公开(公告)号：US4263106A

公开(公告)日：1981-04-21

申请号：US108963

申请日：1979-12-31

申请人： Paul A. Kohl

发明人： Paul A. Kohl

IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/60 ,  H05K3/34

CPC分类号： C25D3/36 ,  C25D3/32 ,  C25D3/60 ,  H05K3/3473

摘要： A process for electroplating tin, lead or alloys of tin and lead from aqueous acidic baths. The baths comprise lactones, lactams, cyclic sulfate esters, cyclic imides and cyclic oxazolinones. The additives assist in providing a process which permits high speed plating with excellent layer properties such as smooth platings free from dendritic growth and having constant plating thickness over wide areas.

摘要翻译： 从含水酸性浴中电镀锡，铅或锡的合金的方法。 浴包括内酯，内酰胺，环硫酸酯，环状酰亚胺和环状恶唑啉酮。 添加剂有助于提供允许高速电镀的方法，其具有优异的层性质，例如没有树枝状生长的光滑电镀并且在宽的区域上具有恒定的电镀厚度。

公开(公告)号：US07923194B2

公开(公告)日：2011-04-12

申请号：US12273114

申请日：2008-11-18

申请人： Paul A. Kohl ,  Paul J. Joseph ,  Hollie K. Reed ,  Sue Ann Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

发明人： Paul A. Kohl ,  Paul J. Joseph ,  Hollie K. Reed ,  Sue Ann Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

IPC分类号： G03F7/00 ,  G03F7/004 ,  G03F7/20 ,  G03F7/26

CPC分类号： B81C1/00476 ,  B81C2201/0108 ,  H01L21/7682 ,  Y10S430/114

摘要： Compositions, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary composition, among others, includes a polymer and a catalytic amount of a negative tone photoinitiator.

摘要翻译： 提供了组合物，其使用方法及其分解方法。 一个示例性组合物，其中包括聚合物和催化量的负色调光引发剂。

公开(公告)号：US20100307786A1

公开(公告)日：2010-12-09

申请号：US12797649

申请日：2010-06-10

申请人： Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

发明人： Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

IPC分类号： H05K5/06

CPC分类号： B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： Embodiments of the present disclosure provide systems and methods for producing micro electro-mechanical device packages. Briefly described, in architecture, one embodiment of the system, among others, includes a micro electro-mechanical device formed on a substrate layer; and a thermally decomposable sacrificial structure protecting at least a portion of the micro electro-mechanical device, where the sacrificial structure is formed on the substrate layer and surrounds a gas cavity enclosing an active surface of the micro electro-mechanical device. Other systems and methods are also provided.

摘要翻译： 本公开的实施例提供了用于生产微机电装置包装的系统和方法。 简要描述，在架构中，系统的一个实施例包括形成在基底层上的微电子机械装置; 以及可热分解的牺牲结构，其保护所述微机电装置的至少一部分，其中所述牺牲结构形成在所述基底层上并且围绕包围所述微机电装置的有效表面的气体腔。 还提供了其他系统和方法。

公开(公告)号：US07847669B2

公开(公告)日：2010-12-07

申请号：US11999527

申请日：2007-12-06

申请人： Farrokh Ayazi ,  Mina Raieszadeh ,  Paul A. Kohl

发明人： Farrokh Ayazi ,  Mina Raieszadeh ,  Paul A. Kohl

IPC分类号： H01F5/00 ,  H01F27/28 ,  H01F21/02 ,  H01F21/10 ,  H01G2/00 ,  H01G5/00

CPC分类号： H01F17/0006 ,  H01F21/12 ,  H01F27/022 ,  H01F2017/0086 ,  H01F2021/125

摘要： Disclosed is an integrated tunable inductor having mutual micromachined inductances fabricated in close proximity to a tunable inductor that is switched in and out by micromechanical ohmic switches to change the inductance of the integrated tunable inductor. To achieve a large tuning range and high quality factor, silver is preferably used as the structural material to co-fabricate the inductors and micromachined switches, and silicon is selectively removed from the backside of the substrate. Using this method, exemplary tuning of 47% at 6 GHz is achievable for a 1.1 nH silver inductor fabricated on a low-loss polymer membrane. The effect of the quality factor on the tuning characteristic of the integrated inductor is evaluated by comparing the measured result of substantially identical inductors fabricated on various substrates. To maintain the quality factor of the silver inductor, the device may be encapsulated using a low-cost wafer-level polymer packaging technique.

