公开(公告)号：US20100052494A1

公开(公告)日：2010-03-04

申请号：US12329770

申请日：2008-12-08

申请人： Hui Ching FENG ,  Kuo-Chin Huang ,  Shyi-Ming Pan ,  Hung-Li Pan

发明人： Hui Ching FENG ,  Kuo-Chin Huang ,  Shyi-Ming Pan ,  Hung-Li Pan

IPC分类号： H01J1/00

CPC分类号： H01L25/0753 ,  H01L27/156 ,  H01L33/62 ,  H01L2224/4847 ,  H01L2224/49107 ,  Y10S257/918

摘要： An alternating current (AC) light emitting device is revealed. The AC light emitting device includes a substrate and a plurality of light emitting units arranged on the substrate. The light emitting unit consists of a first semiconductor layer, a light emitting layer, a second semiconductor layer, at least one electrode and at least one second electrode respectively arranged on the first semiconductor layer and the second semiconductor layer from bottom to top. The plurality of light emitting units is coupled to at least one adjacent light emitting unit by a plurality of conductors. By the plurality of conductors that connect light emitting units with at least one adjacent light emitting unit, an open circuit will not occur in the AC light emitting device once one of the conductors is broken.

摘要翻译： 发现交流（AC）发光器件。 AC发光装置包括基板和布置在基板上的多个发光单元。 发光单元由第一半导体层，发光层，第二半导体层，至少一个电极和至少一个第二电极组成，第一半导体层，第一半导体层和第二半导体层分别从底部到顶部布置。 多个发光单元通过多个导体耦合到至少一个相邻的发光单元。 通过将发光单元与至少一个相邻的发光单元连接的多个导体，一旦导体断开，AC发光器件将不会发生开路。

公开(公告)号：US20100032690A1

公开(公告)日：2010-02-11

申请号：US12349055

申请日：2009-01-06

申请人： Hui Ching Feng ,  Kuo-Chin Huang ,  Shyi-Ming Pan ,  Hung-Li Pan ,  Yin-Cheng Chu

发明人： Hui Ching Feng ,  Kuo-Chin Huang ,  Shyi-Ming Pan ,  Hung-Li Pan ,  Yin-Cheng Chu

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/14 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention is related to a light emitting device with an insulating layer, which comprises a transparent substrate, a first light emitting unit, a second light emitting unit, an insulating layer and a conducting layer. The first light emitting unit and the second light emitting unit are set up on the transparent substrate, wherein the second light emitting unit has an appearance of a stair structure. The insulating layer is set between the first and the second light emitting units. The conducting layer is on the insulating layer in order to conduct the first and the second light emitting units. Because of the appearance of the stair structure of the second light emitting unit, improving the cladding efficiency of the insulating layer, further improving the insulating efficiency of the insulating layer and avoiding the insulating layer loosing and the leakage between the first and the second light emitting units.

摘要翻译： 本发明涉及具有绝缘层的发光器件，其包括透明衬底，第一发光单元，第二发光单元，绝缘层和导电层。 第一发光单元和第二发光单元设置在透明基板上，其中第二发光单元具有楼梯结构的外观。 绝缘层设置在第一和第二发光单元之间。 导电层位于绝缘层上，以便传导第一和第二发光单元。 由于第二发光单元的楼梯结构的出现，提高绝缘层的包层效率，进一步提高绝缘层的绝缘效率，避免绝缘层松动以及第一和第二发光二极管之间的泄漏 单位。

公开(公告)号：US20070272930A1

公开(公告)日：2007-11-29

申请号：US11308926

申请日：2006-05-26

申请人： Huan-Che Tseng ,  Way-Jze Wen ,  Shyi-Ming Pan

发明人： Huan-Che Tseng ,  Way-Jze Wen ,  Shyi-Ming Pan

IPC分类号： H01L33/00

CPC分类号： H01L33/22 ,  H01L33/60 ,  H01L2224/16225

摘要： A light-emitting diode package (LED package) includes a LED and a carrier. The LED includes a substrate, a semiconductor layer, a first electrode and a second electrode. The semiconductor layer is located on a surface of the substrate and has a rough surface. The semiconductor layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer and a light-emitting layer disposed between the two doped semiconductor layers. The first electrode and the second electrode are disposed on and electrically coupled the first-type doped semiconductor layer and the second-type doped semiconductor layer, respectively. The carrier has a rough carrying surface and includes a first contact pad and a second contact pad disposed on the rough carrying surface. The first electrode and the second electrode of the LED face the carrier and are electrically coupled to the first contact pad and a second contact pad, respectively.

