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    Z-Directed Components for Printed Circuit Boards
    22.
    发明申请
    Z-Directed Components for Printed Circuit Boards 审中-公开
    Z型印刷电路板组件

    公开(公告)号：US20110017502A1

    公开(公告)日：2011-01-27

    申请号：US12508131

    申请日：2009-07-23

    Applicant: Keith Bryan Hardin ,  John Thomas Fessler ,  Paul Kevin Hall ,  Brian Lee Nally ,  Robert Aaron Oglesbee

    Inventor： Keith Bryan Hardin ,  John Thomas Fessler ,  Paul Kevin Hall ,  Brian Lee Nally ,  Robert Aaron Oglesbee

    IPC: H05K1/18

    CPC classification number: H05K1/184 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/09809 ,  H05K2201/10893 ,  H05K2201/10984

    Abstract: A design for a Z-directed component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Z-directed components include high frequency signal pass throughs, capacitors, diodes, transistors, transmission lines, delay lines. Methods for mounting Z-directed components are also provided.

    Abstract translation: 用于插入印刷电路板的Z指向元件的设计，同时允许与PCB所包含的内部导电平面电连接。 在一个实施例中，Z定向部件安装在PCB的厚度内，允许其上的部件安装在其上。 主体可以包含一个或多个导体并且可以包括沿着身体的长度的至少一部分延伸的一个或多个表面通道或孔。 Z指向的组件包括高频信号通过，电容器，二极管，晶体管，传输线，延迟线。 还提供了用于安装Z向定向部件的方法。

    Flexible appliance and related method for orthogonal, non-planar interconnections
    24.
    发明授权
    Flexible appliance and related method for orthogonal, non-planar interconnections 有权
    用于正交非平面互连的柔性设备及相关方法

    公开(公告)号：US07479604B1

    公开(公告)日：2009-01-20

    申请号：US11862760

    申请日：2007-09-27

    Applicant: Brian Smith ,  Hector Deju ,  Scott Burri ,  Larry E. Crider ,  Joseph Kreuzpaintner ,  Gregory M. Jandzio ,  Walter M. Whybrew

    Inventor： Brian Smith ,  Hector Deju ,  Scott Burri ,  Larry E. Crider ,  Joseph Kreuzpaintner ,  Gregory M. Jandzio ,  Walter M. Whybrew

    IPC: H05K1/16

    CPC classification number: H05K1/182 ,  H01Q21/062 ,  H01Q21/26 ,  H05K2201/10356 ,  H05K2201/10681 ,  H05K2201/10893

    Abstract: At least one flexible appliance (120) and related method (300) for orthogonal, non-planar interconnections of at least a first electronic interface (115) disposed on a substrate (110) to an associated second electronic interface (161) positioned beneath the substrate (110). The flexible appliance (120) is comprised of a planar body (121) having at least one electrical connector (122) extending from and orthogonally oriented relative to the planar body (121). In one aspect of the invention, the electrical connector (122) is four electrical connectors (122). There is at least one aperture (112) formed in the substrate (110) for allowing the first electronic interface (115) to be electrically interconnected to the associated second electronic interface (161). The flexible appliance (120) is positioned on the substrate (110) by automated means. Contacts pads (123, 124) on the resilient connector (122) are electrically connected to the second electronic interface (161) and the first electronic interface (115) by automated means such as soldering, thermo sonic bonding, or gap welding.

    Abstract translation: 至少一个柔性器具（120）和相关方法（300），用于将至少第一电子接口（115）布置在基板（110）上的相关联的第二电子接口（161）的正交非平面互连， 基板（110）。 柔性器具（120）由平面体（121）组成，平面主体（121）具有至少一个相对于平面主体（121）延伸并且相对于平面主体（121）定向的电连接器（122）。 在本发明的一个方面，电连接器（122）是四个电连接器（122）。 在衬底（110）中形成有至少一个孔（112），用于允许第一电子接口（115）与相关联的第二电子接口（161）电互连。 柔性器具（120）通过自动化方式定位在基底（110）上。 弹性连接器（122）上的接触垫（123,124）通过诸如焊接，热声波接合或间隙焊接的自动化手段电连接到第二电子接口（161）和第一电子接口（115）。

