公开(公告)号：US10734254B2

公开(公告)日：2020-08-04

申请号：US16108464

申请日：2018-08-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Sheng Lin ,  Hsin-Hsien Lu

IPC: H01L21/67 ,  B24B37/34 ,  H01L21/02

Abstract: A method of processing a wafer is disclosed. The method includes, in some embodiments, causing a relative movement between a cleaning brush and a wafer. During the relative movement, a planar cleaning surface of the cleaning brush is brought into contact with a surface of the wafer to remove contaminants from the surface of the wafer. A first size of the cleaning brush, in a plan view, is larger than a second size of the wafer in the plan view.

公开(公告)号：US10377013B2

公开(公告)日：2019-08-13

申请号：US15459192

申请日：2017-03-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Sheng Lin ,  Hsin-Hsien Lu

IPC: B24B37/32 ,  B24B37/30 ,  B24B37/04 ,  B24B37/10 ,  B24B37/20

Abstract: Some embodiments relate to a method of using a polishing system. In this method, a wafer is secured in a carrier head. The carrier head includes a housing, which includes a retaining ring recess, enclosing the wafer. A retaining ring is positioned in the retaining ring recess. The retaining ring surrounds the wafer, and has a hardness ranging from about 5 shore A to about 80 shore D. The wafer is pressed against a polishing pad, and at least one of the carrier head or the polishing pad is moved relative to the other.

公开(公告)号：US20170352548A1

公开(公告)日：2017-12-07

申请号：US15686922

申请日：2017-08-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Kuei Liu ,  Teng-Chun Tsai ,  Kuo-Yin Lin ,  Shen-Nan Lee ,  Yu-Wei Chou ,  Kuo-Cheng Lien ,  Chang-Sheng Lin ,  Chih-Chang Hung ,  Yung-Cheng Lu

IPC: H01L21/3105 ,  H01L21/84 ,  H01L21/28 ,  H01L21/3213 ,  H01L21/027 ,  H01L21/311 ,  H01L29/66 ,  H01L21/8238

CPC classification number: H01L21/31055 ,  H01L21/0273 ,  H01L21/0274 ,  H01L21/28008 ,  H01L21/31058 ,  H01L21/31116 ,  H01L21/31133 ,  H01L21/31138 ,  H01L21/3213 ,  H01L21/32139 ,  H01L21/823821 ,  H01L21/845 ,  H01L29/66545

Abstract: A method of manufacturing an integrated circuit device is provided. A first feature, which has a first susceptibility to damage by chemical mechanical processing (CMP), is formed at a first height as measured from an upper surface of the substrate. A second feature, which has a second susceptibility to damage by the CMP, is formed at a second height as measured from the upper surface of the substrate and is laterally spaced from the first feature by a recess. The second height is greater than the first height, and the second susceptibility is less than the first susceptibility. A sacrificial coating is formed in the recess over an uppermost surface of the first feature. CMP is performed to remove a first portion of the sacrificial coating and expose an upper surface of the second feature while leaving a second portion of the sacrificial coating in place over the first feature.

公开(公告)号：US20160099157A1

公开(公告)日：2016-04-07

申请号：US14967741

申请日：2015-12-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Kuei Liu ,  Teng-Chun Tsai ,  Kuo-Yin Lin ,  Shen-Nan Lee ,  Yu-Wei Chou ,  Kuo-Cheng Lien ,  Chang-Sheng Lin ,  Chih-Chang Hung ,  Yung-Cheng Lu

IPC: H01L21/3105 ,  H01L29/06 ,  H01L21/02 ,  H01L21/311 ,  H01L21/308

CPC classification number: H01L21/31055 ,  H01L21/02282 ,  H01L21/28123 ,  H01L21/3086 ,  H01L21/31058 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/32136 ,  H01L21/823821 ,  H01L21/845 ,  H01L29/0692 ,  H01L29/66545 ,  H01L29/66795

Abstract: The present disclosure provides a method of manufacturing an integrated circuit device in some embodiments. In the method, a semiconductor substrate is processed through a series of operations to form a topographically variable surface over the semiconductor substrate. The topographically variable surface varies in height across the semiconductor substrate. A polymeric bottom anti-reflective coating (BARC) is provided over the topographically variable surface. Chemical mechanical polishing is performed to remove a first portion of the BARC, and etching effectuates a top-down recessing of the BARC.

