公开(公告)号：US20060276044A1

公开(公告)日：2006-12-07

申请号：US11503303

申请日：2006-08-14

Applicant: Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

Inventor： Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

IPC: G03C5/00 ,  H01L21/302

CPC classification number: B81C99/0085 ,  B81C2201/032 ,  C25D1/003 ,  H01L21/4821 ,  H05K3/202 ,  H05K3/205

Abstract: A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.

Abstract translation: 一种通过使用树脂模具（13）制造金属微结构（1）的方法。 为了提供可以设定对树脂模具（13）造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构（1）的方法，制造 根据本发明的金属微结构（1）包括以下步骤：通过插入具有一个或多个金属微结构（1）的光敏聚合物（12）将具有穿过厚度方向的空白部分的树脂模具（13）固定在导电基板（11）上， 化学成分由电子束，紫外线辐射或可见光辐射而变化，形成具有树脂模具（13）的层状结构（2）。 将具有树脂模具（13）的层状结构（2）暴露于电子束，紫外线或可见光; 去除存在于树脂模具（13）的空缺部分的曝光的光敏聚合物（12c）; 并通过电铸将金属（14）填充到具有树脂模具（13）的层状结构（2）的空位部分上。

公开(公告)号：US07041433B1

公开(公告)日：2006-05-09

申请号：US10130221

申请日：2000-11-17

Applicant: Felix Schmitz ,  Matthias Nienhaus ,  Manfred Lacher

Inventor： Felix Schmitz ,  Matthias Nienhaus ,  Manfred Lacher

IPC: G03F7/00

CPC classification number: B81C99/008 ,  B81B2201/034 ,  B81C2201/032 ,  G03F7/00 ,  G03F7/0035 ,  H01F17/0006 ,  H01F41/042

Abstract: The invention relates to a flat coil and to a lthographic method for producing microcomponents with metal component sources in the sub-millimeter range. According to the inventive method, a resist material is structured by means of selective exposition and removing the unexposed zones and filling in the gaps between the resist structures with metal by means of a galvanic method to produe the metal component structures. The aim of the invention is to improve such a method so that the microcomponents can be subdivided during said process. To this end, a structured three-dimensional sacrificial metal layer is produced during the production of the microcomponent, said sacrificial layer delimiting the microcomponent and being removed once the microcomponent is due to be subdivided. The invention also relates to a method for producing microcomponents with component structures of cross-linkable resist material and to a flat coil for micromotors with at least one coil layer with strip conductors in the sub-millimeter range.

Abstract translation: 本发明涉及一种扁平线圈以及用于制造具有亚毫米范围内的金属成分源的微型部件的印刷方法。 根据本发明的方法，通过选择性地曝光和去除未曝光的区域并通过电镀方法用金属填充抗蚀剂结构之间的间隙来制造抗蚀剂材料，以产生金属组分结构。 本发明的目的是改进这种方法，使得微组件可以在所述方法期间细分。 为此，在微组件的制造期间产生结构化的三维牺牲金属层，所述牺牲层限定微组件，并且一旦微元件被细分就被移除。 本发明还涉及一种用于制造具有可交联抗蚀剂材料的组分结构的微组件和具有至少一个带子导体在亚毫米范围内的线圈层的微型电动机的扁平线圈的方法。

公开(公告)号：US06849390B2

公开(公告)日：2005-02-01

申请号：US10061273

申请日：2002-02-04

Applicant: Masahiro Katsumura ,  Tetsuya Iida ,  Nobuhiro Oda ,  Takashi Ueno

Inventor： Masahiro Katsumura ,  Tetsuya Iida ,  Nobuhiro Oda ,  Takashi Ueno

IPC: B81C1/00 ,  C25D1/10 ,  G11B7/26 ,  B32B3/00

CPC classification number: C25D1/10 ,  B81C99/009 ,  B81C2201/0128 ,  B81C2201/032

Abstract: A stamper-forming electrode material contains Cu as its main ingredient and at least one other element, preferably Ag and/or Ti. It is preferred that the Ag content be 10.0 wt % or less and that the Ti content be 5.0 wt % or less. A stamper-forming thin film is made of this stamper-forming electrode material, whereby its corrosion resistance is improved to suppress damage to itself, and a high-quality stamper can hence be formed.

Abstract translation: 压模形成电极材料包含Cu作为其主要成分和至少一种其它元素，优选Ag和/或Ti。 Ag含量优选为10.0重量％以下，Ti含量为5.0重量％以下。 压模形成薄膜由该压模形成用电极材料制成，由此其耐腐蚀性得到改善以抑制其自身的损伤，因此可以形成高质量的压模。

公开(公告)号：US20040065553A1

公开(公告)日：2004-04-08

申请号：US10677549

申请日：2003-10-01

Applicant: University of Southern California

Inventor： Adam L. Cohen

IPC: C25D005/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US5576147A

公开(公告)日：1996-11-19

申请号：US461983

申请日：1995-06-05

Applicant: Henry Guckel ,  Todd R. Christenson ,  Kenneth Skrobis

Inventor： Henry Guckel ,  Todd R. Christenson ,  Kenneth Skrobis

IPC: G03F7/027 ,  B81B1/00 ,  B81C1/00 ,  G03F7/00 ,  G03F7/20 ,  G03F7/26 ,  G03F7/30 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027 ,  H05K3/18

CPC classification number: G03F7/38 ,  B81C1/0038 ,  G03F7/00 ,  G03F7/0035 ,  B81C2201/0128 ,  B81C2201/0159 ,  B81C2201/019 ,  B81C2201/032 ,  Y10S430/168 ,  Y10T428/31504

Abstract: In the formation of microstructures, a preformed sheet of photoresist, such as polymethylmethacrylate (PMMA), which is strain free, may be milled down before or after adherence to a substrate to a desired thickness. The photoresist is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the photoresist material which has been rendered susceptible to the developer. Micrometal structures may be formed by electroplating metal into the areas from which the photoresist has been removed. The photoresist itself may form useful microstructures, and can be removed from the substrate by utilizing a release layer between the substrate and the preformed sheet which can be removed by a remover which does not affect the photoresist. Multiple layers of patterned photoresist can be built up to allow complex three dimensional microstructures to be formed.

