公开(公告)号：US09966369B2

公开(公告)日：2018-05-08

申请号：US15802493

申请日：2017-11-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Il Kim ,  Wan Tae Lim ,  Young Jin Choi ,  Sung Hyun Sim

IPC: H01L25/16 ,  H01L27/12 ,  H01L33/50 ,  H01L33/32 ,  H01L33/54 ,  H01L33/06

CPC classification number: H01L25/167 ,  H01L27/124 ,  H01L33/06 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54

Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

公开(公告)号：US20160163925A1

公开(公告)日：2016-06-09

申请号：US14958002

申请日：2015-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Su Hyun Jo ,  Ki Seok Kim ,  Seong Seok Yang ,  Yong Il Kim ,  Seung Hwan Lee

IPC: H01L33/22 ,  H01L33/32 ,  H01L33/58

CPC classification number: H01L33/44 ,  H01L33/20 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor light-emitting device includes a light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, microstructures regularly arranged on the first conductivity-type semiconductor layer around the light-emitting structure, and a gradient refractive layer on at least a portion of the microstructures, the gradient refractive layer having a lower refractive index than the first conductivity-type semiconductor layer.

Abstract translation: 一种半导体发光器件包括包括第一导电型半导体层，有源层和第二导电型半导体层的发光结构，在发光二极管周围的第一导电型半导体层上规则排列的微结构 结构，以及至少部分微结构的梯度折射层，所述梯度折射层具有比所述第一导电类型半导体层低的折射率。

公开(公告)号：US10700246B2

公开(公告)日：2020-06-30

申请号：US16299422

申请日：2019-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun Sim ,  Yong Il Kim ,  Ha Nul Yoo ,  Ji Hye Yeon ,  Jun Bu Youn ,  Ji Hoon Yun ,  Su Hyun Jo

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

公开(公告)号：US10573632B2

公开(公告)日：2020-02-25

申请号：US16185602

申请日：2018-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hye Yeon ,  Su Hyun Jo ,  Sung Hyun Sim ,  Ha Nul Yoo ,  Yong Il Kim ,  Han Kyu Seong

IPC: H01L25/18 ,  H01L27/12 ,  H01L33/50 ,  H01L25/00 ,  H01L23/00 ,  H01L27/15

Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.

公开(公告)号：US10553641B2

公开(公告)日：2020-02-04

申请号：US15933967

申请日：2018-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hye Yeon ,  Sung Hyun Sim ,  Wan Tae Lim ,  Yong Il Kim ,  Hanul Yoo

IPC: H01L27/15 ,  H01L33/50

Abstract: A light emitting device package includes a substrate for growth having a plurality of light-emitting windows, a plurality of semiconductor light-emitting units corresponding to the plurality of light-emitting windows, each semiconductor light-emitting unit having a first surface contacting the substrate for growth and a second surface opposite the first surface, and each semiconductor light-emitting unit having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on each other, a plurality of wavelength conversion units respectively disposed inside the plurality of light-emitting windows, each wavelength conversion unit is configured to provide light having a wavelength different from light emitted by the respective semiconductor light-emitting unit, a metal support layer disposed on at least one surface of each of the plurality of semiconductor light-emitting units and having a lateral surface coplanar with a lateral surface of the substrate for growth, and an insulating layer disposed between each of the plurality of semiconductor light-emitting units and a respective metal support layer.

公开(公告)号：US10388693B2

公开(公告)日：2019-08-20

申请号：US15984508

申请日：2018-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Goo Cha ,  Yong Il Kim ,  Young Soo Park

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/62 ,  H01L25/065 ,  H01L33/50 ,  H01L33/52 ,  H01L33/44 ,  H01L25/075

