公开(公告)号：US08445807B2

公开(公告)日：2013-05-21

申请号：US13233303

申请日：2011-09-15

申请人： Koichi Hashizume ,  Masakazu Yoshimoto ,  Nobuyuki Washio ,  Yoichiro Kimoto ,  Hiroshi Sato ,  Isao Izui

发明人： Koichi Hashizume ,  Masakazu Yoshimoto ,  Nobuyuki Washio ,  Yoichiro Kimoto ,  Hiroshi Sato ,  Isao Izui

IPC分类号： B23H7/08 ,  B23H1/04 ,  B23H1/06

CPC分类号： B21C1/003 ,  B21C9/00 ,  B23H7/08 ,  Y10T428/12903

摘要： A wire material having a copper-zinc alloy layer, which is formed by action of thermal diffusion, and a zinc layer on its circumference surface is subjected to processes, including from a step of drawing the wire material to a step of reducing the diameter of the product, to reliably crash the copper-zinc alloy layer into particles. The particles are embedded in the circumference surface of a core to integrate the diffusion alloy layer and zinc layer with the core and prevent the diffusion alloy layer and zinc layer from falling off from the core. In addition, in order to cover cracks formed in the copper-zinc alloy layer during wire drawing with a zinc thin film, wire drawing is performed at temperatures appropriate for maintaining good malleability and ductility of zinc.

摘要翻译： 对具有由热扩散作用形成的铜 - 锌合金层和其周面上的锌层的线材进行处理，其中包括从将线材拉丝至减小直径的步骤 该产品可以将铜 - 锌合金层可靠地碰撞成颗粒。 将颗粒嵌入芯的圆周表面，使扩散合金层和锌层与芯体结合，防止扩散合金层和锌层从芯脱落。 此外，为了覆盖用锌薄膜拉丝时在铜 - 锌合金层中形成的裂纹，在适于维持锌的良好延展性和延展性的温度下进行拉丝。

公开(公告)号：US07056448B2

公开(公告)日：2006-06-06

申请号：US10441588

申请日：2003-05-20

申请人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiichiro Nakao ,  Osamu Masuyama ,  Hidenori Tsuji

发明人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiichiro Nakao ,  Osamu Masuyama ,  Hidenori Tsuji

IPC分类号： C23F1/00

CPC分类号： C23C18/161 ,  C23C18/1651 ,  C23C18/30 ,  H05K3/181 ,  Y10T29/49121 ,  Y10T29/49156

摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.

摘要翻译： 形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。 作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。 银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。 电路图案可以形成在印刷线路板上。

公开(公告)号：US20050258134A1

公开(公告)日：2005-11-24

申请号：US10441588

申请日：2003-05-20

申请人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiichiro Nakao ,  Osamu Masuyama ,  Hidenori Tsuji

发明人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiichiro Nakao ,  Osamu Masuyama ,  Hidenori Tsuji

IPC分类号： C23C18/28 ,  B05D3/10 ,  B05D5/12 ,  C23C18/16 ,  C23C18/30 ,  C23C18/38 ,  H01B13/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/46

CPC分类号： C23C18/161 ,  C23C18/1651 ,  C23C18/30 ,  H05K3/181 ,  Y10T29/49121 ,  Y10T29/49156

摘要： A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.

摘要翻译： 形成电路图案的方法至少包括使非导体进行无电镀铜以形成铜膜的步骤（a）和蚀刻铜膜以形成电路图案的步骤（b）。 作为无电镀铜的催化剂，使用银胶体溶液作为至少以下的必要成分：（I）银胶体粒子; （II）一种或多种具有电位的金属离子，其可以将银离子还原成溶液中的金属银，和/或在还原银离子时离子氧化导致的离子; 和（III）一种或多种羟基羧酸盐，缩合磷酸盐和/或胺羧酸盐离子。 银胶体颗粒（I）由具有可以将银离子还原成金属银的电位的金属的离子（II）产生。 电路图案可以形成在印刷线路板上。

公开(公告)号：US5618404A

公开(公告)日：1997-04-08

申请号：US442535

申请日：1995-05-16

申请人： Yoshiaki Okuhama ,  Seishi Masaki ,  Takao Takeuchi ,  Yoshiharu Matsuda ,  Masakazu Yoshimoto

发明人： Yoshiaki Okuhama ,  Seishi Masaki ,  Takao Takeuchi ,  Yoshiharu Matsuda ,  Masakazu Yoshimoto

IPC分类号： C25B3/00 ,  C25D3/60 ,  C25B1/00

CPC分类号： C25B3/00 ,  C25D3/60

摘要： An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode and a plurality of cathodes in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anion-exchange membranes into anode and cathode chambers. The electrolytic solution is a solution of an organic sulfonic acid, and the anode is lead or tin. The process reduces contents of radioisotopes such as uranium and thorium to a level of less than 50 ppb, and therefore the coatings formed by solder plating using the lead and tin salts in accordance with the invention show radioactive .alpha. particle counts of less than 0.1 CPH/cm.sup.2.

