公开(公告)号：US20170129769A1

公开(公告)日：2017-05-11

申请号：US14935863

申请日：2015-11-09

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： AARON A. GEISBERGER

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81C1/00626 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0307

摘要： An embodiment of a microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.

公开(公告)号：US20170101307A1

公开(公告)日：2017-04-13

申请号：US15181480

申请日：2016-06-14

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Chang Hyun LIM ,  Tae Hun LEE ,  Dae Hun JEONG

IPC分类号： B81B7/00 ,  G01D11/24 ,  H01L23/053 ,  H01L25/16 ,  H01L23/00

CPC分类号： B81B7/008 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2207/012 ,  G01D11/245 ,  H01L23/053 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

摘要： There is provided a semiconductor package that comprises a board; a semiconductor chip disposed on the board and having an installation recess; an adhesive layer disposed within the installation recess; and a sensor unit disposed on the adhesive layer.

公开(公告)号：US20170081177A1

公开(公告)日：2017-03-23

申请号：US15311253

申请日：2015-05-29

申请人： Robert Bosch GmbH

发明人： Reinhard Neul ,  Johannes Classen ,  Torsten Kramer ,  Jochen Reinmuth ,  Mirko Hattass ,  Lars Tebje ,  Daniel Christoph Meisel ,  Ralf Reichenbach ,  Friedjof Heuck ,  Antoine Puygranier

IPC分类号： B81B7/00

CPC分类号： B81B7/0048 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/096 ,  H01L23/13 ,  H01L23/49827 ,  H01L2224/16225

摘要： An interposer is provided which is made up of a flat carrier substrate including at least one front wiring plane, in which front terminal pads are formed for mounting a component on the interposer, including at least one rear wiring plane, in which rear terminal pads are formed for mounting on a component carrier, the front terminal pads and the rear terminal pads being arranged offset from each other; and including vias for electrical connection of the at least one front wiring plane and the at least one rear wiring plane. The carrier substrate includes at least one edge section and at least one center section, which are at least largely mechanically decoupled via a stress-decoupling structure. The front terminal pads are arranged exclusively on the center section for mounting the component, while the rear terminal pads are arranged exclusively on the edge section for mounting on a component carrier.

公开(公告)号：US20170022051A1

公开(公告)日：2017-01-26

申请号：US15092234

申请日：2016-04-06

申请人： ANALOG DEVICES, INC.

发明人： Xiaojie Xue ,  Michael J. Zylinski ,  Thomas M. Goida ,  Kathleen O. O'Donnell

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L23/24 ,  H01L25/065

CPC分类号： B81B7/0048 ,  B81B2207/115 ,  B81C1/00365 ,  B81C2201/0147 ,  B81C2203/0136 ,  H01L23/057 ,  H01L23/562 ,  H01L25/0657 ,  H01L2225/06575

摘要： An integrated device package is disclosed. The package can include a carrier, such as first integrated device die, and a second integrated device die stacked on the first integrated device die. The package can include a buffer layer which coats at least a portion of an exterior surface of the first integrated device die and which is disposed between the second integrated device die and the first integrated device die. The buffer layer can comprise a pattern to reduce transmission of stresses between the first integrated device die and the second integrated device die.

摘要翻译： 公开了一种集成器件封装。 封装可以包括诸如第一集成器件管芯的载体和堆叠在第一集成器件管芯上的第二集成器件管芯。 封装可以包括缓冲层，该缓冲层涂覆第一集成器件管芯的外表面的至少一部分，并且设置在第二集成器件管芯和第一集成器件管芯之间。 缓冲层可以包括用于减少第一集成器件管芯和第二集成器件裸片之间的应力传输的图案。

公开(公告)号：US09409765B1

公开(公告)日：2016-08-09

申请号：US13757307

申请日：2013-02-01

申请人： Maxim Integrated Products, Inc.

发明人： Hemant Desai ,  Viresh P. Patel

IPC分类号： H01L29/84 ,  H01L21/52 ,  B81B7/00

CPC分类号： B81B7/0058 ,  B81B7/0048 ,  B81B2207/07 ,  H01L2224/48137

摘要： The present invention relates to a method and apparatus for an isolating structure. Embodiments of the present invention provide a robust packaging process and a mechanical filter to reduce the mechanical shock from impact. The mechanical filter can be integrated within the package substrate as part of the packaging process, reducing the assembly complexity.

摘要翻译： 本发明涉及隔离结构的方法和装置。 本发明的实施例提供了一种坚固的包装过程和机械过滤器，以减少冲击的机械冲击。 机械过滤器可以作为包装过程的一部分集成在封装基板内，从而降低组装的复杂性。

公开(公告)号：US20160090297A1

公开(公告)日：2016-03-31

申请号：US14502475

申请日：2014-09-30

申请人： Analog Devices, Inc.

发明人： Xin Zhang ,  Michael W. Judy ,  George M. Molnar ,  Christopher R. Needham ,  Kemiao Jia

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0048

摘要： A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.

摘要翻译： MEMS产品包括由应力消除间隙围绕并从衬底悬挂的应力隔离MEMS平台。 应力消除间隙提供阻挡机械应力从基板传递到平台的障碍。

公开(公告)号：US20160052784A1

公开(公告)日：2016-02-25

申请号：US14467234

申请日：2014-08-25

申请人： Rosemount Aerospace Inc.

