective alignment key of each of the plurality of channel structures, a top supporting layer on the second upper insulating layer, a bit line on the top supporting layer, and a plurality of bit line contacts that electrically connect respective ones of the plurality of channel structures to the bit line. A sidewall of the first upper insulating layer includes a first step.
Abstract:
A semiconductor device includes a gate electrode structure including first to fourth gate electrodes, a first memory channel structure extending through the first to third gate electrodes, a second memory channel structure contacting an upper surface of the first memory channel structure and extending through the fourth gate electrode, and a first contact plug including a lower portion extending partially through the gate electrode structure and an upper portion on and contacting an upper surface of the lower portion. The lower portion of the first contact plug has a varying width, and the upper portion of the first contact plug has a width gradually increasing from a bottom toward a top thereof. The lower portion of the first contact plug extends through the first, second and third gate electrodes, and is electrically insulated from the first and second gate electrodes, and is electrically connected to the third gate electrode.
Abstract:
A vertical memory device includes a gate electrode structure on a substrate, a channel extending through the gate electrode structure, and an etch stop layer on a sidewall of the gate electrode structure. The gate electrode structure includes gate electrodes spaced apart from each other in a first direction and stacked in a staircase shape. The channel includes a first portion and a second portion contacting the first portion. A lower surface of the second portion has a width less than a width of an upper surface of the first portion. The etch stop layer contacts at least one gate electrode of the gate electrodes, and overlaps an upper portion of the first portion of the channel in a horizontal direction. The at least one gate electrode contacting the etch stop layer is a dummy gate electrode including an insulating material.
Abstract:
A vertical memory device including: a circuit pattern on a first substrate; an insulating interlayer on the first substrate, the insulating interlayer covering the circuit pattern; a bending prevention layer on the insulating interlayer, the bending prevention layer extending in a first direction substantially parallel to an upper surface of the first substrate; a second substrate on the bending prevention layer; gate electrodes spaced apart from each other in a second direction on the second substrate, the second direction being substantially perpendicular to the upper surface of the first substrate; and a channel extending through the gate electrodes in the second direction.
Abstract:
A semiconductor device including: a memory cell array region and a staircase region on a pattern structure; a stack structure including insulating layers and gate layers with gate pads alternately stacked in a vertical direction; a separation structure penetrating through the stack structure and contacting the pattern structure; a memory vertical structure penetrating through the stack structure and contacting the pattern structure; a support vertical structure penetrating through the stack structure and contacting the pattern structure; gate contact plugs disposed on the gate pads; and a peripheral contact plug spaced apart from the gate layers, wherein an upper surface of the memory vertical structure is at a first level, an upper surface of the peripheral contact plug is at a second level, an upper surface of the separation structure is at a third level, and upper surfaces of the gate contact plugs are at a fourth level.