摘要翻译： 一种用于生产铅和锡磺酸盐的电解方法，其包括向电解池中的阳极和多个阴极施加DC电压，从而将铅或锡溶解在电解液中。 电解池被阳离子交换膜和阴离子交换膜分隔成阳极室和阴极室。 电解液是有机磺酸的溶液，阳极是铅或锡。 该方法将诸如铀和钍的放射性同位素的含量降低到低于50ppb的水平，因此根据本发明使用铅和锡盐的焊料镀覆形成的涂层显示出小于0.1CPH / cm2。

公开(公告)号：US5613913A

公开(公告)日：1997-03-25

申请号：US418029

申请日：1995-04-06

申请人： Shinichi Ikematsu ,  Hiroshi Kawakami ,  Satoshi Nakano ,  Tatsuya Kouno ,  Keisuke Hiromi ,  Masakazu Yoshimoto

发明人： Shinichi Ikematsu ,  Hiroshi Kawakami ,  Satoshi Nakano ,  Tatsuya Kouno ,  Keisuke Hiromi ,  Masakazu Yoshimoto

IPC分类号： F41G3/26 ,  A63F9/02 ,  A63F13/00 ,  F41J7/06 ,  F41J11/00 ,  A63F9/24

CPC分类号： A63F9/0291 ,  F41H7/005 ,  F41J7/04 ,  A63F2300/8076

摘要： In a method for developing attractions in a shooting game system with which players can experience gun fights between the targets and players themselves. The shooting game system can be easily installed in a short period anywhere and game quality can be adjusted in the most suitable state. The method for developing attractions includes the steps of producing various types of targets by combining fundamental mechanisms, each of which is used for a unit operation; incorporating unified control equipment and peripherals in the produced target to make them a target unit; embedding the above-described target unit in a target unit case so as to serve also as an indoor partition and posts; and arranging the embedded target units in the designated rooms of the attraction hall. The method for developing attractions alternatively includes inputting information regarding the arrangement of the targets, displaying the arrangement on a screen, and the interaction between the targets and the players. This method thereby allows monitor and control of game quality.

摘要翻译： 一种用于在射击游戏系统中开发景点的方法，玩家可以通过这种方法在目标和玩家本身之间体验枪战。 射击游戏系统可以在短时间内轻松安装，游戏质量可以在最合适的状态下进行调整。 用于开发景点的方法包括通过组合基本机制来生产各种类型的目标的步骤，每个基本机制用于单位操作; 将统一的控制设备和外围设备结合在一起，使其成为目标单位; 将上述目标单元嵌入到目标单元壳体中，以用作室内分区和柱; 并将嵌入的目标单元布置在吸引馆的指定房间中。 用于开发景点的方法或者包括输入关于目标的布置的信息，在屏幕上显示布置以及目标和玩家之间的相互作用。 因此，该方法允许监视和控制游戏质量。

公开(公告)号：US07166152B2

公开(公告)日：2007-01-23

申请号：US10636447

申请日：2003-08-07

申请人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Kim Dong Hyun ,  Shingo Kitamura ,  Seiichiro Nakao ,  Hidenori Tsuji ,  Hidemi Nawafune

发明人： Yoshiaki Okuhama ,  Keigo Obata ,  Masakazu Yoshimoto ,  Kim Dong Hyun ,  Shingo Kitamura ,  Seiichiro Nakao ,  Hidenori Tsuji ,  Hidemi Nawafune

IPC分类号： C23C18/28

CPC分类号： C23C18/28

摘要： A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.

