公开(公告)号：US3584265A

公开(公告)日：1971-06-08

申请号：US3584265D

申请日：1968-09-04

Applicant: BOSCH GMBH ROBERT

Inventor： NIER JOHANNES

IPC: B23K35/26 ,  H01L20060101 ,  H01L21/60 ,  H01L23/045 ,  H01L23/488 ,  H01L11/14

CPC classification number: B23K35/262 ,  B23K35/26 ,  B23K2201/36 ,  H01L23/045 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/4809 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2924/00012

Abstract: A transistor wherein the collector contact of a platelike semiconductor of silicon is soldered to a metallic base and wherein the base carries two insulated terminals for coiled first end portions of two wirelike leads whose second end portions are soldered to the base and emitter contacts on the exposed surface of the semiconductor. The second end portion of the leads are parallel to the axes of coiled end portions and the internal diameters of such coiled end portions exceed the diameters of corresponding terminals. The connections between the terminals and the coiled end portions are established by solder which is applied over the coiled end portions in the form of annuli and melts while the parts of the transistor are conveyed through a soldering furnace. During such transport, the second end portions penetrate into soft solder of the base and emitter contacts, and the collector contact of the semiconductor is simultaneously soldered to the metallic base.

公开(公告)号：US3221394A

公开(公告)日：1965-12-07

申请号：US23333262

申请日：1962-10-26

IPC: H01L21/673

CPC classification number: B23K37/0443 ,  B23K2201/36 ,  Y10T29/413 ,  Y10T29/49117 ,  Y10T29/49899 ,  Y10T29/53178 ,  Y10T29/53196 ,  Y10T29/53961

公开(公告)号：US2131890A

公开(公告)日：1938-10-04

申请号：US9356936

申请日：1936-07-31

Applicant: RCA CORP

Inventor： HOPKINS JR LLOYD C

IPC: B23K1/00 ,  H01J19/66

CPC classification number: B23K1/0008 ,  B23K2201/36

公开(公告)号：US6121560A

公开(公告)日：2000-09-19

申请号：US202156

申请日：1998-12-09

Applicant: Sezai Turkmen

Inventor： Sezai Turkmen

IPC: B23K1/00 ,  B23K15/00 ,  H01H1/58 ,  H01H33/02 ,  H01R31/08 ,  H01H9/30

CPC classification number: B23K1/0008 ,  B23K15/0046 ,  H01H1/5822 ,  H01R31/08 ,  B23K2201/36 ,  H01H2001/5827 ,  H01H2011/0087 ,  H01H33/025

Abstract: A switching contact system of a low-voltage circuit breaker has a bus with cord-like flexible conductors attached thereto. The flexible conductors are accommodated between a connecting surface (30) of the bus (26) and an end piece (27), which is in contact with the connecting surface (30) of the bus (26) with at least two contact surfaces. The parts are connected by heat effect, such as soldering or electron beam welding.

Abstract translation: PCT No.PCT / DE97 / 01290 Sec。 371 1998年12月9日第 102（e）日期1998年12月9日PCT提交1997年6月18日PCT公布。 公开号WO97 / 50102 日期1997年12月31日低压断路器的开关接触系统具有连接到其上的带状柔性导体的总线。 柔性导体容纳在总线（26）的连接表面（30）和与总线（26）的连接表面（30）接触的端部件（27）之间，具有至少两个接触表面。 部件通过热效应连接，如焊接或电子束焊接。

公开(公告)号：US5921460A

公开(公告)日：1999-07-13

申请号：US870049

申请日：1997-06-05

Applicant: Mark Stephen Topping ,  Cuong Van Pham ,  Brian John Hayden

Inventor： Mark Stephen Topping ,  Cuong Van Pham ,  Brian John Hayden

IPC: B23K20/10 ,  H01L21/607 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L24/80 ,  B23K20/10 ,  H05K3/3494 ,  H05K3/363 ,  B23K2201/36 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K3/3421 ,  H05K3/3463

Abstract: A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate. The method facilitates making electrical connections for completing an electronic circuit unit that is supported on a low temperature melting substrate and comprises (a) positioning together first and second conductive terminals for said circuit with a solder deposit therebetween to form an assembly, at least one of the terminals of such assembly being supported directly on such low temperature melting substrate; (b) gripping the assembly between an ultrasonic motion generating horn and an anvil, while exciting the horn to apply ultrasonic vibration to the first terminal to provide sufficient shearing energy that frictionally rubs at least one surface of the solder deposit in a rubbing direction generally parallel to said one surface to rapidly heat and melt the solder deposit; and (c) essentially immediately upon the completion melting of the solder deposit, ceasing the application of ultrasonic shearing energy to allow the solder to solidify and form a soldered diffusion joint between the terminals.

