公开(公告)号：US20240166857A1

公开(公告)日：2024-05-23

申请号：US17989502

申请日：2022-11-17

Applicant: CARLISLE CONSTRUCTION MATERIALS, LLC

Inventor： Majid KARIMI NEJAD ,  Anil SHENOY

IPC: C08L23/16 ,  C08K3/22 ,  C08K5/521 ,  C08L39/04

CPC classification number: C08L23/16 ,  C08K3/22 ,  C08K5/521 ,  C08L39/04 ,  C08K2003/2224 ,  C08K2003/2227 ,  C08L2201/02 ,  C08L2201/22

Abstract: The disclosure herein relates to EPDM rubber compositions and membranes. More specifically, the present disclosure relates to halogen-free, fire-resistant EPDM rubber compositions and membranes, and to methods of making them. In one embodiment, the halogen-free EPDM rubber membrane is used for weatherproofing buildings, in particular as a membrane for façade application.

公开(公告)号：US20230312921A1

公开(公告)日：2023-10-05

申请号：US18134034

申请日：2023-04-12

Applicant: KINGFA SCI. & TECH. CO., LTD.

Inventor： Xuefeng Jin ,  Xianbo Huang ,  Nanbiao Ye ,  Feng Wang ,  Zeyu Hu ,  Xin Yi ,  Changbo Wu ,  Yiquan Zheng

IPC: C08L77/06 ,  C08L77/02

CPC classification number: C08L77/06 ,  C08L77/02 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/03

Abstract: Disclosed are a low-mold deposit halogen-free flame-retardant thermoplastic polyamide composition, and a preparation method and use thereof. The composition includes the following components in parts by weight: 20 to 82 parts of a thermoplastic polyamide resin; 13 to 25 parts of a flame retardant; 1 to 5 parts of a flame-retardant synergist; 5 to 50 parts of a reinforcement material; and 0.5 to 5 parts of an adsorbent, where the flame retardant includes a phosphinate-based flame retardant and the adsorbent is an ethylene copolymer. In the present disclosure, an ethylene copolymer is added as an adsorbent and an addition amount of the ethylene copolymer is controlled, so that the prepared composition exhibits excellent flame resistance and electrical properties, and can effectively reduce the release of small molecules during the injection molding and greatly reduce an amount of the mold deposit generated during the injection molding.

公开(公告)号：US11643529B2

公开(公告)日：2023-05-09

申请号：US16491367

申请日：2018-01-26

Applicant: ExxonMobil Chemical Patents Inc.

Inventor： Andy H. Tsou ,  Hillary L. Passino

IPC: C08L15/02 ,  C08F210/10 ,  C08K3/04 ,  C08J3/22 ,  B60C1/00

CPC classification number: C08L15/02 ,  B60C1/0008 ,  C08F210/10 ,  C08J3/226 ,  C08K3/042 ,  C08F2800/20 ,  C08F2810/50 ,  C08K2201/011 ,  C08L2201/22 ,  C08L2310/00

Abstract: Disclosed herein are graft polymers having a copolymer backbone and polycyclic aromatic hydrocarbon branches for use as a nanofiller dispersant and methods for making the same. Also disclosed are elastomeric nanocomposite compositions comprising a halobutyl rubber matrix, nanoparticles of graphite or grapheme, and the graft polymer. Such elastomeric nanocomposite compositions are suitable as tire innerliners or innertubes.

公开(公告)号：US20180223094A1

公开(公告)日：2018-08-09

申请号：US15807163

申请日：2017-11-08

Applicant: ITEQ CORPORATION

Inventor： Kai-Yang CHEN ,  Chun-Hao CHANG ,  Yu-Chieh HSU

IPC: C08L63/00 ,  C08G59/40 ,  H01B3/40 ,  H01B3/30

CPC classification number: C08L63/00 ,  C08G59/4071 ,  C08G59/4223 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2205/02 ,  C08L2205/03 ,  H01B3/303 ,  H01B3/40 ,  C08K3/36 ,  C08K5/0066 ,  C08L79/08

Abstract: The present invention discloses a halogen-free epoxy resin composition having low dielectric loss, comprises: (A) 100 parts by weight of an epoxy resin; (B) 10-30 parts by weight of a DOPO modified curing agent; (C) 1-10 parts by weight of benzoxazine resin; (D) 60-90 parts by weight of an active ester compound; (E) 20-50 parts by weight of a flame retardant; and (F) 0.5-10 parts by weight of a curing accelerator. The halogen-free epoxy resin composition uses active ester as a curing agent of the epoxy resin to ensure that the hardening product has characteristics such as low dielectric constant (Dk), low dielectric loss (Df), high heat resistance, low water absorption, flame retardant and halogen-free. The halogen-free epoxy resin composition of the present invention is used for manufacturing semi-cured prepregs or resin-coated films, and is applied toward manufacturing metal clad laminates and printed circuit boards.