    Telecommunication main distribution frame structure
    28.
    发明授权
    Telecommunication main distribution frame structure 失效
    电信主配线架结构

    公开(公告)号：US06388895B1

    公开(公告)日：2002-05-14

    申请号：US09842145

    申请日：2001-04-26

    Applicant: Pey-Son Hsu

    Inventor： Pey-Son Hsu

    IPC: H02B101

    CPC classification number: H05K7/1445 ,  H04Q1/14 ,  H04Q2201/12 ,  H05K1/0289 ,  H05K3/403 ,  H05K3/429 ,  H05K7/1444 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/10893

    Abstract: Telecommunication main distribution frame structure including a PC board, several pairs of insertion pins, four insertion seats, four buses, four corresponding insertion seats connected with one end of the buses and four connectors connected with the other end of the buses. The PC board is formed with several insertion holes and soldering holes electrically connected with each other. The insertion seats are soldered at the soldering holes of the PC board. The corresponding insertion seats are inserted in the insertion seats. The PC board has a left board, a middle board and a right boards integrally connected with each other. Each of two openings of the insertion hole is provided with a circle of shallow conductive face divided-by a locating split into a left and a right halves. Each of two openings of the soldering hole is provided with a shallow conductive face. The insertion pin is a rectangular column made of insulating material. Each of two ends thereof is formed with a lip and a resilient well conductive plate is connected between the lips. The insertion pins are inserted into the insertion holes with the conductive plate aimed at the locating split of the insertion hole, whereby the conductive plate is resiliently pressed to contact with the conductive faces of the insertion hole so as to electrically connect the conductive faces.

    Abstract translation: 电信主配线框架结构包括一个PC板，几对插针，四个插座，四个总线，四个相应的插座，与一总线连接，四个连接器与总线的另一端连接。 PC板形成有多个彼此电连接的插入孔和焊接孔。 插入座被焊接在PC板的焊接孔处。 相应的插入座插入到插入座中。 PC板具有彼此整体连接的左板，中板和右板。 插入孔的两个开口中的每一个设置有一个浅导电面的圆，被划分成左半部和右半部的定位分开。 焊接孔的两个开口中的每一个设置有浅导电面。 插销是由绝缘材料制成的矩形柱。 其两个端部中的每一个都形成有唇缘，弹性导电板连接在唇缘之间。 插入销插入到插入孔中，导电板瞄准插入孔的定位分裂，由此导电板被弹性压制以与插入孔的导电面接触，以便电连接导电面。

    Methods for Manufacturing a Z-Directed Printed Circuit Board Component Having a Removable End Portion
    29.
    发明申请
    Methods for Manufacturing a Z-Directed Printed Circuit Board Component Having a Removable End Portion 有权
    制造具有可拆卸端部的Z型定向印刷电路板部件的方法

    公开(公告)号：US20150173207A1

    公开(公告)日：2015-06-18

    申请号：US14631192

    申请日：2015-02-25

    Applicant: Lexmark International, Inc.

    Inventor： Keith Bryan Hardin ,  Paul Kevin Hall ,  Qing Zhang ,  John Thomas Fessler

    IPC: H05K3/30

    CPC classification number: H05K3/301 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10893 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

    Abstract: A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example includes filling a first cavity having a tapered surface with a body material. A first layer of a constraining material is provided on top of the first cavity and has a second cavity having a width that is smaller than the first cavity. The second cavity is filled with the body material. Successive layers of the constraining material are provided on top of the first layer of the constraining material. Cavities of the successive layers of the constraining material are selectively filled with at least the body material to form layers of the main body portion of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

    Abstract translation: 根据一个示例的用于形成用于插入到印刷电路板的安装孔中的Z定向部件的方法包括用主体材料填充具有锥形表面的第一腔体。 约束材料的第一层设置在第一空腔的顶部上，并具有第二腔，其宽度小于第一空腔。 第二个空腔充满了主体材料。 约束材料的连续层设置在约束材料的第一层的顶部上。 约束材料的连续层的空腔至少选择性填充主体材料，以形成Z向分量的主体部分的层。 消融约束材料以将约束材料释放Z定向的成分，并且对Z指向的元件进行烧制。

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