公开(公告)号：US20090129041A1

公开(公告)日：2009-05-21

申请号：US12232990

申请日：2008-09-26

Applicant: Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

Inventor： Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

IPC: H05K1/14 ,  H05K1/00 ,  H05K7/10

CPC classification number: H05K1/147 ,  H05K1/117 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/10159 ,  H05K2203/1572

Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

Abstract translation: 提供堆叠半导体模块，其制造方法和使用该模块的电子系统。 提供了具有安装在刚性印刷电路板（PCB）上的多个半导体器件和具有安装在柔性PCB上的多个其它半导体器件的第二半导体模块的第一半导体模块。 在刚性PCB上，可以在第一表面上设置数L个第一突出部，并且可以在刚性PCB的第二表面上设置数个K个第二突片。 柔性PCB可以在第三表面上具有数量M的第三突出部，并且在柔性PCB的第四表面上可以具有数目N的第四突出部。 第二突片可以使用导电粘合剂与第三突片组合。 第三突片可以电连接到相应的第二突片。

公开(公告)号：US20080315402A1

公开(公告)日：2008-12-25

申请号：US12146356

申请日：2008-06-25

Applicant: Hyung-Mo Hwang ,  Yong-Hyun Kim ,  Jung-Chan Cho ,  Hyun-Seok Choi

Inventor： Hyung-Mo Hwang ,  Yong-Hyun Kim ,  Jung-Chan Cho ,  Hyun-Seok Choi

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H05K1/189 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/147 ,  H05K1/148 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A printed circuit board, a memory module having the same, and a fabrication method thereof. The printed circuit board includes an interconnection substrate on which electronic components are mounted and in which a plurality of signal lines are arranged. The signal lines are electrically coupled to the electronic components. A heat sink is disposed on one surface of the interconnection substrate to dissipate heat of the electronic components, and in which no signal lines are arranged. The printed circuit board includes a bending substrate coupling the interconnection substrate to the heat sink, and formed of a flexible material configured to be bent.

Abstract translation: 印刷电路板，具有该印刷电路板的存储模块及其制造方法。 印刷电路板包括其上安装有电子部件的互连基板，并且布置有多条信号线。 信号线电耦合到电子部件。 散热器布置在互连基板的一个表面上以散发电子部件的热量，并且其中不布置信号线。 印刷电路板包括将互连基板连接到散热器的弯曲基板，并由构造成弯曲的柔性材料形成。

公开(公告)号：US20080157389A1

公开(公告)日：2008-07-03

申请号：US11968035

申请日：2007-12-31

Applicant: Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

Inventor： Chang-Yong Park ,  Kwang-Ho Chun ,  Dong-Chun Lee ,  Yong-Hyun Kim

IPC: H01L23/48 ,  H05K7/02

CPC classification number: H05K1/111 ,  H01L2924/0002 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09845 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.

Abstract translation: 提供了用于安装它的半导体封装和模块印刷电路板（PCB）。 半导体封装和模块PCB中的每一个包括衬底，设置在衬底的第一区域中的第一类型衬垫结构以及设置在封装衬底的第二区域中的第二类型衬垫结构。 第一型焊盘包括设置在封装衬底上的第一导电焊盘和涂覆在封装衬底上的第一绝缘层。 第一绝缘层具有第一开口，通过该第一开口，第一导电焊盘的侧壁的一部分被暴露，并且部分覆盖第一导电焊盘。 第二类型衬垫包括涂覆在封装衬底上以具有第二开口的第二绝缘层和设置在第二开口中的封装衬底上的具有暴露侧壁的第二导电焊盘。 在这种结构中，半导体封装和模块PCB可以具有优异的耐物理和热应力，以增强结构可靠性。

公开(公告)号：US20080127315A1

公开(公告)日：2008-05-29

申请号：US11982026

申请日：2007-10-31

Applicant: Yong Hyun Kim

Inventor： Yong Hyun Kim

IPC: G06F21/20

CPC classification number: G06F21/10

Abstract: A system for protecting copyrights of digital content includes a digital content server for providing digital content containing an address of a digital content server, performing authentication of the digital content, and generating execution/non-execution information representing an authentication result for the digital content. A mobile terminal receives the execution/non-execution information from the digital content server and executes the digital content according to the execution/non-execution information. A method may include the steps of detecting an address of a digital content server contained in the digital content; accessing the digital content server using the detected address and transmitting identification (ID) information necessary for executing the digital content to the digital content server; performing authentication of the digital content in the digital content server using the ID information, and generating execution/non-execution information representing an authentication result for the digital content, and transmitting the execution/non-execution information to the mobile terminal.

