公开(公告)号：US20230326769A1

公开(公告)日：2023-10-12

申请号：US18184670

申请日：2023-03-16

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyoWang KOO ,  SeoJun BAE ,  JungSub LEE

IPC: H01L21/56 ,  H01L25/00

CPC classification number: H01L21/565 ,  H01L25/50

Abstract: A method for making a semiconductor device is provided. The method includes: providing a package including: a substrate including a top surface and a bottom surface; a top electronic component mounted on the top surface of the substrate; at least one conductive pillar formed on the bottom surface of the substrate; and a protection layer attached on the bottom surface of the substrate and covering the at least one conductive pillar; providing a molding apparatus including a top chase and a bottom chase, wherein a molding material is held in the bottom chase; attaching the protection layer onto the top chase of the molding apparatus; and moving the top chase and the bottom chase close to each other to compress the molding material to cover the top electronic component on the top surface of the substrate, thereby forming a top encapsulation on the top surface of the substrate.

公开(公告)号：US20230307414A1

公开(公告)日：2023-09-28

申请号：US18315991

申请日：2023-05-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Wagno Alves Braganca, JR. ,  KyungOe Kim

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: H01L24/97 ,  H01L24/81 ,  H01L24/16 ,  H01L21/6835 ,  H01L21/78 ,  H01L2224/81005 ,  H01L2924/3511 ,  H01L2224/16235 ,  H01L2224/81224 ,  H01L2221/68327 ,  H01L2221/68372 ,  H01L2224/95001

Abstract: A semiconductor device has a semiconductor die and a support tape disposed over a back surface of the semiconductor die opposite an active surface of the semiconductor die. A portion of the back surface of the semiconductor wafer is removed to reduce its thickness. The semiconductor die is part of a semiconductor wafer, and the wafer is singulated to provide the semiconductor die with the support tape disposed on the back surface of the semiconductor die. The support tape can be a polyimide tape. A dicing tape is disposed over the support tape. The semiconductor die is disposed over a substrate. A laser emission is projected onto the semiconductor die to bond the semiconductor die to the substrate. The support tape provides stress relief to avoid warpage of the semiconductor die during the laser emission. The support tape is removed from the back surface of the semiconductor die.

公开(公告)号：US20230275034A1

公开(公告)日：2023-08-31

申请号：US18303308

申请日：2023-04-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US11735530B2

公开(公告)日：2023-08-22

申请号：US17445908

申请日：2021-08-25

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： NamJu Cho ,  YoungCheol Kim ,  HaengCheol Choi

IPC: H01L25/18 ,  H01L23/538 ,  H01L25/00 ,  H01Q1/22

CPC classification number: H01L23/5386 ,  H01L25/18 ,  H01L25/50 ,  H01Q1/2283

Abstract: A semiconductor device has a substrate and a first electrical component disposed over a first surface of the substrate. An RF antenna interposer is disposed over the substrate with the first electrical component connected to a first antenna disposed on a surface of the antenna interposer. An area of the antenna interposer is substantially the same as an area of the substrate. The first antenna disposed on the surface of the antenna interposer has a plurality of islands of conductive material. Alternatively, the first antenna disposed on the surface of the antenna interposer has a spiral shape of conductive material. A second antenna can be disposed on the surface of the antenna interposer connected to a second electrical component disposed over the substrate. A second electrical component can be disposed over a second surface of the substrate opposite the first surface of the substrate.

公开(公告)号：US20230215812A1

公开(公告)日：2023-07-06

申请号：US17647055

申请日：2022-01-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JinHee Jung ,  ChangOh Kim ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/78

Abstract: A semiconductor device has a substrate and a slot formed in the substrate. A first electrical component is disposed over the substrate adjacent to the slot. An encapsulant is deposited over the first electrical component with a surface of the encapsulant coplanar to a surface of the substrate within the slot. A shielding layer is formed over the encapsulant and physically contacting the surface of the substrate within the slot. The substrate is singulated to form a semiconductor package with the first electrical component after forming the shielding layer.