Abstract translation: 本公开提供了在一些实施例中制造集成电路器件的方法。 在该方法中，通过一系列操作来处理半导体衬底，以在半导体衬底上形成拓扑可变表面。 地形可变表面在半导体衬底上的高度变化。 在地形可变表面上提供聚合物底部抗反射涂层（BARC）。 执行化学机械抛光以去除BARC的第一部分，并且蚀刻实现BARC的自上而下的凹陷。

公开(公告)号：US09236446B2

公开(公告)日：2016-01-12

申请号：US14208697

申请日：2014-03-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Kuei Liu ,  Teng-Chun Tsai ,  Kuo-Yin Lin ,  Shen-Nan Lee ,  Yu-Wei Chou ,  Kuo-Cheng Lien ,  Chang-Sheng Lin ,  Chih-Chang Hung ,  Yung-Cheng Lu

IPC: H01L21/302 ,  H01L21/461 ,  H01L29/66 ,  H01L21/3105 ,  H01L21/311 ,  H01L21/02

CPC classification number: H01L21/31055 ,  H01L21/02282 ,  H01L21/28123 ,  H01L21/3086 ,  H01L21/31058 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/32136 ,  H01L21/823821 ,  H01L21/845 ,  H01L29/0692 ,  H01L29/66545 ,  H01L29/66795

Abstract: An IC device manufacturing process effectuates a planar recessing of material that initially varies in height across a substrate. The method includes forming a bottom anti-reflective coating (BARC), baking to induce cross-linking in the BARC, CMP to remove a first portion of the BARC and form a planar surface, then plasma etching to effectuate a planar recessing of the BARC. The plasma etching can have a low selectivity between the BARC and the material being recessed, whereby the BARC and the material are recessed simultaneously. Any of the material above a certain height is removed. Structures that are substantially below that certain height can be protected from contamination and left intact. The method can be particularly effective when an abrasive used during CMP forms ester linkages with the BARC.

Abstract translation: IC器件制造工艺实现了最初在衬底上高度变化的材料的平面凹陷。 该方法包括形成底部抗反射涂层（BARC），烘焙以在BARC，CMP中引发交联以除去BARC的第一部分并形成平坦表面，然后进行等离子体蚀刻以实现BARC的平面凹陷 。 等离子体蚀刻可以在BARC和被凹入的材料之间具有低选择性，由此BARC和材料同时凹陷。 任何高于一定高度的材料都被去除。 可以保护基本上低于该特定高度的结构免受污染并保持不变。 当CMP中使用的研磨剂与BARC形成酯键时，该方法可以是特别有效的。

公开(公告)号：US20150235858A1

公开(公告)日：2015-08-20

申请号：US14181814

申请日：2014-02-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shen-Nan Lee ,  Teng-Chun Tsai ,  Hsin-Hsien Lu ,  Chang-Sheng Lin ,  Kuo-Cheng Lien ,  Kuo-Yin Lin ,  Wen-Kuei Liu ,  Yu-Wei Chou

IPC: H01L21/306 ,  H01L21/66 ,  B24B21/00 ,  H01L21/02 ,  B24B9/06 ,  B24B7/22

CPC classification number: H01L21/0209 ,  B24B7/228 ,  B24B9/065 ,  B24B21/002 ,  H01L21/02043 ,  H01L21/02057 ,  H01L21/02087 ,  H01L21/02096 ,  H01L21/30625 ,  H01L21/67092 ,  H01L21/67288 ,  H01L22/12 ,  H01L22/20

Abstract: A wafer polishing process includes polishing a central area on the back side of a wafer, polishing a peripheral area on the back side of the wafer, buffing the central area, and buffing the peripheral area. The process can significantly reduce scratch-related wafer breakage, can correct focus spots on wafers, and can replace cleaning processes that use chemical etchants. Polishing and buffing can include polishing and buffing the bevel region. Further improvements include polishing with abrasive pads having a soft backing, polishing or buffing with pads having relatively soft abrasive particles, polishing or buffing with abrasive pads made from abrasive particles that have been sorted and selected for regularity of shape, irrigating the surface being polished or buffed with an aqueous solution that includes a friction-reducing agent, and buffing with abrasive pads having 20k or finer grit or non-abrasive pads.