摘要翻译： 公开了一种集成的可调电感器，其具有相互微机电感应，其紧密接近可调电感器，该可调谐电感器由微机械欧姆开关导入和切出以改变集成可调电感器的电感。 为了实现大的调谐范围和高品质因素，优选使用银作为用于共同制造电感器和微加工开关的结构材料，并且硅从衬底的背面选择性地去除。 使用这种方法，在低损耗聚合物膜上制造的1.1nH银电感器可以实现在6GHz下47％的示例性调谐。 通过比较在各种衬底上制造的基本相同的电感器的测量结果来评估质量因子对集成电感器的调谐特性的影响。 为了保持银电感器的品质因素，可以使用低成本晶圆级聚合物封装技术封装器件。

公开(公告)号：US07799516B2

公开(公告)日：2010-09-21

申请号：US10686697

申请日：2003-10-16

申请人： Paul A. Kohl ,  SueAnn Bidstrup Allen ,  Xiaoqun Wu ,  Clifford Lee Henderson

发明人： Paul A. Kohl ,  SueAnn Bidstrup Allen ,  Xiaoqun Wu ,  Clifford Lee Henderson

IPC分类号： G03F7/40 ,  G03F7/20 ,  G03F7/30 ,  G03F7/36

CPC分类号： G03F7/004 ,  B81B2201/058 ,  B81B2203/0338 ,  B81B2203/0384 ,  B81C1/00103 ,  B81C2201/0108 ,  C08J3/28 ,  C08K5/0041 ,  G03F7/40 ,  Y10T428/24479

摘要： Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.

摘要翻译： 提供聚合物，其使用方法及其分解方法。 一个示例性聚合物，其中包括具有牺牲聚合物和光引发剂的光可定义聚合物。

公开(公告)号：US20100112277A1

公开(公告)日：2010-05-06

申请号：US11657769

申请日：2007-01-25

申请人： Paul Jayachandran Joseph ,  Sue Ann Bidstrup Allen ,  Paul A. Kohl

发明人： Paul Jayachandran Joseph ,  Sue Ann Bidstrup Allen ,  Paul A. Kohl

IPC分类号： B32B3/12 ,  B81B1/00 ,  B32B3/14 ,  B32B27/00

CPC分类号： B32B3/20 ,  B32B17/064 ,  B32B25/08 ,  B32B27/281 ,  B32B27/285 ,  B32B27/38 ,  B32B2363/00 ,  B32B2371/00 ,  B32B2379/08 ,  B81B2201/058 ,  B81C1/00071 ,  Y10T428/24149 ,  Y10T428/24521 ,  Y10T428/24529 ,  Y10T428/24537 ,  Y10T428/24545 ,  Y10T428/24562 ,  Y10T428/24612 ,  Y10T428/24744 ,  Y10T428/2495

摘要： Microstructures and methods of fabricating microstructures are disclosed. One exemplary microstructure, among others, includes a substrate, an overcoat layer disposed upon the substrate, an air-region within at least a portion of the overcoat layer, and a framing material layer engaging at least a portion of the air-region on the inside of the framing material layer and engaging the overcoat layer on the outside of the framing material layer.

摘要翻译： 公开了微结构和微结构制造方法。 一个示例性微观结构，其中包括基底，设置在基底上的外涂层，在外涂层的至少一部分内的空气区域，以及框架材料层，其与所述外涂层上的空气区域的至少一部分接合 在框架材料层的内部并且与框架材料层的外侧上的外涂层接合。

公开(公告)号：US20080073795A1

公开(公告)日：2008-03-27

申请号：US11534668

申请日：2006-09-24

申请人： PAUL A. KOHL ,  ATE HE ,  TYLER OSBORN

发明人： PAUL A. KOHL ,  ATE HE ,  TYLER OSBORN

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/10126 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00

摘要： Integrated circuit interconnection devices and methods are provided. An interconnection to connect components can comprise a first portion, a second portion, and a joining portion. The first portion can extend from a first component, and the first portion can be made with a single conductor. The second portion can extend from a second component, and the second portion can be made with the single conductor. The joining section can be disposed between the first portion and the second portion so that the first component and second component are interconnected to each other to form an interconnect. The joining section can be made of the single conductor so that the interconnect structure consists only of the single conductor. An interconnect can also be formed with two portions, and be formed to have a high-aspect ratio. Other embodiments are also claimed and described.