公开(公告)号：US09840620B2

公开(公告)日：2017-12-12

申请号：US15022154

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: C08L79/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/28 ,  C08G14/06 ,  C08L61/34 ,  C08J5/24 ,  C08L71/12 ,  H05K1/03 ,  H05K3/02

CPC classification number: C08L79/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/285 ,  B32B2264/102 ,  B32B2307/306 ,  B32B2307/3065 ,  C08G14/06 ,  C08J5/24 ,  C08J2371/12 ,  C08J2379/02 ,  C08J2425/10 ,  C08J2471/12 ,  C08K5/14 ,  C08K7/18 ,  C08L25/10 ,  C08L61/34 ,  C08L71/126 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2205/03 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012

Abstract: Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

公开(公告)号：US20170283609A1

公开(公告)日：2017-10-05

申请号：US15118204

申请日：2015-06-01

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Xianping Zeng ,  Liexiang He

IPC: C08L63/04 ,  C08G59/42 ,  H05K1/03 ,  C08J5/04 ,  C08J5/10 ,  C08G59/68 ,  C08G59/62 ,  C08J5/24

CPC classification number: C08L63/04 ,  C08G59/4071 ,  C08G59/4215 ,  C08G59/4238 ,  C08G59/4284 ,  C08G59/621 ,  C08G59/685 ,  C08G59/686 ,  C08J5/043 ,  C08J5/10 ,  C08J5/24 ,  C08J2363/04 ,  C08J2425/08 ,  C08J2461/14 ,  C08L63/00 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/05 ,  H05K1/0373 ,  C08L61/14 ,  C08L61/12 ,  C08L61/32

Abstract: Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

公开(公告)号：US20160304715A1

公开(公告)日：2016-10-20

申请号：US15103431

申请日：2013-12-12

Applicant: ITALMATCH CHEMICALS S.p.A.

Inventor： Ugo ZUCCHELLI

IPC: C08L77/02

CPC classification number: C08L77/02 ,  C08K3/32 ,  C08K5/34924 ,  C08K5/5313 ,  C08L23/0861 ,  C08L77/06 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2207/04

Abstract: The present invention relates to halogen-free flame retardant compositions essentially comprising polyamide polymers (preferred is PA6), at least an Hypophosphorous acid metal salt (preferred is Aluminium hypophosphite), at least an organic phosphinate metal salt (preferred is Aluminium Di Ethyl Phosphinate), at least a Nitrogen based flame retardant agent (preferred is Melamine Cyanurate), at least an organic polyhydric polymer (preferred is EVOH) and optionally further conventional components. Such compositions are highly flame retarded at low thickness and have high Glow Wire temperature resistance.

Abstract translation: 本发明涉及至少一种次磷酸金属盐（优选次磷酸铝），至少一种有机次膦酸盐金属盐（优选为二乙基铝磷酸盐）的聚酰胺聚合物（优选为PA6），无卤阻燃剂组合物 至少一种氮基阻燃剂（优选氰尿酸三聚氰胺），至少一种有机多羟基聚合物（优选EVOH）和任选的其它常规组分。 这种组合物在低厚度下是高度阻燃的并且具有高辉光线耐温性。

公开(公告)号：US20160244471A1

公开(公告)日：2016-08-25

申请号：US15027369

申请日：2014-06-13

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yueshan HE

IPC: C07F9/6581 ,  C08L79/02 ,  C08L75/00 ,  H05K1/03 ,  C08L63/08 ,  C08J5/24 ,  C08J5/04 ,  C09K21/14 ,  C08G59/30 ,  C08L71/00

CPC classification number: C07F9/65812 ,  C07F9/65815 ,  C08G59/304 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/08 ,  C08J2371/00 ,  C08J2375/00 ,  C08J2379/00 ,  C08J2379/02 ,  C08J2435/06 ,  C08J2463/08 ,  C08K5/5399 ,  C08L63/08 ,  C08L71/00 ,  C08L75/00 ,  C08L79/02 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/03 ,  C09K21/12 ,  C09K21/14 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209

Abstract: The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol. % of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible.

Abstract translation: 本发明公开了一种苯氧基环三磷腈活性酯，一种无卤树脂组合物及其应用。 苯氧基环三磷腈活性酯包含至少65mol。 ％具有以下结构式的物质。 无卤素树脂组合物包含5-50重量份苯氧基环三磷腈活性酯，15-85重量份热固性树脂，1-35重量份固化剂，0-5重量份固化剂 促进剂和0-100重量份的无机填料。 本发明公开了将苯氧基环三磷腈活性酯引入热固性树脂中，使活性酯与环氧树脂等热固性树脂反应而不产生羟基，不仅满足无卤素和阻燃性的要求，而且改善了电 性能（降低和稳定Dk和Df），从而使高频和高速基板材料的非卤化成为可能。