Abstract translation: 一种通过控制超声能量来焊接材料的方法，以在仅在低温熔融基底上承载的待接合组件中仅熔化焊料。 该方法有助于进行电连接以完成支撑在低温熔融基板上的电子电路单元，并且包括（a）将第一和第二导电端子定位在所述电路之间，其间具有焊料沉积物以形成组件，至少一个 这种组件的端子直接支撑在这种低温熔融基板上; （b）在超声波发生喇叭和砧座之间夹持组件，同时激励喇叭以对第一端子施加超声波振动，以提供足够的剪切能量，其摩擦方向大致平行于摩擦方向摩擦焊料沉积物的至少一个表面 使所述一个表面快速加热和熔化所述焊料沉积物; 和（c）基本上在焊料沉积物完成熔化之后立即停止超声剪切能量的施加，以允许焊料固化并在端子之间形成焊接的扩散接头。

公开(公告)号：US5916459A

公开(公告)日：1999-06-29

申请号：US919544

申请日：1997-08-28

Applicant: Thaddeus Schroeder ,  Thomas Arthur Perry ,  Martin Stephen Meyer ,  Bruno Patrice Bernard Lequesne

Inventor： Thaddeus Schroeder ,  Thomas Arthur Perry ,  Martin Stephen Meyer ,  Bruno Patrice Bernard Lequesne

IPC: B23K76/00

CPC classification number: B23K26/0066 ,  B23K26/0006 ,  B23K2201/36 ,  B23K2203/50

Abstract: A method is disclosed for equalizing the electrical resistance of two or more magnetoresistor sensor elements positioned on a permanent magnet in a sensor assembly. The method may utilize a laser to reduce the magnetic field of the portion of the permanent magnet underlying the sensor with the higher electrical resistance.

Abstract translation: 公开了一种用于均衡位于传感器组件中的永磁体上的两个或更多个磁电阻传感​​器元件的电阻的方法。 该方法可以利用激光器以更高的电阻来减小传感​​器下面的永久磁体的部分的磁场。

公开(公告)号：US5863493A

公开(公告)日：1999-01-26

申请号：US771351

申请日：1996-12-16

Applicant: Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

Inventor： Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34

CPC classification number: C22C13/00 ,  B23K35/262 ,  B23K2201/36

Abstract: Electrical solder compositions (by weight percent) having between 91.5-96.5% Sn; 2-5% Ag; 0.1-3% Ni; and 0-2.9% Cu; and having a melting temperature 220.degree. C. or less. The solder compositions have microstructure with uniformly dispersed fine grains of Sn--Ni, Sn--Cu and Sn--Cu--Ni intermetallic phases that provide resistance to grain growth during thermal cycling.

Abstract translation: 锡焊料组成（重量百分比）为91.5-96.5％Sn; 2-5％Ag; 0.1-3％Ni; 和0-2.9％Cu; 熔点220℃以下。 焊料组合物具有均匀分散的Sn-Ni，Sn-Cu和Sn-Cu-Ni金属间相的微细颗粒的微观结构，其在热循环期间提供对晶粒生长的抵抗力。

公开(公告)号：US5744780A

公开(公告)日：1998-04-28

申请号：US523321

申请日：1995-09-05

Applicant: Jim J. Chang ,  Ernest P. Dragon ,  Bruce E. Warner

Inventor： Jim J. Chang ,  Ernest P. Dragon ,  Bruce E. Warner

IPC: B23K26/04 ,  B23K26/06 ,  B23K26/08 ,  B23K26/14 ,  B23K26/16 ,  B23K26/18 ,  B23K26/38

CPC classification number: B23K26/0626 ,  B23K26/0057 ,  B23K26/032 ,  B23K26/046 ,  B23K26/0643 ,  B23K26/0665 ,  B23K26/082 ,  B23K26/123 ,  B23K26/142 ,  B23K26/16 ,  B23K26/18 ,  B23K26/382 ,  B23K26/384 ,  B23K26/388 ,  B23K26/40 ,  B23K2201/36 ,  B23K2203/04 ,  B23K2203/05 ,  B23K2203/10 ,  B23K2203/16 ,  B23K2203/50 ,  B23K2203/52

Abstract: A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialogroaphic sections of machined parts show little (submicron scale) recast layer and heat affected zone.

