公开(公告)号：US20110061906A1

公开(公告)日：2011-03-17

申请号：US12654433

申请日：2009-12-18

Applicant: Min Jung Cho ,  Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

Inventor： Min Jung Cho ,  Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

IPC: H05K1/09 ,  B05D5/12

CPC classification number: H05K1/0271 ,  H05K1/09 ,  H05K3/007 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2201/10674

Abstract: A printed circuit board (PCB) and a fabrication method thereof are disclosed. The PCB includes: a dual-layered circuit pattern formed with a desired pattern on at least one of upper and lower surfaces of an insulation base member (i.e., an insulation substrate) and having metal layers each having a different thermal expansion coefficient; and an insulating layer formed on the insulation base member to cover the circuit pattern. Because the PCB includes an anti-warping unit, a processing rate and productivity can be improved.

Abstract translation: 公开了印刷电路板（PCB）及其制造方法。 PCB包括：在绝缘基底（即绝缘基板）的上表面和下表面的至少一个表面上形成具有期望图案并且具有各自具有不同热膨胀系数的金属层的双层电路图案; 以及形成在所述绝缘基底构件上以覆盖所述电路图案的绝缘层。 由于PCB包括抗翘曲单元，因此可以提高加工速度和生产率。

公开(公告)号：US08881381B2

公开(公告)日：2014-11-11

申请号：US12631594

申请日：2009-12-04

Applicant: Mi Sun Hwang ,  Myung Sam Kang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

Inventor： Mi Sun Hwang ,  Myung Sam Kang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

IPC: H05K3/36 ,  H05K3/10 ,  H05K3/20 ,  H05K3/46 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/4685 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括：制备第一载体，其包括在其一侧上形成的第一图案; 制备包括在其一侧上顺序形成的第一阻焊层和第二图案的第二载体; 按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且将第二图案嵌入绝缘层的另一侧，然后移除第一载体和第二载体以制造两个基板 ; 使用粘合层将两个基板彼此连接，使得第一阻焊层彼此面对; 以及形成用于在绝缘层中连接第一图案与第二图案的通孔，在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。

公开(公告)号：US20110067233A1

公开(公告)日：2011-03-24

申请号：US12654669

申请日：2009-12-29

Applicant: Seon Ha Kang ,  Myung Sam Kang ,  Mi Sun Hwang ,  Kil Yong Yun ,  Min Jung Cho ,  Gil Yong Shin ,  Ok Tae Kim

Inventor： Seon Ha Kang ,  Myung Sam Kang ,  Mi Sun Hwang ,  Kil Yong Yun ,  Min Jung Cho ,  Gil Yong Shin ,  Ok Tae Kim

IPC: H05K3/10

CPC classification number: H05K3/465 ,  H05K3/0041 ,  H05K3/045 ,  H05K3/064 ,  H05K3/107 ,  H05K3/108 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/09036 ,  Y10T29/49155

Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.

Abstract translation: 一种制造印刷电路板的方法，所述方法包括：提供具有形成有第一电路图案的第一表面的绝缘基体和与所述第一表面相对的第二表面; 将绝缘基体的第一表面压在绝缘层的至少一个表面上，使得第一电路图案嵌入绝缘层中; 在绝缘基体的第二表面上形成具有所需图案的抗蚀剂; 通过在其上形成有抗蚀剂的绝缘基体的第二表面上进行等离子体处理来形成沟槽; 以及通过用导电材料填充所述沟槽来形成第二电路图案。 因此，可以使用简单的工艺形成导电图案，从而提高处理速度和生产率。

公开(公告)号：US20110061912A1

公开(公告)日：2011-03-17

申请号：US12654668

申请日：2009-12-29

Applicant: Myung Sam Kang ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

Inventor： Myung Sam Kang ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

IPC: H05K1/00 ,  H05K1/11 ,  B32B38/10 ,  B29C65/00

CPC classification number: H05K3/4611 ,  H05K3/045 ,  H05K3/4069 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2203/1461 ,  H05K2203/1536 ,  Y10T156/10

Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.

Abstract translation: 提供了一种印刷电路板（PCB）及其制造方法。 PCB包括堆叠结构，其包括其间插入有第一绝缘层的第二绝缘层和第三绝缘层，以及具有第一至第四导电通孔的导电通孔。 在第一绝缘层中埋设第二层电路图形和第三层电路图案，在第二绝缘层上形成第一层电路图案，在第三绝缘层上形成第四层电路图形。 第一导电通孔连接第一层电路图案和第二层电路图案，第二导电通孔连接第一层电路图案和第三层电路图案，第三导电通孔连接第二层电路图案和 第四层电路图案和第四导电通孔连接第三层电路图案和第四层电路图案。

公开(公告)号：US20100314755A1

公开(公告)日：2010-12-16

申请号：US12511723

申请日：2009-07-29

Applicant: Myung Sam KANG ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

Inventor： Myung Sam KANG ,  Mi Sun Hwang ,  Ok Tae Kim ,  Seon Ha Kang ,  Gil Yong Shin ,  Kil Yong Yun ,  Min Jung Cho

IPC: H01L23/498 ,  H05K1/11 ,  B05D5/12 ,  B32B38/00

CPC classification number: H05K3/46 ,  B32B2309/10 ,  B32B2457/14 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/0064 ,  H05K3/205 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.