公开(公告)号：US20230170311A1

公开(公告)日：2023-06-01

申请号：US18161693

申请日：2023-01-30

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  SeongHwan Park ,  JinHee Jung

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/48 ,  H01Q1/22 ,  H01L21/56 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/31 ,  H01L21/486 ,  H01Q1/2283 ,  H01L21/56 ,  H01L23/66

Abstract: A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component is disposed over the redistribution layer. An encapsulant is deposited over the electrical component. A second shielding layer is formed over the encapsulant. The second shielding layer is patterned. The patterning of the first shielding layer and second shielding layer can be done with a laser. The second shielding layer can be patterned to form an antenna.

公开(公告)号：US20230125546A1

公开(公告)日：2023-04-27

申请号：US17452489

申请日：2021-10-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyungOe Kim ,  YoungCheol Kim ,  HeeSoo Lee

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/31 ,  H01L31/12 ,  H01L23/538 ,  H01L21/56

Abstract: A semiconductor device has an interposer. A first semiconductor die with a photonic portion is disposed over the interposer. The photonic portion extends outside a footprint of the interposer. The interposer and first semiconductor die are disposed over a substrate. An encapsulant is deposited between the interposer and substrate. The photonic portion remains exposed from the encapsulant.

公开(公告)号：US20230096463A1

公开(公告)日：2023-03-30

申请号：US18060115

申请日：2022-11-30

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Yaojian Lin ,  Kang Chen

IPC: H01L21/66 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H01L21/78 ,  H01L23/28 ,  H01L25/10

Abstract: A semiconductor device has a substrate with first and second conductive layers formed over first and second opposing surfaces of the substrate. A plurality of bumps is formed over the substrate. A semiconductor die is mounted to the substrate between the bumps. An encapsulant is deposited over the substrate and semiconductor die. A portion of the bumps extends out from the encapsulant. A portion of the encapsulant is removed to expose the substrate. An interconnect structure is formed over the encapsulant and semiconductor die and electrically coupled to the bumps. A portion of the substrate can be removed to expose the first or second conductive layer. A portion of the substrate can be removed to expose the bumps. The substrate can be removed and a protection layer formed over the encapsulant and semiconductor die. A semiconductor package is disposed over the substrate and electrically connected to the substrate.

公开(公告)号：US20230077132A1

公开(公告)日：2023-03-09

申请号：US17447001

申请日：2021-09-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Wagno Alves Braganca, JR. ,  KyungOe Kim

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78

Abstract: A semiconductor device has a semiconductor die and a support tape disposed over a back surface of the semiconductor die opposite an active surface of the semiconductor die. A portion of the back surface of the semiconductor wafer is removed to reduce its thickness. The semiconductor die is part of a semiconductor wafer, and the wafer is singulated to provide the semiconductor die with the support tape disposed on the back surface of the semiconductor die. The support tape can be a polyimide tape. A dicing tape is disposed over the support tape. The semiconductor die is disposed over a substrate. A laser emission is projected onto the semiconductor die to bond the semiconductor die to the substrate. The support tape provides stress relief to avoid warpage of the semiconductor die during the laser emission. The support tape is removed from the back surface of the semiconductor die.

公开(公告)号：US11587882B2

公开(公告)日：2023-02-21

申请号：US17163776

申请日：2021-02-01

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： DeokKyung Yang ,  HunTeak Lee ,  HeeSoo Lee ,  Wanil Lee ,  SangDuk Lee

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66

Abstract: A semiconductor device has a substrate comprising a carrier and an interposer disposed on the carrier. An electrical component is disposed over a first surface of the interposer. An interconnect structure is disposed over the first surface of the interposer. An encapsulant is deposited over the electrical component, interconnect structure, and substrate. A trench is formed through the encapsulant and interposer into the carrier. A shielding layer is formed over the encapsulant and into the trench. The carrier is removed after forming the shielding layer.