Abstract translation: 用于保护数字内容的版权的系统包括数字内容服务器，用于提供包含数字内容服务器的地址的数字内容，执行数字内容的认证，以及生成表示数字内容的认证结果的执行/不执行信息。 移动终端从数字内容服务器接收执行/不执行信息，并根据执行/不执行信息执行数字内容。 一种方法可以包括以下步骤：检测包含在数字内容中的数字内容服务器的地址; 使用检测到的地址访问数字内容服务器，并向数字内容服务器发送执行数字内容所需的标识（ID）信息; 使用所述ID信息对所述数字内容服务器中的数字内容进行认证，以及生成表示所述数字内容的认证结果的执行/不执行信息，以及将所述执行/不执行信息发送到所述移动终端。

公开(公告)号：US07345181B2

公开(公告)日：2008-03-18

申请号：US10528256

申请日：2003-09-18

Applicant: Yong-Hyun Kim ,  Yiu-Suk Lee

Inventor： Yong-Hyun Kim ,  Yiu-Suk Lee

IPC: C07D307/77

CPC classification number: C07D307/93 ,  C07F7/1892 ,  C07F7/2208 ,  Y02P20/55

Abstract: The present invention provides a process for preparing benzoprostacycline derivatives of formula (1), i.e. 5,6,7-trinor-4,8-inter-m-phenylene PGI2 derivatives, and vinyl tin compounds of formula (III) as starting materials for the same.

Abstract translation: 本发明提供了制备式（1）的苯并前列环素衍生物的方法，即5,6,7-三硝基-4,​​8-​​间 - 间 - 亚苯基PGI 2衍生物和式（III）的乙烯基锡化合物作为起始原料 一样。

公开(公告)号：US07215026B2

公开(公告)日：2007-05-08

申请号：US11246303

申请日：2005-10-11

Applicant: Chang-Yong Park ,  Byung-Man Kim ,  Dong-Chun Lee ,  Yong-Hyun Kim ,  Kwang-Seop Kim ,  Dong-Woo Shin ,  Kwang-Ho Chun

Inventor： Chang-Yong Park ,  Byung-Man Kim ,  Dong-Chun Lee ,  Yong-Hyun Kim ,  Kwang-Seop Kim ,  Dong-Woo Shin ,  Kwang-Ho Chun

IPC: H01L23/12

CPC classification number: H01L23/49811 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K3/303 ,  H05K3/3457 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

Abstract translation: 在一个实施例中，半导体模块包括至少一个半导体芯片封装，具有功能焊盘和虚拟焊盘的板，以及将半导体芯片封装和板的功能焊盘之一电连接的至少一个焊点。 此外，在一个虚拟焊盘上形成至少一个支撑焊料凸块并且设置在半导体芯片封装的一部分之下。 例如，支撑焊料凸块可以设置在半导体芯片封装的外围区域的下方。

公开(公告)号：US20120089373A1

公开(公告)日：2012-04-12

申请号：US13268299

申请日：2011-10-07

Applicant: Sang Gi Hong ,  Nae Soo Kim ,  Yong Hyun Kim ,  Noh Bok Lee

Inventor： Sang Gi Hong ,  Nae Soo Kim ,  Yong Hyun Kim ,  Noh Bok Lee

IPC: G06F15/00

CPC classification number: H04N7/185

Abstract: An apparatus and method for controlling a sensor node are provided that may calculate an azimuth angle and a slope of the sensor node using a 2-axis magnetic sensor and a 3-axis acceleration sensor, and may detect a target approaching the sensor node. The apparatus may include a calculation unit to calculate an azimuth angle and a slope of a sensor node, based on a magnetic values measured by a 2-axis magnetic sensor and a acceleration values measured by a 3-axis acceleration sensor; a sensor control unit to filter the magnetic values and the vibration values and to amplify the filtered magnetic values and the filtered vibration values, when the azimuth angle and the slope are calculated; and a detection unit to detect a target based on the amplified magnetic values and the amplified vibration values.