公开(公告)号：US09045333B2

公开(公告)日：2015-06-02

申请号：US12797389

申请日：2010-06-09

Applicant: Pierre Cusin ,  Jean-Philippe Thiebaud

Inventor： Pierre Cusin ,  Jean-Philippe Thiebaud

IPC: B23P15/00 ,  C03C25/00 ,  B44C1/00 ,  B81C99/00 ,  B81C1/00 ,  B81B3/00 ,  C25D1/20 ,  G04B13/02 ,  G04D3/00 ,  C25D1/00 ,  C25D5/02

CPC classification number: B81C99/008 ,  B81B3/0075 ,  B81B2201/035 ,  B81C1/00031 ,  B81C1/00087 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/032 ,  C25D1/003 ,  C25D1/20 ,  C25D5/022 ,  G04B13/022 ,  G04B13/026 ,  G04D3/0069

Abstract: The invention relates to a method of fabricating a composite micromechanical component, particularly for timepiece movements, including steps: a) providing a substrate including a horizontal top layer and a horizontal bottom layer made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, horizontal, intermediate layer; b) etching a pattern in the top layer through to the intermediate layer, thereby forming at least one cavity in the substrate; c) coating the top part of the substrate with an electrically insulating coating; d) directionally etching the coating and the intermediate layer to limit the presence thereof exclusively at each vertical wall; e) performing an electrodeposition by connecting the electrode to the conductive bottom layer of the substrate to form at least one metal part of the component; g) releasing the composite component from the substrate.

Abstract translation: 本发明涉及一种制造复合微机械部件的方法，特别是用于钟表运动的方法，包括步骤：a）提供包括由导电的可微加工材料制成的水平顶层和水平底层的基板，并通过 电绝缘的水平中间层; b）将顶层中的图案蚀刻到中间层，从而在衬底中形成至少一个空腔; c）用电绝缘涂层涂覆基材的顶部; d）定向蚀刻涂层和中间层，以限制其在每个垂直壁上的存在; e）通过将所述电极连接到所述基板的导电底层来进行电沉积以形成所述部件的至少一个金属部分; g）从基底释放复合组分。

公开(公告)号：US20140004374A1

公开(公告)日：2014-01-02

申请号：US14017510

申请日：2013-09-04

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen

IPC: C25D1/00 ,  C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US08603316B2

公开(公告)日：2013-12-10

申请号：US13167451

申请日：2011-06-23

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02 ,  C25D5/10

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US20120234688A1

公开(公告)日：2012-09-20

申请号：US13441136

申请日：2012-04-06

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02 ,  C25D5/48

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US20120042510A1

公开(公告)日：2012-02-23

申请号：US13266229

申请日：2010-05-26

Applicant: Alexandre Fussinger

Inventor： Alexandre Fussinger

IPC: H05K3/00

CPC classification number: C25D1/003 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  C25D5/022 ,  G03F7/0035 ,  Y10T29/49124

Abstract: The present invention concerns a method of fabricating a plurality of metallic microstructures, characterized in that it includes the steps consisting in: a) taking a conductive substrate or an insulating substrate coated with a conductive seed layer; b) applying a layer of photosensitive resin over the conductive part of the substrate surface; c) flattening the surface of the photosensitive resin layer to the desired thickness and/or surface state; d) irradiating the resin layer through a mask defining the contour of the desired microstructure; e) dissolving the non-polymerized areas of the photosensitive resin layer to reveal, in places, the conductive surface of the substrate; f) the galvanic deposition of at least one layer of a metal from said conductive layer to form a unit substantially reaching the upper surface of the photosensitive resin; g) flattening the resin and the electroformed metal to bring the resin and the electroformed units to the same level and thereby form electroformed parts or microstructures; h) separating the resin layer and the electroformed parts from the substrate; and i) removing the layer of photosensitive resin from the structure obtained at the end of step g) to release the microstructures thereby formed.

Abstract translation: 本发明涉及一种制造多个金属微结构的方法，其特征在于包括以下步骤：a）取导电基底或涂有导电种子层的绝缘基片; b）在基板表面的导电部分上施加一层感光树脂; c）将感光性树脂层的表面平坦化成所需的厚度和/或表面状态; d）通过限定所需微结构轮廓的掩模照射树脂层; e）溶解感光性树脂层的未聚合区域，以露出基材的导电表面; f）从所述导电层电镀沉积至少一层金属以形成基本上到达感光树脂上表面的单元; g）使树脂和电铸金属变平，使树脂和电铸单元达到同一水平，从而形成电铸部件或微结构; h）从基板分离树脂层和电铸部件; i）从步骤g）结束时得到的结构除去感光性树脂层，以释放由此形成的微结构。