摘要翻译： 提供了一种用于提供无电镀的催化剂的预处理溶液和使用该溶液的预处理方法。 所述预处理溶液包含至少含有以下成分（I），（II）和（III）作为必要成分的银胶体溶液：（I）银胶体粒子，（II）一种或多种离子，选自 具有可以将银离子还原成溶液中的金属银的金属和在银离子还原时被氧化的离子的金属，和（III）一种或多种选自羟基羧酸根离子，缩合磷酸根离子 和胺羧酸根离子，银胶体粒子（I）由金属（II）的离子产生，具有可以将银离子还原成金属银的电位。 当通过使用预处理溶液预处理要镀覆的物体时，实现无电镀的有效催化剂。

公开(公告)号：US20060113006A1

公开(公告)日：2006-06-01

申请号：US10542029

申请日：2004-01-22

申请人： Akihiro Masuda ,  Masayoshi Kohinata ,  Keigo Obata ,  Masakazu Yoshimoto ,  Kiyotaka Tsuji ,  Ei Uchida ,  Keiji Ori ,  Masahiro Eikawa

发明人： Akihiro Masuda ,  Masayoshi Kohinata ,  Keigo Obata ,  Masakazu Yoshimoto ,  Kiyotaka Tsuji ,  Ei Uchida ,  Keiji Ori ,  Masahiro Eikawa

IPC分类号： C23C22/48

CPC分类号： C25D3/32 ,  C25D3/60 ,  H01L2224/11462

摘要： The present invention provides a tin-containing plating bath comprising: (a) a soluble stannous salt, or a mixture of a soluble stannous salt and at least one soluble salt selected from the group consisting of copper salts, bismuth salts, silver salts, indium salts, zinc salts, nickel salts, cobalt salts and antimony salts; and (b) at least one aliphatic sulfonic acid selected from the group consisting of alkanesulfonic acids and alkanolsulfonic acids, the aliphatic sulfonic acid being a purified aliphatic sulfonic acid in which the total amount of sulfur-containing compounds as impurities consisting of compound(s) containing one or more sulfur atoms with an oxidation number of +4 or less in the molecule and compound(s) containing one or more sulfur atoms and one or more chlorine atoms in the molecule is a minute amount or less. A tin or tin alloy plating film with excellent reflowability, film appearance, etc. can be formed by the use of this plating bath.

摘要翻译： 本发明提供一种含锡电镀液，其包含：（a）可溶性亚锡盐或可溶性亚锡盐与至少一种选自铜盐，铋盐，银盐，铟的可溶性盐的混合物 盐，锌盐，镍盐，钴盐和锑盐; 和（b）选自烷烃磺酸和链烷醇磺酸的至少一种脂族磺酸，所述脂族磺酸是纯化的脂族磺酸，其中作为杂质的含硫化合物的总量由化合物 在分子中含有氧化数为+4以下的一个或多个硫原子，分子中含有一个以上硫原子和一个以上氯原子的化合物为微量以下。 可以通过使用该镀浴形成具有优异的回流性，膜外观等的锡或锡合金电镀膜。

公开(公告)号：US5818968A

公开(公告)日：1998-10-06

申请号：US618514

申请日：1996-03-19

申请人： Masakazu Yoshimoto

发明人： Masakazu Yoshimoto

IPC分类号： H04N5/937 ,  G06T9/00 ,  H04N5/14 ,  H04N5/926 ,  H04N11/04 ,  H04N19/105 ,  H04N19/107 ,  H04N19/134 ,  H04N19/136 ,  H04N19/137 ,  H04N19/159 ,  H04N19/167 ,  H04N19/176 ,  H04N19/18 ,  H04N19/196 ,  H04N19/42 ,  H04N19/423 ,  H04N19/50 ,  H04N19/503 ,  H04N19/51 ,  H04N19/513 ,  H04N19/523 ,  H04N19/53 ,  H04N19/57 ,  H04N19/587 ,  H04N19/59 ,  H04N19/61 ,  H04N19/625 ,  H04N19/85 ,  H04N19/91 ,  H04N19/93 ,  G06K9/00

CPC分类号： H04N19/523 ,  H04N5/145 ,  H04N5/9261

摘要： A high-efficiency coding apparatus is provided which can increase accuracy in motion compensation and also increase processing speed without increasing the circuit scale as compared with the case that motion detection is carried out with respect to both of even and odd fields. Thus, this high-efficiency coding apparatus can perform accurate encoding, and can realize satisfactory transmission or recording of information. This high-efficiency coding apparatus is formed with frame memories for storing image information of a present frame therein, a frame memory for storing image information of a preceding frame therein, a frame type/2-field type motion detecting circuit for obtaining frame motion vector data of half-pel accuracy and 2-field motion vector data of half-pel accuracy by effecting motion detection of pixel data located within reference blocks located within the search area of a preceding frame and pixel data located within a remarkable block of the present frame, and selectively outputting these motion vector data. A motion compensating circuit effects motion compensation based on the selected output and an adding circuit effects encoding of the image information of the present frame and motion-compensated image information.