摘要翻译： 提供集成电路互连设备和方法。 连接组件的互连可以包括第一部分，第二部分和接合部分。 第一部分可以从第一部件延伸，并且第一部分可以由单个导体制成。 第二部分可以从第二部件延伸，并且第二部分可以由单个导体制成。 接合部可以设置在第一部分和第二部分之间，使得第一部件和第二部件彼此互连以形成互连。 接合部分可以由单个导体制成，使得互连结构仅由单个导体组成。 互连也可以形成为两部分，并且形成为具有高纵横比。 还要求保护和描述其它实施例。

公开(公告)号：US07182875B2

公开(公告)日：2007-02-27

申请号：US10695591

申请日：2003-10-28

申请人： Paul Jayachandran Joseph ,  Paul A. Kohl ,  Sue Ann Bidstrup Allen

发明人： Paul Jayachandran Joseph ,  Paul A. Kohl ,  Sue Ann Bidstrup Allen

IPC分类号： C23F1/00

CPC分类号： B32B3/20 ,  B32B17/064 ,  B32B25/08 ,  B32B27/281 ,  B32B27/285 ,  B32B27/38 ,  B32B2363/00 ,  B32B2371/00 ,  B32B2379/08 ,  B81B2201/058 ,  B81C1/00071 ,  Y10T428/24149 ,  Y10T428/24521 ,  Y10T428/24529 ,  Y10T428/24537 ,  Y10T428/24545 ,  Y10T428/24562 ,  Y10T428/24612 ,  Y10T428/24744 ,  Y10T428/2495

摘要： Microstructures and methods of fabricating microstructures are disclosed. One exemplary microstructure, among others, includes a substrate, an overcoat layer disposed upon the substrate, an air-region within at least a portion of the overcoat layer, and a framing material layer engaging at least a portion of the air-region on the inside of the framing material layer and engaging the overcoat layer on the outside of the framing material layer.

摘要翻译： 公开了微结构和微结构制造方法。 一个示例性微观结构，其中包括基底，设置在基底上的外涂层，在外涂层的至少一部分内的空气区域，以及框架材料层，其与所述外涂层上的空气区域的至少一部分接合 在框架材料层的内部并且与框架材料层的外侧上的外涂层接合。

公开(公告)号：US6162838A

公开(公告)日：2000-12-19

申请号：US325977

申请日：1999-06-04

申请人： Paul A. Kohl

发明人： Paul A. Kohl

IPC分类号： C09D5/25 ,  C09D7/12 ,  C09D145/00 ,  C09D183/04 ,  C09D201/00 ,  H01L21/312 ,  H01L21/316 ,  H01L21/318 ,  H01L21/76 ,  H01L21/762 ,  H01L21/768 ,  H01L23/498 ,  H01L23/522 ,  H01L23/532 ,  C09J9/02

CPC分类号： H01L21/762 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3121 ,  H01L21/316 ,  H01L21/31695 ,  H01L21/3185 ,  H01L23/49894 ,  H01L23/5222 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a porous insulating composition comprising the steps of (A) providing at least one organic sacrificial material/dielectric material composition comprising at least one organic sacrificial material and at least one dielectric material; and (B) removing the at least one organic sacrificial material in the at least one organic sacrificial material/dielectric material composition, in order to generate pores in the at least one dielectric material. Also disclosed is a composition useful in making a porous insulator, comprising a heat-activated, pore-forming, sacrificial material; and a dielectric material. Alternatively, the composition useful in making a porous insulator, comprises at least one pore-forming, organic sacrificial material; and at least one dielectric material, wherein the at least one pore-forming, material is a norbornene-type polymer.

公开(公告)号：USPP9125P

公开(公告)日：1995-05-02

申请号：US210711

申请日：1994-03-18

申请人： Paul A. Kohl, deceased ,  by Rosalie K. Buckley, Successor Trustee

发明人： Paul A. Kohl, deceased ,  by Rosalie K. Buckley, Successor Trustee

摘要： The new plant is a hybrid semi-evergreen azalea characterized by compact mounded, branching form and blooms which appear in clusters of two with an occasional cluster of three. The azalea blooms in early April to mid-May in St. Louis, Mo. Blooms measure 1 32/32 to 2 15/32 inches in diameter, usually 1 32/32 to 2 15/32 inches, and are single with five lobes fused at the base with 10 non-petaloid stamens. The blooms are uniform pink with no flecking.