发明人： David P. Potasek

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00873 ,  B81B7/0048 ,  B81B7/0061 ,  B81C1/00492

摘要： A MEMS sensor includes a sensor die configured to generate a sensor signal and a pedestal layer disposed on the sensor die. The pedestal layer includes a channel defined therein about a pedestal of the pedestal layer. The pedestal is configured to be mounted to a housing. A method for manufacturing MEMS sensors can include disposing a pedestal layer on a sensor layer, wherein the sensor layer defines a plurality of sensor dies to be cut therefrom. The method further includes defining a respective channel in the pedestal layer for each sensor die, thereby creating a pedestal for each sensor die.

摘要翻译： MEMS传感器包括被配置为产生传感器信号的传感器管芯和设置在传感器管芯上的基座层。 基座层包括围绕基座层的基座限定的通道。 基座被构造成安装到壳体。 用于制造MEMS传感器的方法可以包括在传感器层上设置基座层，其中传感器层限定要从其切割的多个传感器管芯。 该方法还包括为每个传感器模具定义基座层中的相应通道，从而为每个传感器模具创建基座。

公开(公告)号：US20160039664A1

公开(公告)日：2016-02-11

申请号：US14453155

申请日：2014-08-06

申请人： Honeywell International Inc.

发明人： Grant H. Lodden ,  Ryan Supino

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0048 ,  B81C1/00269 ,  B81C1/00325 ,  B81C1/00476 ,  B81C1/00492 ,  B81C2203/037

摘要： A microelectromechanical (MEMS) structure is provided. In one embodiment, the MEMS structure includes a glass substrate layer containing at least one embedded stress isolation feature. The glass substrate also includes at least one bump bond site configured for coupling the MEMS structure to a package. The MEMS structure also includes a semiconductor device layer, formed on the glass substrate layer, that includes a MEMS sensor. The MEMS structure also includes a top glass layer disposed on the semiconductor device layer

摘要翻译： 提供了一种微机电（MEMS）结构。 在一个实施例中，MEMS结构包括包含至少一个嵌入式应力隔离特征的玻璃基底层。 玻璃基板还包括至少一个凸起接合位置，其被配置为将MEMS结构耦合到封装。 MEMS结构还包括形成在玻璃衬底层上的包括MEMS传感器的半导体器件层。 MEMS结构还包括设置在半导体器件层上的顶部玻璃层

公开(公告)号：US20150192602A1

公开(公告)日：2015-07-09

申请号：US14660353

申请日：2015-03-17

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Shigehiro Yoshiuchi ,  Satoshi Ohuchi ,  Tsuyoshi Fujii ,  Kensaku Yamamoto ,  Hideo Ohkoshi

IPC分类号： G01P15/08

CPC分类号： G01C19/5769 ,  B81B7/0048 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2207/07 ,  B81C1/0023 ,  B81C1/00238 ,  G01P15/0802 ,  H01L24/32 ,  H01L41/1132 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014

摘要： An inertial force sensor that can suppress fluctuation of detection sensitivity even if an external stress is applied to the inertial force sensor. Angular velocity sensor (1), that is, an inertial force sensor includes ceramic substrate (6), lower lid (4) adhering to ceramic substrate (6) with adhesives (11a and 11b) (first adhesives), and sensor element (2) adhering to lower lid (4) with adhesives (10a and 10b) (second adhesives). The elastic moduli of adhesives (11a and 11b) are smaller than those of adhesives (10a and 10b).

摘要翻译： 即使向惯性力传感器施加外部应力也能够抑制检测灵敏度的波动的惯性力传感器。 角速度传感器（1）即惯性力传感器包括陶瓷基板（6），粘合剂（11a和11b）（第一粘合剂）和传感器元件（2）附着在陶瓷基板（6）上的下盖 ）用粘合剂（10a和10b）（第二粘合剂）粘附到下盖（4）上。 粘合剂（11a和11b）的弹性模量小于粘合剂（10a和10b）的弹性模量。

公开(公告)号：US20150191349A1

公开(公告)日：2015-07-09

申请号：US14414333

申请日：2012-07-11

申请人： Jennifer Wu ,  Zhuqing Zhang ,  Wallace Andrew Dingman

发明人： Jennifer Wu ,  Zhuqing Zhang ,  Wallace Andrew Dingman

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00357 ,  B81B7/0006 ,  B81B7/0048 ,  B81B2201/0242 ,  B81C2203/032 ,  H01L23/13 ,  H01L24/32 ,  H01L2224/2919 ,  H01L2224/3224 ,  H01L2224/83385 ,  H01L2924/1461 ,  H01L2924/1515 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014

摘要： A device including a semiconductor and a substrate. The substrate has a first surface and a second surface that opposes the first surface. The substrate has a hole that extends from the first surface to the second surface and the semiconductor is secured to the substrate via adhesive in the hole.

摘要翻译： 一种包括半导体和衬底的器件。 衬底具有与第一表面相对的第一表面和第二表面。 衬底具有从第一表面延伸到第二表面的孔，并且半导体通过孔中的粘合剂固定到衬底。