公开(公告)号：US20090154458A1

公开(公告)日：2009-06-18

申请号：US12334043

申请日：2008-12-12

申请人： Pansoo KIM ,  In-Ki Lee ,  Dae-Ig Chang ,  Ho-Jin Lee ,  Namshik Kim ,  Bongseop Song ,  Hyuncheol Park

发明人： Pansoo KIM ,  In-Ki Lee ,  Dae-Ig Chang ,  Ho-Jin Lee ,  Namshik Kim ,  Bongseop Song ,  Hyuncheol Park

IPC分类号： H04L12/56

CPC分类号： H04L1/0071 ,  H04L1/0013 ,  H04L1/0068 ,  H04L1/08

摘要： Provided are repetition apparatus and method for repeatedly transmitting and receiving a data packet using different puncturing patterns to overcome signal attenuation and fading in a high speed mobile environment by repeatedly transmitting the duplicated information bit sequences with parity bits having a different puncturing pattern after channel-encoding the duplicated information bit. The repetition apparatus for repeatedly transmitting a data packet, includes a dual data generator for generating duplicated information bit sequences identical to each of information bit sequences to transmit, a channel encoder for dividing each of the duplicated information bit sequences into a plurality of information bits, and generating coded data packets alternately having a plurality of parity bits according to different puncturing patterns for each of the divided information bits, and a transmitter for transmitting the generated coded data packets sequentially.

摘要翻译： 提供了一种重复装置和方法，用于使用不同的打孔模式重复地发送和接收数据分组，以通过在频道编码之后重复地发送具有不同打孔图案的奇偶校验位的复制信息比特序列来克服高速移动环境中的信号衰减和衰落 重复的信息位。 用于重复发送数据分组的重复装置包括：双数据产生器，用于产生与要发送的每个信息比特序列相同的重复信息比特序列，用于将每个复制信息比特序列分成多个信息比特的信道编码器， 以及根据用于每个分割的信息比特的不同的删截图案，交替地生成具有多个奇偶校验位的编码数据分组，以及发送器，用于顺序地发送所生成的编码数据分组。

公开(公告)号：US20060115013A1

公开(公告)日：2006-06-01

申请号：US11184592

申请日：2005-07-19

申请人： Il Kim ,  Ho-Kyom Kim ,  Deock-Gil Oh ,  Ho-Jin Lee

发明人： Il Kim ,  Ho-Kyom Kim ,  Deock-Gil Oh ,  Ho-Jin Lee

IPC分类号： H04L23/02

CPC分类号： H04L27/0012

摘要： A blind modulation classification apparatus in a satellite communication system improves performance in non-ideal communication environment having frequency error and phase error, by reducing computational burden of test statistic and possibility of numerical error of hardware, with computation of likelihood for each stage independently. The blind modulation classification apparatus includes a plurality of likelihood computing units, each for computing a likelihood value of a received baseband signal for corresponding one of a plurality of modulation schemes; a maximum selecting and setting units for selecting the maximum among the calculated likelihood values and setting a flag corresponding to the maximum to ‘1’ and the other flags to ‘0’; a plurality of flag summing-up units for summing up the flags of the plurality of the modulation schemes; and a modulation scheme selecting unit for selecting the maximum among the summed-up values and selecting the modulation scheme corresponding to the selected value.

摘要翻译： 卫星通信系统中的盲调制分类装置通过减少测试统计量的计算负担和硬件的数值误差的可能性，通过独立地计算每个阶段的可能性来提高具有频率误差和相位误差的非理想通信环境中的性能。 盲调制分类装置包括多个似然度计算单元，每个似然运算单元用于计算多个调制方案中的相应一个的接收基带信号的似然值; 最大选择和设置单位，用于在所计算的似然值中选择最大值，并将与最大值相对应的标志设置为“1”，将其他标志设置为“0”; 多个标记求和单元，用于对多个调制方案的标志进行相加; 以及调制方式选择单元，用于选择累加值中的最大值，并选择与所选值对应的调制方案。

公开(公告)号：US20060100846A1

公开(公告)日：2006-05-11

申请号：US11182133

申请日：2005-07-14

申请人： Sang-Uk Lee ,  Jae-Hoon Kim ,  Ho-Jin Lee ,  Seong-Pal Lee

发明人： Sang-Uk Lee ,  Jae-Hoon Kim ,  Ho-Jin Lee ,  Seong-Pal Lee

IPC分类号： G06F9/45

CPC分类号： B64G7/00 ,  B64G1/24 ,  H04L67/38

摘要： A hybrid-type satellite simulation system and a method thereof are disclosed. The system includes: a satellite modeling unit including a satellite model and a software model having flight dynamics and space environment data; a satellite operation unit for generating a telecommand, transmitting the telecommand to the satellite simulation system, receiving simulation result as a telemetry, analyzing the simulation result and displaying the analyzed result; a simulator kernel for managing and controlling the satellite simulation system; a TCP/IP interface processing unit for performing an interface function of TCP/IP level between the simulator kernel and a satellite onboard computer; an onboard computer interface processing unit for performing an interface function between the satellite onboard computer and the TCP/IP interface processing unit; and a satellite onboard computer including flight software for controlling a satellite.