Abstract translation: 晶片抛光工艺包括抛光晶片背面的中心区域，抛光晶片背面的周边区域，抛光中心区域，以及抛光周边区域。 该过程可以显着减少划痕相关的晶片断裂，可以校正晶片上的焦点，并可以替代使用化学蚀刻剂的清洗工艺。 抛光和抛光可以包括抛光和抛光斜面区域。 进一步的改进包括用具有柔软背衬的研磨垫，抛光或抛光，具有相对较软的磨料颗粒的垫，抛光或抛光，其中由磨料颗粒制成的研磨垫已被分选并选择成规则形状，冲洗正被抛光的表面 用包含减摩剂的水溶液抛光，并用具有20k或更细砂粒或非研磨垫的研磨垫进行抛光。

公开(公告)号：US20150306737A1

公开(公告)日：2015-10-29

申请号：US14259646

申请日：2014-04-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chang-Sheng Lin

IPC: B24D3/34 ,  B24B37/24

CPC classification number: B24D3/346 ,  B24B37/24

Abstract: The present disclosure relates to a radiance decomposable CMP pad, and an associated method to refresh the CMP pad. In some embodiments, the CMP pad has a polymer layer and some macro pores disposed therein. A monomer of the polymer layer has a photoactive compound unit.

Abstract translation: 本公开涉及一种可辐射分解CMP焊盘以及用于刷新CMP焊盘的相关方法。 在一些实施例中，CMP垫具有聚合物层，并且其中布置有一些宏观孔。 聚合物层的单体具有光活性化合物单元。

公开(公告)号：US20150263132A1

公开(公告)日：2015-09-17

申请号：US14208697

申请日：2014-03-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Kuei Liu ,  Teng-Chun Tsai ,  Kuo-Yin Lin ,  Shen-Nan Lee ,  Yu-Wei Chou ,  Kuo-Cheng Lien ,  Chang-Sheng Lin ,  Chih-Chang Hung ,  Yung-Cheng Lu

IPC: H01L29/66 ,  H01L21/311 ,  H01L21/02 ,  H01L21/3105

CPC classification number: H01L21/31055 ,  H01L21/02282 ,  H01L21/28123 ,  H01L21/3086 ,  H01L21/31058 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/32136 ,  H01L21/823821 ,  H01L21/845 ,  H01L29/0692 ,  H01L29/66545 ,  H01L29/66795

Abstract: An IC device manufacturing process effectuates a planar recessing of material that initially varies in height across a substrate. The method includes forming a bottom anti-reflective coating (BARC), baking to induce cross-linking in the BARC, CMP to remove a first portion of the BARC and form a planar surface, then plasma etching to effectuate a planar recessing of the BARC. The plasma etching can have a low selectivity between the BARC and the material being recessed, whereby the BARC and the material are recessed simultaneously. Any of the material above a certain height is removed. Structures that are substantially below that certain height can be protected from contamination and left intact. The method can be particularly effective when an abrasive used during CMP forms ester linkages with the BARC.

Abstract translation: IC器件制造工艺实现了最初在衬底上高度变化的材料的平面凹陷。 该方法包括形成底部抗反射涂层（BARC），烘烤以在BARC，CMP中引发交联以除去BARC的第一部分并形成平坦表面，然后进行等离子体蚀刻以实现BARC的平面凹陷 。 等离子体蚀刻可以在BARC和被凹入的材料之间具有低选择性，由此BARC和材料同时凹陷。 任何高于一定高度的材料都被去除。 可以保护基本上低于该特定高度的结构免受污染并保持不变。 当CMP中使用的研磨剂与BARC形成酯键时，该方法可以是特别有效的。