摘要翻译： 发光二极管封装（LED封装）包括LED和载体。 LED包括基板，半导体层，第一电极和第二电极。 半导体层位于基板的表面上，具有粗糙的表面。 半导体层包括第一掺杂半导体层，第二掺杂半导体层和设置在两个掺杂半导体层之间的发光层。 第一电极和第二电极分别设置在第一掺杂半导体层和第二掺杂半导体层上并电耦合。 载体具有粗糙的承载表面，并且包括设置在粗糙承载表面上的第一接触焊盘和第二接触焊盘。 LED的第一电极和第二电极面向载体并且分别电耦合到第一接触焊盘和第二接触焊盘。

公开(公告)号：US20070141749A1

公开(公告)日：2007-06-21

申请号：US11311243

申请日：2005-12-20

申请人： Yi-Fong Lin ,  Shyi-Ming Pan ,  Way-Jze Wen ,  Fen-Ren Chen

发明人： Yi-Fong Lin ,  Shyi-Ming Pan ,  Way-Jze Wen ,  Fen-Ren Chen

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L24/28 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00

摘要： A die attachment method for LED chips and the structure thereof are disclosed. While attaching a LED chip to a substrate, surface of two bonding material is ionized by ultrasonic waves so as to make the attachment of a LED chip to a substrate is under low temperature operating condition and having better heat dissipation structure.

摘要翻译： 公开了一种LED芯片的芯片附着方法及其结构。 当将LED芯片附着到基板上时，通过超声波将两个接合材料的表面电离，以使LED芯片与基板的连接处于低温工作状态并具有更好的散热结构。

公开(公告)号：US08698175B2

公开(公告)日：2014-04-15

申请号：US12547571

申请日：2009-08-26

申请人： Wei-Kang Cheng ,  Jia-Lin Li ,  Shyi-Ming Pan ,  Kuo-Chin Huang

发明人： Wei-Kang Cheng ,  Jia-Lin Li ,  Shyi-Ming Pan ,  Kuo-Chin Huang

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/507 ,  H01L33/508 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a light-emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.

摘要翻译： 本发明涉及一种发光二极管（LED）。 LED包括LED管芯，一个或多个金属焊盘和荧光层。 本发明的特征包括为了方便后续的布线和包装过程，将金属垫留下来露出。 此外，本发明提供的LED是单一的混合芯片，其可以直接包装而不需要在包装胶上涂布荧光粉。 由于荧光层和包装胶不是同时处理并且具有不同的材料，所以可以有效地降低封装LED中的应力问题。

公开(公告)号：US08658443B2

公开(公告)日：2014-02-25

申请号：US12905258

申请日：2010-10-15

申请人： Wei-Kang Cheng ,  Yu-Chih Lin ,  Han-Zhong Liao ,  Yi-Sheng Ting ,  Shyi-Ming Pan

发明人： Wei-Kang Cheng ,  Yu-Chih Lin ,  Han-Zhong Liao ,  Yi-Sheng Ting ,  Shyi-Ming Pan

IPC分类号： H01L33/50

CPC分类号： H01L33/505 ,  H01L2224/16225 ,  H01L2933/0041

摘要： A method for manufacturing light emitting device is provided. Firstly, provide a substrate. Then arrange a light emitting unit on the substrate. Next form at least one electrode and arrange at least one protective layer on the electrode. The protective layer is to prevent a phosphor layer following formed on the light emitting unit from covering the electrode. After forming the phosphor layer, flatten the phosphor layer and the protective layer. A part of the phosphor layer over the protective layer is removed. Thus the electrode is not affected by the phosphor layer and conductivity of the electrode is improved to resolve phosphor thickness and uniformity problems of the light emitting device. Therefore, the thickness of the light emitting device with LED is effectively reduced and stability of white color temperature control is significantly improved.

摘要翻译： 提供一种制造发光器件的方法。 首先，提供基板。 然后在基板上布置发光单元。 接下来形成至少一个电极并且在电极上布置至少一个保护层。 保护层是为了防止在发光单元上形成的荧光体层覆盖电极。 在形成荧光体层之后，使荧光体层和保护层平坦化。 去除保护层上的磷光体层的一部分。 因此，电极不受磷光体层的影响，电极的导电性得到改善，以解决发光器件的荧光体厚度和均匀性问题。 因此，具有LED的发光装置的厚度被有效地降低，白色温度控制的稳定性显着提高。

公开(公告)号：US20100270570A1

公开(公告)日：2010-10-28

申请号：US12558849

申请日：2009-09-14

申请人： Wei-Kang CHENG ,  Yi-Sheng Ting ,  Shyi-Ming Pan

发明人： Wei-Kang CHENG ,  Yi-Sheng Ting ,  Shyi-Ming Pan

IPC分类号： H01L33/00

CPC分类号： H01L33/44 ,  H01L33/20 ,  H01L33/38 ,  H01L33/50

摘要： The present invention provides a light emitting element comprising a first substrate, a light emitting unit disposed on the first substrate, at least a selective reflection layer disposed on an emitting side of the light emitting unit so that a light of a first color emitted from the light emitting unit passes through the selective reflection layer, and a fluorescent layer disposed on the emitting side of the light emitting unit and converting the light of the first color passing therethrough into a light of a second color, wherein a light of a mixed color is formed by the lights of the first and second color and only the light of the second color is reflected by the selective reflection layer.