摘要翻译： 公开了一种混合型卫星仿真系统及其方法。 该系统包括：包括卫星模型和具有飞行动力学和空间环境数据的软件模型的卫星建模单元; 用于产生遥控的卫星操作单元，向卫星仿真系统发送遥控信号，接收模拟结果作为遥测，分析仿真结果并显示分析结果; 用于管理和控制卫星仿真系统的模拟器内核; TCP / IP接口处理单元，用于在模拟器内核和机载计算机之间执行TCP / IP级别的接口功能; 车载计算机接口处理单元，用于在卫星机载计算机和TCP / IP接口处理单元之间执行接口功能; 以及包含用于控制卫星的飞行软件的卫星机载计算机。

公开(公告)号：US08933561B2

公开(公告)日：2015-01-13

申请号：US13211574

申请日：2011-08-17

申请人： SeYoung Jeong ,  Hogeon Song ,  Chungsun Lee ,  Ho-Jin Lee

发明人： SeYoung Jeong ,  Hogeon Song ,  Chungsun Lee ,  Ho-Jin Lee

IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L23/481 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3128 ,  H01L24/04 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a semiconductor device. The semiconductor device may include a first semiconductor chip that includes a first through silicon via having a first protrusion height and a second through silicon via having a second protrusion height greater than the first protrusion height which are penetrating at least a portion of the first semiconductor chip, a second semiconductor chip may be electrically connected to the first through silicon via, and a third semiconductor chip may be electrically connected to the second through silicon via.

摘要翻译： 提供一种半导体器件。 半导体器件可以包括第一半导体芯片，其包括具有第一突起高度的第一至第二硅通孔以及具有大于第一突出高度的第二突出高度的第二穿透硅通孔，该第二突出高度穿过第一半导体芯片的至少一部分 ，第二半导体芯片可以电连接到第一通孔硅通孔，并且第三半导体芯片可以电连接到第二通孔硅通孔。

公开(公告)号：US08592991B2

公开(公告)日：2013-11-26

申请号：US13235369

申请日：2011-09-17

申请人： Ho-Jin Lee ,  Tae-Je Cho ,  Dong-Hyeon Jang ,  Ho-Geon Song ,  Se-Young Jeong ,  Un-Byoung Kang ,  Min-Seung Yoon

发明人： Ho-Jin Lee ,  Tae-Je Cho ,  Dong-Hyeon Jang ,  Ho-Geon Song ,  Se-Young Jeong ,  Un-Byoung Kang ,  Min-Seung Yoon

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/00

CPC分类号： H01L23/49844 ,  H01L21/76831 ,  H01L21/76844 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/525 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2924/15311

摘要： In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector.

摘要翻译： 在一个实施例中，半导体器件包括具有第一表面的半导体衬底和与第一表面相对的第二表面。 第二表面限定再分布沟槽。 基板具有贯穿其中的通孔。 半导体器件还包括设置在通孔中的贯通孔。 通孔可以包括依次形成在通孔的内壁上的通孔绝缘层，阻挡层。 通孔还可以包括邻近阻挡层的导电连接器。 半导体器件还包括形成在衬底的第二表面上的绝缘层图案。 绝缘层图案限定了暴露通孔的顶表面的区域的开口。 半导体器件包括设置在沟槽中并与通孔电连接的再分配层。 绝缘层图案与导电连接器的区域重叠。

公开(公告)号：US08492902B2

公开(公告)日：2013-07-23

申请号：US13049661

申请日：2011-03-16

申请人： Ho-Jin Lee ,  SeYoung Jeong ,  Jae-hyun Phee ,  Jung-Hwan Kim ,  Tae Hong Min

发明人： Ho-Jin Lee ,  SeYoung Jeong ,  Jae-hyun Phee ,  Jung-Hwan Kim ,  Tae Hong Min

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L21/76898 ,  H01L21/76831 ,  H01L23/481 ,  H01L25/105 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/00014

摘要： Provided is a semiconductor device. The semiconductor device may include a substrate and a stacked insulation layer on a sidewall of an opening which penetrates the substrate. The stacked insulation layer can include at least one first insulation layer and at least one second insulation layer whose dielectric constant is different than that of the first insulation layer. One insulation layer may be a polymer and one insulation layer may be a silicon based insulation layer. The insulation layers may be uniform in thickness or may vary as a distance from the substrate changes.

