Abstract:
A printed circuit board (PCB) and a fabrication method thereof are disclosed. The PCB includes: a dual-layered circuit pattern formed with a desired pattern on at least one of upper and lower surfaces of an insulation base member (i.e., an insulation substrate) and having metal layers each having a different thermal expansion coefficient; and an insulating layer formed on the insulation base member to cover the circuit pattern. Because the PCB includes an anti-warping unit, a processing rate and productivity can be improved.
Abstract:
Provided is a method for preparing nickel nanoparticles capable of easily controlling particle sizes and shapes of the nickel nanoparticles and obtaining a high yield of the nickel nanoparticles using a process that is simpler than methods used to mass-produce the nickel nanoparticles. The method for preparing nickel nanoparticles may be useful to prepare nickel nanoparticles by mixing a nickel precursor and organic amine to prepare a mixture and heating the mixture.
Abstract:
Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board in accordance with the present invention includes: a circuit laminate, a solder resist laminated on the circuit laminate, a metal support layer formed on the solder resist, a stiffener formed on the metal support layer.
Abstract:
Disclosed is a working panel for a multilayer printed circuit board. The working panel for a multilayer printed circuit board is constructed in a manner such that first and second strips, having circuit layers and insulating layers which are layered on the upper and lower sides of a core in the opposite order with respect to each other, are appropriately disposed, by which the working panel can resist warpage due to thermal stress applied during the substrate fabrication process, thus imparting industrially useful effects that promise improvements in the standardization, productivity and yield of products.
Abstract:
Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.
Abstract:
A method of fabricating a micro drill, which includes a drill part for machining a hole and a shank part fixed to a motor, the drill part and the shank part being made of different materials. The method includes the steps of forming a drill part-forming powder compact having a recess in one end thereof, and forming a shank part-forming powder compact having a protrusion, the protrusion intended to be fitted into the recess of the drill part-forming powder compact, forming an assembly of the drill part-forming powder compact and the shank part-forming powder compact, with the protrusion fitted into the recess, and simultaneously sintering the assembly of the drill part-forming powder compact and the shank part-forming powder compact.
Abstract:
Disclosed herein are a multilayer ceramic electronic component and a method for manufacturing the same. The multilayer ceramic electronic component includes a multilayer body in which dielectric layers and internal electrode layers are alternately stacked and external electrodes, wherein a portion in the internal electrode layers positioned in a marginal portion in which vertically neighboring internal electrode layers in the multilayer body is not overlapped with each other has a thickness thicker than that of a portion of the internal electrode layer positioned in an overlapped portion in which the vertically neighboring internal electrode layers are overlapped with each other, such that an accumulated stepped height difference in the marginal portion is reduced.
Abstract:
An apparatus and method for coding and decoding a depth image are provided. The depth image coding apparatus predicts directivity of a current macro block using coded adjacent macro blocks. An intra-prediction mode that intra-codes the current macro block using the predicted directivity is included in intra-candidate coding modes. Priorities of intra-candidate coding modes and inter-candidate coding modes are arranged according to characteristics of a color image and coded. As a result, coding efficiency for a depth image may be increased.
Abstract:
An image processing apparatus and method using a three-dimensional (3D) image format are provided. According to an embodiment, the 3D image format may be configured to generate a mono video, a stereo video, and a multiview video, so that various images may be outputted through various displays without changing an existing an infrastructure.
Abstract:
Provided is an image processing apparatus. In the case of a multi-view image, the image processing apparatus may warp a color image and/or a depth image of a reference view to correspond to a target view. An occlusion region may be extracted by comparing the warped color image and/or depth image of the reference view with a color image and/or a depth image of the target view. The image processing apparatus may encode the extracted occlusion region information without loss, and decrease an amount of data in the multi-view image.