Abstract translation: 提供一种用于控制传感器节点的装置和方法，其可以使用2轴磁传感器和3轴加速度传感器来计算传感器节点的方位角和斜率，并且可以检测接近传感器节点的目标。 该装置可以包括计算单元，其基于由2轴磁传感器测量的磁值和由3轴加速度传感器测量的加速度值来计算传感器节点的方位角和斜率; 传感器控制单元，当计算所述方位角和斜率时，对所述磁值和所述振动值进行滤波和放大所述滤波后的磁值和滤波后的振动值; 以及检测单元，用于基于放大的磁值和放大的振动值来检测目标。

公开(公告)号：US20120007625A1

公开(公告)日：2012-01-12

申请号：US13165927

申请日：2011-06-22

Applicant: Jung-Hoon Kim ,  Yong-Hyun Kim ,  Seong-Chan Han ,  Kwang-Su Yu ,  Jae-Seon Hwang

Inventor： Jung-Hoon Kim ,  Yong-Hyun Kim ,  Seong-Chan Han ,  Kwang-Su Yu ,  Jae-Seon Hwang

IPC: H01R24/00 ,  H01R13/62 ,  G01R1/06

CPC classification number: H01R12/87 ,  G01R1/0441 ,  H01R2201/20

Abstract: A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.

Abstract translation: 测试插座可以包括插座框架，板，插座销和连接件。 插座框架可以具有配置成接受对象的插槽。 板可以沿着物体的插入方向在槽中自由移动以支撑物体的下表面。 插座销可以沿着与物体的插入方向基本垂直的方向可移动地布置。 插座销可以选择性地与物体的突片接触。 连杆可以枢转地连接到插座销和板。 因此，测试插座的插座销可以避免在插入期间沿着物体的突出部拖动，因此，物体的突片可以避免损坏。

公开(公告)号：US20110258165A1

公开(公告)日：2011-10-20

申请号：US13004498

申请日：2011-01-11

Applicant: Sang-Won JUNG ,  Jun-Seob KIM ,  Yong-Hyun KIM

Inventor： Sang-Won JUNG ,  Jun-Seob KIM ,  Yong-Hyun KIM

IPC: G06F17/30

CPC classification number: G06F21/568

Abstract: The present invention relates to a method and system for automatically verifying a computer vaccine database and, more particularly, to a method and system for automatically verifying a computer vaccine database, which is capable of automatically verifying and modifying a vaccine database mounted on a vaccine engine so that a normal program is not recognized as viruses or malicious codes by storing information about the normal program in the vaccine database in order to remove computer viruses or malicious codes. According to the present invention, a file set of the latest vaccine database can be rapidly collected and processed, and the problems of a vaccine database file provided by a vendor can be checked in advance. Accordingly, there are advantages in that a function of alarming error conditions and a process of reporting error in a vaccine database update process can be automated.

Abstract translation: 本发明涉及一种用于自动验证计算机疫苗数据库的方法和系统，更具体地，涉及一种用于自动验证计算机疫苗数据库的方法和系统，其能够自动验证和修改安装在疫苗引擎上的疫苗数据库 以便通过在疫苗数据库中存储有关正常程序的信息来清除计算机病毒或恶意代码，从而不会将正常程序识别为病毒或恶意代码。 根据本发明，可以快速收集和处理最新疫苗数据库的文件集，并且可以提前检查供应商提供的疫苗数据库文件的问题。 因此，具有以下优点：疫苗数据库更新处理中的报警错误状况和报告错误处理的功能可以自动化。

公开(公告)号：US08003018B2

公开(公告)日：2011-08-23

申请号：US12285658

申请日：2008-10-10

Applicant: Jae Hwi Cho ,  Kuninori Okamoto ,  Yong Hyun Kim ,  Hyun Don Kim

Inventor： Jae Hwi Cho ,  Kuninori Okamoto ,  Yong Hyun Kim ,  Hyun Don Kim

IPC: H01B1/22 ,  B05D5/12 ,  H01L31/0224

CPC classification number: H01J11/22 ,  B22F1/0055 ,  B22F1/0074 ,  H01J9/02 ,  H01J11/12 ,  H01J2211/225

Abstract: A composition for fabricating an electrode includes an organic binder and a conductive filler. About 3 to about 60 wt. % of the composition is the organic binder, about 5 to about 95 wt. % of the composition is the conductive filler, the conductive filler includes predominantly aluminum, the conductive filler has a flake shape, and the conductive filler has an average thickness of about 0.05 μm to about 0.75 μm.

Abstract translation: 用于制造电极的组合物包括有机粘合剂和导电填料。 约3至约60wt。 组合物的％为有机粘合剂，约5至约95wt。 组成的％是导电填料，导电填料主要包括铝，导电填料具有薄片形状，导电填料的平均厚度约为0.05μm至约0.75μm。