Abstract translation: 使用短脉冲，高重复率可见激光器进行精密微加工的新材料处理装置利用近衍射限制激光器，用于转向激光束的高速精密双轴倾斜镜，用于两者的光学系统 将激光束聚焦或成像在该部件上，以及可由盖板和背板组成的部件保持器。 该系统通常用于金属和陶瓷的精密钻孔，切割，铣削和抛光，并且在制造精密部件方面具有广泛的应用。 通过使用该系统的冲击钻和切割技术已经证明了精密加工。 使用以多kHz脉冲重复频率运行的30瓦铜蒸气激光器，尺寸变化范围从500微米到小于25微米，纵横比高达1:40的直线平行孔已被持续地钻出，具有良好的表面光洁度 的金属。 使用250瓦铜蒸汽激光器的陶瓷上的微孔和微孔也已经被证明具有良好的结果。 加工零件的材质部分显示出少量（亚微米级）重铸层和热影响区。

公开(公告)号：US5743457A

公开(公告)日：1998-04-28

申请号：US627793

申请日：1996-04-01

Applicant: Walter Benedette ,  Medhat Said ,  Andrew Z. Glovatsky

Inventor： Walter Benedette ,  Medhat Said ,  Andrew Z. Glovatsky

IPC: B05C5/02 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0623 ,  H05K3/3457 ,  B23K2201/36 ,  H05K2203/0126 ,  H05K3/3447

Abstract: A solder dispensing apparatus for depositing fluid solder into and around a pin-in-through-hole joining zone of an electronic circuit board which comprises: a valve assembly defining a valve chamber with an inlet and an outlet, and having the valve member actuated by the pin of said pin-in-through-hole joining zone when the valve is positioned at the zone against the board, the valve member moving from a first position closing off fluid flow from the outlet to a second position permitting fluid flow through the outlet; means for measuring a predetermined body of fluid solder that is released from the chamber when said valve member is in the second position with the assembly positioned at the zone against the board; and means to contain the released fluid solder in a predetermined shape and in and around the pin-in-through-hole joining zone while the solder solidifies.

Abstract translation: 一种焊料分配装置，用于将流体焊料沉积到电子电路板的销钉通孔连接区域中并围绕电子电路板的销钉通孔接合区域，该焊接分配装置包括：阀组件，其限定具有入口和出口的阀室，并且所述阀构件由 当所述阀定位在抵靠所述板的区域时，所述销钉在通孔接合区域中的销，所述阀构件从关闭流体流动的第一位置移动到第二位置，从而允许流体流过所述出口 ; 用于测量当所述阀构件位于所述第二位置时从所述腔室释放的预定体积的流体焊料的装置，其中所述组件位于相对于所述板的所述区域处; 以及用于在焊料固化时将所释放的流体焊料容纳在预定形状中并且在销钉通孔接合区中和周围的装置。

公开(公告)号：US5680984A

公开(公告)日：1997-10-28

申请号：US439948

申请日：1995-05-12

Applicant: Shoji Sakemi

Inventor： Shoji Sakemi

IPC: B23K3/06 ,  B23K3/08 ,  H01L21/48 ,  H05K3/34 ,  B23K1/018

CPC classification number: B23K3/082 ,  B23K3/0623 ,  H01L21/4853 ,  H05K3/3478 ,  B23K2201/36 ,  H05K2203/041 ,  H05K2203/082 ,  H05K3/3489

Abstract: An absorber head 10 picks up a plurality of soldering balls 1 from a container 2, and is shifted horizontally toward a substrate 31. In the midway of this shift movement, the absorber head 10 is stopped just above a flux storage 32 and then lowered to soak the soldering ball 1 in the flux 34 stored in the flux storage 32, thereby applying each soldering ball 1 with an adequate amount of flux. Thereafter, the absorber head 10 is again shifted horizontally until it reaches the substrate 31. Then, the absorber head 10 lowers the soldering ball 1 applied with flux, so that each soldering ball 1 is mounted on a corresponding electrode 31a provided on the substrate 31. If any soldering balls 1 are left in the flux storage 32 due to failure of the pickup operation by the absorber head 10, such soldering balls 1 are surely collected in a groove 36 by a wiping movement of a squeegee 37 which is associated with the flux storage 32.

Abstract translation: 吸收头10从容器2拾取多个焊球1，并且水平地朝向基板31移动。在该移动运动的中途，吸收头10恰好停在磁通储存器32的上方，然后降低到 将焊球1浸入储存在助焊剂储存器32中的助焊剂34中，从而使每个焊球1具有足够量的助熔剂。 此后，吸收头10再次水平移动直到其到达基板31.然后，吸收头10降低施加有焊剂的焊球1，使得每个焊球1安装在设置在基板31上的对应的电极31a上 如果由于吸收头10的拾取操作失败而将任何焊球1留在助焊剂储存器32中，则这样的焊球1通过刮板37的擦拭运动可靠地收集在凹槽36中，刮板37与 助焊剂储存32。