Abstract:
The present invention relates to a sigma-delta analog-to-digital converter using a mixed mode integrator composed of an analog integrator and a digital integrator, which can prevent the performance degradation due to the saturation of an integrator of the overload of a quantizer. A sigma-delta analog-to-digital converter having an anti-aliasing filter, a sample and hold circuit, a sigma-delta modulator and a decimation filter comprises an overload estimating unit for judging the saturation or overload of an analog integrator; a mixed mode integrator which has the analog integrator and a digital integrator composed of a digital adder and a digital storing unit and integrates the output of the overload estimating unit in analog or digitally; and a quantization unit for converting the output of the mixed mode integrator to a digital signal.
Abstract:
A non-volatile bistable nano-electromechanical switch is provided for use in memory devices and microprocessors. The switch employs carbon nanotubes as the actuation element. A method has been developed for fabricating nanoswitches having one single-walled carbon nanotube as the actuator. The actuation of two different states can be achieved using the same low voltage for each state.
Abstract:
Methods for multiple level program verify, memory devices, and memory systems are provided. In one such method, a series of programming pulses are applied to a memory cell to be programmed. A program verify pulse, at an initial program verify voltage, is applied to the memory cell after each programming pulse. The initial program verify voltage is a verify voltage that has been increased by a quick charge loss voltage. The quick charge loss voltage is subtracted from the initial program verify voltage after either a programming pulse has reached a certain reference voltage or a quantity of programming pulses has reached a pulse count threshold.
Abstract:
A non-volatile bistable nano-electromechanical switch is provided for use in memory devices and microprocessors. The switch employs carbon nanotubes as the actuation element. A method has been developed for fabricating nanoswitches having one single-walled carbon nanotube as the actuator. The actuation of two different states can be achieved using the same low voltage for each state.
Abstract:
A lighting system which automatically assigns a unique address to each lighting device and controls each lighting device assigned the unique address is disclosed. The lighting system may include a plurality of lighting apparatuses, at least one bridge coupled to the plurality of lighting apparatuses, and a lighting controller coupled to the at least one bridge for controlling the lighting apparatuses. One of the at least one bridge or the controller may generate address data for assigning an address to one of the plurality of lighting apparatuses. The plurality of lighting apparatuses may include an LED module, a connection circuit configured to control a connection between the at least one bridge and the plurality of lighting apparatuses, and a controller configured to control the connection circuit based on the address.
Abstract:
A non-volatile bistable nano-electromechanical switch is provided for use in memory devices and microprocessors. The switch employs carbon nanotubes as the actuation element. A method has been developed for fabricating nanoswitches having one single-walled carbon nanotube as the actuator. The actuation of two different states can be achieved using the same low voltage for each state.
Abstract:
A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.
Abstract:
Image processing devices include a color extractor circuit configured to extract color information from input image data, a color shifter circuit configured to color shift the input image data according to the extracted color information and a definition enhancement circuit configured to detect a color difference from the color-shifted image data and to unsharp mask filter the color-shifted image data according to the detected color difference.
Abstract:
A method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. The interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.
Abstract:
Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. According to this invention, the interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.