Abstract translation: 公开了一种印刷电路板，其包括嵌入在一个表面中的绝缘层的第一电路层，并且包括凸块焊盘和引线接合焊盘，从而实现高密度导线焊盘。 还提供了包括印刷电路板的半导体器件和制造印刷电路板的方法。

公开(公告)号：US20110061905A1

公开(公告)日：2011-03-17

申请号：US12654446

申请日：2009-12-18

Applicant: Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

Inventor： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

IPC: H05K1/03 ,  H05K3/36

CPC classification number: H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

Abstract translation: 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。

公开(公告)号：US08541096B2

公开(公告)日：2013-09-24

申请号：US12654446

申请日：2009-12-18

Applicant: Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

Inventor： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

IPC: H05K1/03 ,  H05K7/02

CPC classification number: H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

Abstract translation: 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。

公开(公告)号：US08415200B2

公开(公告)日：2013-04-09

申请号：US13007444

申请日：2011-01-14

Applicant: Mi Sun Hwang ,  Keung Jin Sohn ,  Eung Suek Lee ,  Myung Sam Kang

Inventor： Mi Sun Hwang ,  Keung Jin Sohn ,  Eung Suek Lee ,  Myung Sam Kang

IPC: H01L23/48

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2203/0384 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.

Abstract translation: 本发明公开了一种半导体封装件的制造方法，该半导体封装件使用基片120，其中第一金属层113，阻挡层115和第二金属层117依次以两个表面层叠在第一金属层113，阻挡层115和第二金属层117上， 同时通过单片工艺制造两个印刷电路板，从而可以提高制造效率; 通过焊料凸块250将半导体芯片300电连接到印刷电路板，从而可以实现高密度封装基板; 并且形成金属柱140而不是层间电路连接所需的通孔，从而可以降低通孔的加工/电镀所需的成本。

公开(公告)号：US20090260868A1

公开(公告)日：2009-10-22

申请号：US12215413

申请日：2008-06-27

Applicant: Chang Gun Oh ,  Mi Sun Hwang ,  Suk Won Lee

Inventor： Chang Gun Oh ,  Mi Sun Hwang ,  Suk Won Lee

IPC: H05K1/00 ,  H05K3/42

CPC classification number: H05K3/4647 ,  H05K3/108 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/09536 ,  H05K2201/09545 ,  H05K2203/0574 ,  H05K2203/0733 ,  Y10T29/49165

Abstract: The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a cylindrical shape, and thus exhibits good interlayer electrical connection and high reliability of physical contact upon thermal stress caused by the variance in physical properties of material depending on changes in temperature. The via has no upper land, and thus a fine circuit pattern of the circuit layer can be formed on the via.

Abstract translation: 印刷电路板包括形成有电镀层的通孔，与通过形成有化学镀层和电镀层并且具有圆柱形状的常规通孔不同，由此表现出良好的层间电连接和由于热应力引起的物理接触的高可靠性 材料的物理性质随温度变化的变化。 通孔没有上部焊盘，因此可以在通孔上形成电路层的精细电路图案。

公开(公告)号：US20090255722A1

公开(公告)日：2009-10-15

申请号：US12213975

申请日：2008-06-26

Applicant: Suk Won Lee ,  Chang Gun Oh ,  Mi Sun Hwang

Inventor： Suk Won Lee ,  Chang Gun Oh ,  Mi Sun Hwang

IPC: H01R12/04 ,  H05K3/00

CPC classification number: H05K3/421 ,  H05K1/116 ,  H05K3/108 ,  H05K2201/09545 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of a second metal and a plating layer made of a third metal, which is different from the second metal, and to a method of manufacturing the same. In the printed circuit board, the via has no upper land, thus making it possible to finely form the circuit pattern which is connected to the via, thereby realizing a high-density circuit pattern.

Abstract translation: 本发明涉及一种具有无轨道通孔的印刷电路板，该无线通孔包括形成在由第一金属制成的通孔上并具有小于通孔直径的线宽的电路图案，其中电路图案包括种子层 由与第二金属不同的第三金属制成的第二金属和镀层制成，以及其制造方法。 在印刷电路板中，通孔没有上部焊盘，从而可以精细地形成连接到通孔的电路图案，从而实现高密度电路图案。