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    CHIP INTEGRATED ION SENSOR
    31.
    发明申请
    CHIP INTEGRATED ION SENSOR 审中-公开
    芯片集成离子传感器

    公开(公告)号：US20110100810A1

    公开(公告)日：2011-05-05

    申请号：US13001804

    申请日：2009-05-19

    Applicant: Matthias Merz

    Inventor： Matthias Merz

    IPC: G01N27/414 ,  H01L29/772 ,  H01L21/335

    CPC classification number: G01N27/227

    Abstract: A chip integrated ion sensor is provided, which comprises a substrate having arranged thereon an electrolyte insulator semiconductor structure and a reference electrode. In particular, the electrolyte insulator semiconductor (EIS) structure may be formed on a chip already processed, i.e. the EIS structure may be formed in a Back End process on an already formed chip comprising a plurality of formed electronic components. In particular, the ion sensor may be adapted to form an ion concentration sensor, e.g. a pH sensor, i.e. may form a pH sensor. The reference electrode may be a non-polarizable electrode. In particular, the reference electrode may comprise Ag or AgCl as material.

    Abstract translation: 提供一种芯片集成离子传感器，其包括其上布置有电解质绝缘体半导体结构和参考电极的基板。 特别地，可以在已经处理的芯片上形成电解绝缘体半导体（EIS）结构，即EIS结构可以在已经形成的包括多个形成的电子部件的芯片的后端工艺中形成。 特别地，离子传感器可以适于形成离子浓度传感器，例如， pH传感器，即可形成pH传感器。 参考电极可以是非极化电极。 特别地，参考电极可以包括Ag或AgCl作为材料。

    FEEDBACK LOOP FOR FOCUSED ULTRASOUND APPLICATION
    32.
    发明申请
    FEEDBACK LOOP FOR FOCUSED ULTRASOUND APPLICATION 审中-公开
    用于聚焦超声波应用的反馈环

    公开(公告)号：US20100041988A1

    公开(公告)日：2010-02-18

    申请号：US12442197

    申请日：2007-09-19

    Applicant: Remco H. W. Pijnenburg ,  Youri V. Ponomarev ,  Matthias Merz

    Inventor： Remco H. W. Pijnenburg ,  Youri V. Ponomarev ,  Matthias Merz

    IPC: A61B8/00 ,  A61N7/00

    CPC classification number: A61B17/2202 ,  A61B17/2256 ,  A61B2017/00106

    Abstract: A method is disclosed using a feedback loop for focused ultrasound application. The method includes the steps of determining a location of a target side within a body using ultrasound waves, applying focused ultrasound waves to the target site, determining a new location of the target site using further ultrasound waves, and adjusting the focused ultrasound waves in response to the new location of the target site.

    Abstract translation: 公开了一种使用聚焦超声应用的反馈回路的方法。 该方法包括以下步骤：使用超声波确定身体内目标侧的位置，向目标位置施加聚焦超声波，使用另外的超声波确定目标位置的新位置，以及响应于调整聚焦超声波 到目标网站的新位置。

    BRANCHING THERAPY ELEMENTS AND METHOD OF THEIR INSERTION INTO LIVING TISSUE
    33.
    发明申请
    BRANCHING THERAPY ELEMENTS AND METHOD OF THEIR INSERTION INTO LIVING TISSUE 审中-公开
    分配治疗单元及其入侵组织的方法

    公开(公告)号：US20100010550A1

    公开(公告)日：2010-01-14

    申请号：US12442528

    申请日：2007-09-20

    Applicant: Youri Ponomarev ,  Matthias Merz ,  Remco Henricus Wilhelmus Pijnenburg

    Inventor： Youri Ponomarev ,  Matthias Merz ,  Remco Henricus Wilhelmus Pijnenburg

    IPC: A61N1/05 ,  A61M31/00 ,  A61B19/00

    CPC classification number: A61N1/0529 ,  A61N1/0534

    Abstract: An implantable medical system for electrical recording and or providing therapy to a plurality of tissue sites without damage to surrounding blood vessels is disclosed comprising: an implant body having a plurality of therapy elements, the elements being hingedly attached at one end to the surface of the body and releasably extendable outward from the surface of the body at the other end; a release mechanism for each of the elements; and a coating material covering the body and the elements; wherein upon dissolution of the coating material after implantation, the release mechanism is capable of causing the elements to extend outward at one end from the surface of the body and into a plurality of tissue sites without damage to the surrounding blood vessels. The method of implanting the system into a body is also disclosed.

