Abstract:
A method of manufacturing a semiconductor device includes forming first and second gate structures on a substrate in first and second regions, respectively, forming a first capping layer on the substrate by a first high density plasma process, such that the first capping layer covers the first and second gate structures except for sidewalls thereof, removing a portion of the first capping layer in the first region, removing an upper portion of the substrate in the first region using the first gate structure as an etching mask to form a first trench, and forming a first epitaxial layer to fill the first trench.
Abstract:
A semiconductor memory device stably operates over a wide range of the power supply voltage by including a power supply voltage level detector for generating detecting signals according to predetermined levels of the power supply voltage and an oscillator for generating a frequency-controlled oscillation pulse whose frequency is changeable according to the detecting signals. Thus, a boosting ratio of a boosting circuit, the refresh period of a refresh circuit and the substrate voltage of a substrate voltage generator can be adaptively changeable according to the variation of the power supply voltage.
Abstract:
A synchronous dynamic random access memory capable of accessing data in a memory cell array therein in synchronism with a system clock from an external system such as a central processing unit (CPU). The synchronous DRAM receives an external clock and includes a plurality of memory banks each including a plurality of memory cells and operable in either an active cycle or a precharge cycle, a circuit for receiving a row address strobe signal and latching a logic level of the row address strobe signal in response to the clock, an address input circuit for receiving an externally generated address selecting one of the memory banks, and a circuit for receiving the latched logic level and the address from the address input circuit and for outputting an activation signal to the memory bank selected by the address and an inactivation signals to unselected memory banks when the latched logic level is a first logic level, so that the selected memory bank responsive to the activation signal operates in the active cycle while the unselected memory banks responsive to the inactivation signals operate in the precharge cycle.
Abstract:
A synchronous dynamic random access memory capable of accessing data in a memory cell array therein in synchronism with a system clock from an external system such as a central processing unit (CPU). The synchronous DRAM receives an external clock and includes a plurality of memory banks each including a plurality of memory cells and operable in either an active cycle or a precharge cycle, a circuit for receiving a row address strobe signal and latching a logic level of the row address strobe signal in response to the clock, an address input circuit for receiving an externally generated address selecting one of the memory banks, and a circuit for receiving the latched logic level and the address from the address input circuit and for outputting an activation signal to the memory bank selected by the address and an inactivation signals to unselected memory banks when the latched logic level is a first logic level, so that the selected memory bank responsive to the activation signal operates in the active cycle while the unselected memory banks responsive to the inactivation signals operate in the precharge cycle.
Abstract:
A memory cell array includes a plurality of memory blocks, each of which includes normal memory cells and spare memory cells, arranged in arrays having rows and columns. A row or column of spare memory cells in one of the memory cell blocks is substituted for a defective row or column of normal memory cells in the one of the memory blocks, without substituting a row or column of spare memory cells in remaining ones of the memory cell blocks for a row or column of normal memory cells in the remaining ones of the memory blocks. Stated differently, a predetermined row or column of spare memory cells in a first one of the memory blocks is substituted for a first defective row or column of normal memory cells in the first one of the memory blocks, and the predetermined row or column of spare memory cells in a second one of the memory blocks is also substituted for a second defective row or column of normal memory cells in a second one of the memory blocks. Thus, a given row or column of spare memory cells can be used to substitute for different rows or columns of memory cells in each memory block. The number of spare memory cells which is required is thereby reduced.
Abstract:
A synchronous dynamic random access memory capable of accessing data in a memory cell array therein in synchronism with a system clock from an external system such as a central processing unit (CPU). The synchronous DRAM receives an external clock and includes a plurality of memory banks each including a plurality of memory cells and operable in either an active cycle or a precharge cycle, a circuit for receiving a row address strobe signal and latching a logic level of the row address strobe signal in response to the clock, an address input circuit for receiving an externally generated address selecting one of the memory banks, and a circuit for receiving the latched logic level and the address from the address input circuit and for outputting an activation signal to the memory bank selected by the address and an inactivation signals to unselected memory banks when the latched logic level is a first logic level, so that the selected memory bank responsive to the activation signal operates in the active cycle while the unselected memory banks responsive to the inactivation signals operate in the precharge cycle.
Abstract:
An integrated circuit memory device includes a plurality of memory banks. Each of the memory banks includes a first array of at least four memory blocks and a second array of at least four memory blocks wherein each of the memory blocks includes at least two bit lines. Each of the memory blocks from the second array is paired with a respective memory block from the first array and the memory blocks are activated as pairs with at least one pair being activated during a data access operation. Four data lines are provided adjacent the first and second arrays of memory blocks. A plurality of input/output lines directly connects two of the bit lines from each of the memory blocks with two of the input/output lines so that for any pair of the memory blocks, two bit lines from each memory block of the pair are connected to separate data lines.
Abstract:
Disclosed is a composition containing a Dendropanax morbifera extract. The Dendropanax morbifera extract is used as an active ingredient for relieving stress, blocking UV light, and/or diffusing fragrance. The composition includes essential oil extracted from Dendropanax morbifera leaf, stem or sap, in which the Dendropanax morbifera extract is separated under optimal extraction conditions, which are determined by comparing and evaluating the components and yields of the essential oil, thus ensuring maximum efficacy and various applications of Dendropanax morbifera.
Abstract:
A semiconductor device includes a buffer layer on a substrate, the buffer layer having a lattice constant different from that of the substrate, a fin structure upwardly protruding from the buffer layer, a gate electrode crossing over the fin structure, a cladding layer at a side of the fin structure and covering a top surface and sidewalls of the fin structure, and an interfacial layer between the cladding layer and the fin structure, the interfacial layer including a same element as the buffer layer.
Abstract:
A method of manufacturing a semiconductor device includes forming first and second gate structures on a substrate in first and second regions, respectively, forming a first capping layer on the substrate by a first high density plasma process, such that the first capping layer covers the first and second gate structures except for sidewalls thereof, removing a portion of the first capping layer in the first region, removing an upper portion of the substrate in the first region using the first gate structure as an etching mask to form a first trench, and forming a first epitaxial layer to fill the first trench.