公开(公告)号：US4459185A

公开(公告)日：1984-07-10

申请号：US532934

申请日：1983-09-16

申请人： Keigo Obata ,  Nobuyasu Dohi ,  Yoshiaki Okuhama ,  Seishi Masaki ,  Yukiyoshi Okada ,  Masakazu Yoshimoto

发明人： Keigo Obata ,  Nobuyasu Dohi ,  Yoshiaki Okuhama ,  Seishi Masaki ,  Yukiyoshi Okada ,  Masakazu Yoshimoto

IPC分类号： C25D3/30 ,  C25D3/32 ,  C25D3/34 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60

CPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60

摘要： A tin, lead or tin-lead alloy plating bath, which comprises(A) a principal plating bath containing an alkanesulfonic or alkanolsulfonic acid, and either a divalent tin salt or a divalent lead salt thereof or both;(B) at least one of surfactants comprising(a) a cationic surfactant selected from the group consisting of quarternary ammonium salts, alkyl pyridinium salts, alkyl imidazolinium salts and higher alkyl amine salts,(b) an amphoteric surfactant selected from betaines, or(c) a nonionic surfactant selected from the group consisting of condensation products of ethylene oxide and/or propylene oxide with a styrenated phenol, a higher alcohol, an alkylphenol, an alkylnaphthol, a fatty acid amide, a sorbitan or a phosphate; and(C) at least one of levelling agents selected from the group consisting of alkylidene sulfamic acids, quinolinol derivatives, benzotriazole derivatives, dialkylidene o-phenylene diamines, benzaldehyde derivatives, triazine derivatives, salicylic acid derivatives and nitriles.

摘要翻译： 锡，铅或锡铅合金电镀浴，其包含（A）含有烷烃磺酸或链烷醇磺酸的主要电镀液，以及二价锡盐或其二价铅盐或两者; （B）至少一种表面活性剂，其包含（a）选自季铵盐，烷基吡啶鎓盐，烷基咪唑啉鎓盐和高级烷基胺盐的阳离子表面活性剂，（b）选自甜菜碱的两性表面活性剂或（ c）选自环氧乙烷和/或环氧丙烷与苯乙烯化酚，高级醇，烷基酚，烷基萘酚，脂肪酸酰胺，脱水山梨糖醇或磷酸酯的缩合产物的非离子表面活性剂; 和（C）选自亚烷基氨基磺酸，羟基喹啉衍生物，苯并三唑衍生物，二烷基亚苯基二胺，苯甲醛衍生物，三嗪衍生物，水杨酸衍生物和腈的至少一种流平剂。

公开(公告)号：US20090159453A1

公开(公告)日：2009-06-25

申请号：US12172104

申请日：2008-07-11

申请人： Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiji Omori ,  Toshifumi Kadokawa

发明人： Masakazu Yoshimoto ,  Shingo Kitamura ,  Seiji Omori ,  Toshifumi Kadokawa

IPC分类号： C25D3/46

CPC分类号： C25D3/46 ,  C25D5/34

摘要： The aim of the present invention is to provide a method for silver plating that does not comprise the step of forming the nickel-underlayer and that can form a silver-plated layer having sufficient adherence directly on the difficult-to-plate substrates with the use of a halide-free plating bath under a good working environment. The present invention provides a silver plating method onto a substrate on which an oxide layer inhibiting adherence of a plated layer is prone to form, comprising at least the following steps of; (A) degreasing the substrate, (B) removing the oxide layer with a strongly acidic solution from the substrate, and (C) silver plating onto the substrate, without a step of nickel or nickel alloy strike plating in advance, utilizing a phosphines-containing acidic silver plating bath which essentially does not contain halide ion or cyanide ion.

摘要翻译： 本发明的目的是提供一种镀银方法，其不包括形成镍底层的步骤，并且可以在使用中直接形成具有足够粘附性的镀银层 的无卤电镀槽在良好的工作环境下。 本发明提供一种镀银方法，其至少包括以下步骤：在其上易于形成抑制镀层粘附的氧化物层的基板上。 （A）对基材脱脂，（B）从基材除去氧化层，用强酸性溶液除去氧化物层，（C）镀银到基板上，不用预先进行镍或镍合金电镀步骤， 含有基本上不含卤离子或氰离子的酸性银镀液。