Methods of manufacturing semiconductor devices
    1.
    发明授权
    Methods of manufacturing semiconductor devices 有权
    制造半导体器件的方法

    公开(公告)号:US08815672B2

    公开(公告)日:2014-08-26

    申请号:US13223783

    申请日:2011-09-01

    IPC分类号: H01L21/8238

    摘要: A method of manufacturing a semiconductor device includes forming first and second gate structures on a substrate in first and second regions, respectively, forming a first capping layer on the substrate by a first high density plasma process, such that the first capping layer covers the first and second gate structures except for sidewalls thereof, removing a portion of the first capping layer in the first region, removing an upper portion of the substrate in the first region using the first gate structure as an etching mask to form a first trench, and forming a first epitaxial layer to fill the first trench.

    摘要翻译: 一种制造半导体器件的方法包括分别在第一和第二区域的衬底上形成第一和第二栅极结构,通过第一高密度等离子体工艺在衬底上形成第一覆盖层,使得第一覆盖层覆盖第一 以及除了其侧壁之外的第二栅极结构,去除第一区域中的第一覆盖层的一部分,使用第一栅极结构去除第一区域中的衬底的上部,以形成第一沟槽,并形成 第一外延层,以填充第一沟槽。

    SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:US20100001349A1

    公开(公告)日:2010-01-07

    申请号:US12495501

    申请日:2009-06-30

    IPC分类号: H01L27/088

    摘要: A semiconductor device can include a first gate electrode including a gate insulating pattern, a gate conductive pattern and a capping pattern that are sequentially stacked on a semiconductor substrate, and a first spacer of a low dielectric constant disposed on a lower sidewall of the first gate electrode. A second spacer of a high dielectric constant, that is greater than the low dielectric constant, is disposed on an upper sidewall of the first gate electrode above the first spacer.

    摘要翻译: 半导体器件可以包括第一栅电极,其包括依次层叠在半导体衬底上的栅极绝缘图案,栅极导电图案和覆盖图案,以及布置在第一栅极的下侧壁上的低介电常数的第一间隔物 电极。 高介电常数的第二间隔物大于低介电常数,设置在第一间隔物上方的第一栅电极的上侧壁上。

    Circuit in a semiconductor memory for programming operation modes of the
memory
    9.
    发明授权
    Circuit in a semiconductor memory for programming operation modes of the memory 失效
    用于存储器的编程操作模式的半导体存储器中的电路

    公开(公告)号:US5838990A

    公开(公告)日:1998-11-17

    申请号:US905562

    申请日:1997-08-04

    摘要: A synchronous dynamic random access memory capable of accessing data in a memory cell array therein in synchronism with a system clock from an external system such as a central processing unit (CPU). The synchronous DRAM receives an external clock and includes a plurality of memory banks each including a plurality of memory cells and operable in either an active cycle or a precharge cycle, a circuit for receiving a row address strobe signal and latching a logic level of the row address strobe signal in response to the clock, an address input circuit for receiving an externally generated address selecting one of the memory banks, and a circuit for receiving the latched logic level and the address from the address input circuit and for outputting an activation signal to the memory bank selected by the address and an inactivation signals to unselected memory banks when the latched logic level is a first logic level, so that the selected memory bank responsive to the activation signal operates in the active cycle while the unselected memory banks responsive to the inactivation signals operate in the precharge cycle.

    摘要翻译: 能够与来自诸如中央处理单元(CPU)的外部系统的系统时钟同步地访问其中的存储器单元阵列中的数据的同步动态随机存取存储器。 同步DRAM接收外部时钟并且包括多个存储器组,每个存储器组包括多个存储器单元并且可以在有效周期或预充电周期中操作,用于接收行地址选通信号并锁存该行的逻辑电平的电路 响应于时钟的地址选通信号,用于接收选择存储体之一的外部产生的地址的地址输入电路,以及用于从地址输入电路接收锁存的逻辑电平和地址的电路,并将激活信号输出到 当锁存的逻辑电平为第一逻辑电平时,由地址选择的存储器组和对未选择的存储体的失活信号,使得响应于激活信号的所选择的存储器组在活动周期中工作,而未选定的存储器组响应于 灭活信号在预充电循环中工作。

    Synchronous dram having a plurality of latency modes
    10.
    发明授权
    Synchronous dram having a plurality of latency modes 失效
    具有多个等待时间模式的同步电话

    公开(公告)号:US5835956A

    公开(公告)日:1998-11-10

    申请号:US822148

    申请日:1997-03-17

    摘要: A synchronous dynamic random access memory capable of accessing data in a memory cell array therein in synchronism with a system clock from an external system such as a central processing unit (CPU). The synchronous DRAM receives an external clock and includes a plurality of memory banks each including a plurality of memory cells and operable in either an active cycle or a precharge cycle, a circuit for receiving a row address strobe signal and latching a logic level of the row address strobe signal in response to the clock, an address input circuit for receiving an externally generated address selecting one of the memory banks, and a circuit for receiving the latched logic level and the address from the address input circuit and for outputting an activation signal to the memory bank selected by the address and an inactivation signals to unselected memory banks when the latched logic level is a first logic level, so that the selected memory bank responsive to the activation signal operates in the active cycle while the unselected memory banks responsive to the inactivation signals operate in the precharge cycle.

    摘要翻译: 能够与来自诸如中央处理单元(CPU)的外部系统的系统时钟同步地访问其中的存储器单元阵列中的数据的同步动态随机存取存储器。 同步DRAM接收外部时钟并且包括多个存储器组,每个存储器组包括多个存储器单元并且可以在有效周期或预充电周期中操作,用于接收行地址选通信号并锁存该行的逻辑电平的电路 响应于时钟的地址选通信号,用于接收选择存储体之一的外部产生的地址的地址输入电路,以及用于从地址输入电路接收锁存的逻辑电平和地址的电路,并将激活信号输出到 当锁存的逻辑电平为第一逻辑电平时,由地址选择的存储器组和对未选择的存储体的失活信号,使得响应于激活信号的所选择的存储器组在活动周期中工作,而未选定的存储器组响应于 灭活信号在预充电循环中工作。