    Abstract translation: 公开了一种用于对多个组织部位进行电记录和/或对周围血管的损伤提供治疗的可植入医疗系统，包括：具有多个治疗元件的植入体，所述元件在一端铰接附接到 并且在另一端从主体的表面可释放地向外延伸; 用于每个元件的释放机构; 以及覆盖所述主体和所述元件的涂层材料; 其中，在植入后溶解涂层材料时，释放机构能够使元件在一端从身体的表面向外延伸并且进入多个组织部位而不损坏周围的血管。 还公开了将系统植入体内的方法。

    Sensor
    36.
    发明授权
    Sensor 有权
    传感器

    公开(公告)号：US08925371B2

    公开(公告)日：2015-01-06

    申请号：US13382726

    申请日：2010-07-16

    Applicant: Aurelie Humbert ,  Youri Victorovitch Ponomarev ,  Roel Daamen ,  Matthias Merz

    Inventor： Aurelie Humbert ,  Youri Victorovitch Ponomarev ,  Roel Daamen ,  Matthias Merz

    IPC: G01N7/00 ,  G01N19/10 ,  G01N27/22 ,  G01N33/00

    CPC classification number: G01N27/223 ,  G01N33/004

    Abstract: A sensor (2) for sensing a first substance and a second substance, the sensor comprising first (3) and second (5) sensor components each comprising a first material (20), the first material being sensitive to both the first substance and the second substance, the sensor further comprising a barrier (18) for preventing the second substance from passing into the second sensor component (5).

    Abstract translation: 一种用于感测第一物质和第二物质的传感器（2），所述传感器包括第一（3）和第二（5）个传感器部件，每个传感器部件包括第一材料（20），所述第一材料对第一物质和 第二物质，传感器还包括用于防止第二物质进入第二传感器部件（5）的阻挡层（18）。

    Electrochemical sensor
    37.
    发明授权
    Electrochemical sensor 有权
    电化学传感器

    公开(公告)号：US08864968B2

    公开(公告)日：2014-10-21

    申请号：US12858353

    申请日：2010-08-17

    Applicant: Matthias Merz ,  Youri Victorovitch Ponomarev

    Inventor： Matthias Merz ,  Youri Victorovitch Ponomarev

    IPC: G01N27/333 ,  G01N27/416 ,  G01N27/414

    CPC classification number: G01N27/4167 ,  G01N27/333 ,  G01N27/414 ,  Y10T29/4913

    Abstract: An electrochemical sensor device including a sensor chip having an integrated electrochemical sensor element; and a substrate having a first surface on which the sensor chip is mounted, the substrate comprising a reference electrode structure for the integrated electrochemical sensor element, the reference electrode structure connected to the sensor chip via an electrical connection on the first surface of the substrate.

    Abstract translation: 一种电化学传感器装置，包括具有集成的电化学传感器元件的传感器芯片; 以及基板，其具有安装有传感器芯片的第一表面，所述基板包括用于所述一体化电化学传感器元件的参考电极结构，所述参考电极结构通过所述基板的第一表面上的电连接连接到所述传感器芯片。

    BICOMPATIBLE ELECTRODES
    40.
    发明申请
    BICOMPATIBLE ELECTRODES 有权
    BICOMPATIBLE电极

    公开(公告)号：US20110207239A1

    公开(公告)日：2011-08-25

    申请号：US13126057

    申请日：2009-10-26

    Applicant: Roel Daamen ,  Matthias Merz

    Inventor： Roel Daamen ,  Matthias Merz

    IPC: H01L21/283

    CPC classification number: H01L21/76849 ,  H01L21/32134 ,  H01L21/7684 ,  H01L21/76883

    Abstract: A biocompatible electrode is manufactured by depositing filling metal 36 and etching back the filling metal to the surface of the surrounding insulator 30. Then, a further etch forms a recess 38 at the top of the via 32. An electrode metal 40 is then deposited and etched back to fill the recess 38 and form biocompatible electrode 42. In this way, a planar biocompatible electrode is achieved. The step of etching to form the recess may be carried out in the same CMP tool as is used to etch back the filling metal 36. A hydrogen peroxide etch may be used.

    Abstract translation: 通过沉积填充金属36并将填充金属蚀刻回到周围绝缘体30的表面来制造生物相容性电极。然后，另外的蚀刻在通孔32的顶部形成凹部38.然后沉积电极金属40， 回蚀以填充凹部38并形成生物相容性电极42.以这种方式，实现平面生物相容性电极。 蚀刻形成凹部的步骤可以在与用于回填填充金属36相同的CMP工具中进行。可以使用过氧化氢蚀刻。

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