摘要翻译： 提供一种半导体器件。 半导体器件可以包括衬底和在穿透衬底的开口的侧壁上的层叠绝缘层。 层叠绝缘层可以包括至少一个第一绝缘层和至少一个第二绝缘层，其介电常数不同于第一绝缘层的介电常数。 一个绝缘层可以是聚合物，一个绝缘层可以是硅基绝缘层。 绝缘层的厚度可以是均匀的，或者可以随着离开衬底的距离而改变。

公开(公告)号：US08433293B2

公开(公告)日：2013-04-30

申请号：US12447886

申请日：2007-11-08

申请人： Ho-Jin Lee

发明人： Ho-Jin Lee

IPC分类号： H04L12/58

CPC分类号： H04L67/26 ,  H04L67/04 ,  H04L69/16 ,  H04L69/162 ,  H04L69/164

摘要： The present invention relates to an apparatus and method of providing a content push service, a mobile terminal, and a method of operating a mobile terminal. According to an exemplary embodiment of the present invention, a user datagram protocol (UDP) port is set between the mobile terminal and a content push service providing server. In addition, the mobile terminal drives an application that receives the content push service through the set user datagram protocol (UDP) port, by the request of the content push service providing server. The mobile terminal receives the content push service from the content push service providing server through the driven application. Accordingly, it is not necessary to select a specific identifier for each of existing applications and recognize a specific identifier for each node of the mobile communication network.

摘要翻译： 本发明涉及提供内容推送服务，移动终端和操作移动终端的方法的装置和方法。 根据本发明的示例性实施例，在移动终端和内容推送服务提供服务器之间设置用户数据报协议（UDP）端口。 此外，通过内容推送服务提供服务器的请求，移动终端通过设置的用户数据报协议（UDP）端口来驱动接收内容推送服务的应用。 移动终端通过驱动应用从内容推送服务提供服务器接收内容推送服务。 因此，不需要为每个现有应用选择特定的标识符并且识别移动通信网络的每个节点的特定标识符。

公开(公告)号：US08346962B2

公开(公告)日：2013-01-01

申请号：US13025911

申请日：2011-02-11

申请人： Jang-Won Lee ,  Ho-Jin Lee ,  Sang-Man Bak

发明人： Jang-Won Lee ,  Ho-Jin Lee ,  Sang-Man Bak

IPC分类号： G06F15/173

CPC分类号： H04L65/1006 ,  H04L29/06027 ,  H04L29/12367 ,  H04L29/12528 ,  H04L29/12556 ,  H04L61/2514 ,  H04L61/2575 ,  H04L61/2585 ,  H04L65/103 ,  H04L65/104 ,  H04L65/1043

摘要： Disclosed are examples of an interworking system and related methods. The interworking system can be configured to implement a session initiation protocol (SIP) message routing method that may include checking a transmitting subject and a transmission method of a SIP message, applying a network address translation based on the checked message's transmitting subject and its transmission method, and specifying the address of the node selected based on the checked message's transmitting subject in routing path information.

摘要翻译： 公开了互通系统和相关方法的示例。 互通系统可以被配置为实现会话发起协议（SIP）消息路由方法，该方法可以包括检查发送对象和SIP消息的发送方法，基于所检查的消息的发送对象及其发送方法应用网络地址转换 并且基于所检查的消息的发送对象在路由路径信息中指定选择的节点的地址。

公开(公告)号：US08289208B2

公开(公告)日：2012-10-16

申请号：US12664053

申请日：2008-05-08

申请人： Bon-Jun Ku ,  Do-Seob Ahn ,  Ho-Jin Lee

发明人： Bon-Jun Ku ,  Do-Seob Ahn ,  Ho-Jin Lee

IPC分类号： H04B7/185 ,  H04B1/00

CPC分类号： H04B7/10

摘要： Provided is a device for tracking polarizations. A receiving polarization tracking device includes a feeder for finding vertical and horizontal vector components by receiving vertical and horizontal polarizations, a polarization estimator for estimating distortion of polarizations using the vertical and horizontal vector components outputted from the feeder, a polarization controller for controlling amplitudes and phases of vertical and horizontal polarizations based on information about the estimated distortion from the polarization estimator and an output signal from the receiving polarization tracking device, and a combiner for combining the vertical and horizontal polarizations controlled from the polarization controller.

摘要翻译： 提供了用于跟踪偏振的装置。 接收偏振跟踪装置包括：通过接收垂直和水平偏振来发现垂直和水平矢量分量的馈线，用于使用从馈线输出的垂直和水平矢量分量估计极化失真的偏振估计器，用于控制幅度和相位的偏振控制器 基于关于来自极化估计器的估计失真的信息和来自接收偏振跟踪装置的输出信号的垂直和水平偏振的组合器，以及用于组合从偏振控制器控制的垂直和水平极化的组合器。

公开(公告)号：US08232644B2

公开(公告)日：2012-07-31

申请号：US13346191

申请日：2012-01-09

申请人： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

发明人： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

摘要： In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

摘要翻译： 在具有应力消除间隔物的半导体器件封装及其制造方法中，从芯片本体延伸的金属互连指状物提供芯片互连。 金属手指通过应力消除间隔物与芯片的主体隔离。 在一个示例中，这种隔离采取气隙的形式。 在另一个实例中，这种隔离采用弹性体材料的形式。 在这两种情况下，都避免了金属互连指和芯体之间的热膨胀系数的不匹配，从而减轻了与开裂和分层相关的问题，从而提高了器件的产量和器件的可靠性。