摘要翻译： 本发明提供一种发光元件，其包括第一基板，设置在第一基板上的发光单元，至少设置在发光单元的发射侧的选择反射层，使得从第一基板发射的第一颜色的光从 发光单元通过选择反射层，以及设置在发光单元的发射侧的荧光层，并将通过其的第一颜色的光转换为第二颜色的光，其中混合的光是 由第一和第二颜色的光形成，并且仅第二颜色的光被选择性反射层反射。

公开(公告)号：US20090267095A1

公开(公告)日：2009-10-29

申请号：US12234652

申请日：2008-09-20

申请人： Wei-Kang CHENG ,  Shyi-Ming Pan ,  Cheng-Kuo Huang ,  Yin-Cheng Chu ,  Kuo-Chin Huang

发明人： Wei-Kang CHENG ,  Shyi-Ming Pan ,  Cheng-Kuo Huang ,  Yin-Cheng Chu ,  Kuo-Chin Huang

IPC分类号： H01L33/00

CPC分类号： H01L33/46 ,  H01L33/64

摘要： The present invention provides a light-emitting device with a reflection layer and the structure of the reflection layer. The reflection layer comprises a variety of dielectric materials. The reflection layer includes a plurality of dielectric layers. The materials of the plurality of dielectric layers have two or more types with two or more thicknesses, except for the combination of two material types and two thicknesses, for forming the reflection layer with a variety of structures. The reflection layer according to the present invention can be applied to light-emitting diodes of various types to form new light-emitting devices. Owing to its excellent reflectivity, the reflection layer can improve light-emitting efficiency of the light-emitting devices.

摘要翻译： 本发明提供一种具有反射层的发光装置和反射层的结构。 反射层包括各种介电材料。 反射层包括多个电介质层。 除了两种材料类型和两种厚度的组合之外，多个电介质层的材料具有两种或更多种类型，具有两种或更多种厚度，用于形成具有各种结构的反射层。 根据本发明的反射层可以应用于各种类型的发光二极管，以形成新的发光器件。 由于反射率优异，因此能够提高发光元件的发光效率。

公开(公告)号：US20070170596A1

公开(公告)日：2007-07-26

申请号：US11339622

申请日：2006-01-26

申请人： Way-Jze Wen ,  Yi-Fong Lin ,  Shyi-Ming Pan ,  Fen Chien

发明人： Way-Jze Wen ,  Yi-Fong Lin ,  Shyi-Ming Pan ,  Fen Chien

IPC分类号： H01L23/52

CPC分类号： H01L33/405 ,  H01L33/32 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/3025 ,  H01L2924/00014

摘要： A flip-chip light emitting diode with high light-emitting efficiency is disclosed. The LED includes a transparent conductive layer, an oxide layer, a reflective metal layer, a conductive layer, and a protective diffusion layer sequentially disposed over a p-type semiconductor layer. Thereby, light emitting from a light-emitting layer toward the p-type semiconductor layer is reflected and penetrating a transparent substrate and emitting outwards. Thus the problem of light shielded from the flip-chip type LED is solved and the light-emitting efficiency is improved. Furthermore, the present invention disposes the LED chip in a face-down orientation on a conductive substrate by flip-chip technology so as to enhance heat-dissipation efficiency of the LED.

摘要翻译： 公开了一种具有高发光效率的倒装芯片发光二极管。 LED包括依次设置在p型半导体层上的透明导电层，氧化物层，反射金属层，导电层和保护性扩散层。 由此，从发光层朝向p型半导体层发光的光被反射并透过透明基板并向外发射。 因此解决了从倒装型LED遮光的问题，提高了发光效率。 此外，本发明通过倒装芯片技术将LED芯片以面朝下的方式配置在导电基板上，从而提高LED的散热效率。

公开(公告)号：US20060038195A1

公开(公告)日：2006-02-23

申请号：US11254691

申请日：2005-10-21

申请人： Shyi-Ming Pan ,  Jenq-Dar Tsay ,  Ru-Chin Tu ,  Jung-Tsung Hsu

发明人： Shyi-Ming Pan ,  Jenq-Dar Tsay ,  Ru-Chin Tu ,  Jung-Tsung Hsu

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L33/32

摘要： The specification discloses a light-emitting diode and the corresponding manufacturing method. A GaN thick film with a slant surface is formed on the surface of a substrate. An epitaxial slant surface is naturally formed using the properties of the GaN epitaxy. An LED structure is grown on the GaN thick film to form an LED device. This disclosed method and device can simplify the manufacturing process. The invention further uses the GaN thick film epitaxial property to make various kinds of LED chips with multiple slant surfaces and different structures. Since the surface area for emitting light on the chip increases and the multiple slant surfaces reduce the chances of total internal reflections, the light emission efficiency of the invention is much better than the prior art.

摘要翻译： 该说明书公开了一种发光二极管及相应的制造方法。 在衬底的表面上形成具有倾斜表面的GaN厚膜。 使用GaN外延的性质自然地形成外延倾斜表面。 在GaN厚膜上生长LED结构以形成LED器件。 该公开的方法和装置可以简化制造过程。 本发明进一步使用GaN厚膜外延性制造具有多个倾斜表面和不同结构的各种LED芯片。 由于用于在芯片上发射光的表面积增加并且多个倾斜表面减小了内部反射的机会，所以本发明的发光效率比现有技术好得多。