Abstract: In some examples, a semiconductor device may comprise a semiconductor chip including a plurality of pixels, each pixel formed of a plurality of sub-pixels, such as a red sub-pixel, green sub-pixel and blue sub-pixel. Each sub-pixel may comprise a light emitting diode. A first signal line may connect to signal terminals of a first group sub-pixels (e.g., arranged in the same row), and a second signal line may connect to common terminals of a second group of sub-pixels (e.g., arranged in the same column). The number of chip pads may thus be reduced to provide increased design flexibility in location and/or allowing an increase in chip pad size. In some examples, a light transmissive material may be formed in openings of a semiconductor growth substrate on which light emitting cells of the sub-pixels were grown. The light transmissive material of some of the sub-pixels may comprise a wavelength conversion material and/or filter. Exemplary display panels and methods of manufacturing semiconductor devices and display panels are also disclosed.

公开(公告)号：US10361248B2

公开(公告)日：2019-07-23

申请号：US15352933

申请日：2016-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Sub Lee ,  Han Kyu Seong ,  Yong Il Kim ,  Jung Sub Kim ,  Seul Gee Lee

IPC: H01L25/16 ,  H01L27/15 ,  H01L33/00 ,  H01L33/44 ,  H01L33/50 ,  H05B33/08 ,  H05B37/02 ,  H01L25/075

Abstract: A pixel of a light emitting diode module, display panel or other device, may comprise different colored sub-pixels, where one of the sub-pixels comprises a wavelength converting material, such as phosphor, to convert light emitted from an associated light emitting diode of that sub-pixel into a color other than the main color of light emitted from that sub-pixel. The wavelength converting material may have an amount selected to tune the color coordinates of the pixel. The amount of wavelength converting material may be determined in response to measuring the intensity of the spectrum of light emitted by the light emitting diode of the sub-pixel, or similarly manufactured sub-pixels, on which the wavelength converting material is to be formed. Methods of manufacturing the same are also disclosed.

公开(公告)号：US10326061B2

公开(公告)日：2019-06-18

申请号：US15486982

申请日：2017-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wan Tae Lim ,  Sung Hyun Sim ,  Hanul Yoo ,  Yong Il Kim ,  Hye Seok Noh ,  Ji Hye Yeon

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62

Abstract: A method of fabricating a light emitting device package includes forming a plurality of semiconductor light emitting parts, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a growth substrate, forming a partition structure having a plurality of light emitting windows on the growth substrate, filling each of the plurality of light emitting windows with a resin having a phosphor, and forming a plurality of wavelength conversion parts by planarizing a surface of the resin.

公开(公告)号：US10230021B2

公开(公告)日：2019-03-12

申请号：US15279864

申请日：2016-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Il Kim ,  Hyong Sik Won ,  Wan Tae Lim ,  Nam Goo Cha

IPC: H01L33/50 ,  H01L33/08 ,  H01L33/32 ,  H01L25/075 ,  H01L33/44 ,  H01L33/38 ,  H01L33/58 ,  H01L27/15

Abstract: A light emitting device package may include: a light emitting structure including a plurality of light emitting regions configured to emit light, respectively; a plurality of light adjusting layers formed above the light emitting regions to change characteristics of the light emitted from the light emitting regions, respectively; a plurality of electrodes configured to control the light emitting regions to emit the light, respectively; and an isolation insulating layer disposed between the light emitting regions to insulate the light emitting regions from one another, the isolation insulating layer forming a continuous structure with respect to the light emitting regions.

公开(公告)号：US10991857B2

公开(公告)日：2021-04-27

申请号：US16442870

申请日：2019-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wan Tae Lim ,  Sung Hyun Sim ,  Hanul Yoo ,  Yong Il Kim ,  Hye Seok Noh ,  Ji Hye Yeon

IPC: H01L33/50 ,  H01L25/075 ,  H01L27/15 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L33/44

Abstract: A method of fabricating a light emitting device package includes forming a plurality of semiconductor light emitting parts, each having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a growth substrate, forming a partition structure having a plurality of light emitting windows on the growth substrate, filling each of the plurality of light emitting windows with a resin having a phosphor, and forming a plurality of wavelength conversion parts by planarizing a surface of the resin.