公开(公告)号：US10149521B2

公开(公告)日：2018-12-11

申请号：US15728349

申请日：2017-10-09

Applicant: Apple Inc.

Inventor： Andrzej T. Baranski ,  Serhan O. Isikman ,  Tyler S. Bushnell ,  Steven J. Martisauskas ,  David I. Nazzaro

IPC: A44C5/00 ,  A44C5/20 ,  A45F5/00 ,  A61B5/00 ,  A44C5/08

Abstract: Systems and methods for dynamically adjusting the fit of a wearable electronic device are disclosed. In many embodiments, a tensioner associated with a wearable electronic device can control one or more actuators that are mechanically coupled to either the housing or to a band attached to the wearable electronic device. In one example, in response to a signal to increase the tightness of the band, the tensioner can cause the actuator(s) to increase the tension within the band.

公开(公告)号：US09946297B2

公开(公告)日：2018-04-17

申请号：US14632924

申请日：2015-02-26

Applicant: APPLE INC.

Inventor： David I. Nazzaro ,  Tyler S. Bushnell ,  Javier Mendez

IPC: H01F27/42 ,  H01F37/00 ,  H01F38/00 ,  G06F1/16 ,  A61B5/00 ,  H02J5/00 ,  H02J7/02 ,  G04G19/10 ,  G04C10/00 ,  G04G21/02 ,  G04G21/04 ,  H02J7/00 ,  H02J50/10

CPC classification number: G06F1/163 ,  A61B5/681 ,  G04C10/00 ,  G04G19/10 ,  G04G21/02 ,  G04G21/025 ,  G04G21/04 ,  H02J5/005 ,  H02J7/0044 ,  H02J7/025 ,  H02J50/10

Abstract: An auxiliary electronic device attachable to a wearable electronic device. The auxiliary device includes a housing, electronic circuitry within the housing, and an attachment mechanism configured to attach the auxiliary electronic device to the wearable device while the device is being worn by a user. In some embodiments the electronic circuitry includes a power transmitting unit that can wirelessly transmit power to charge a rechargeable battery within the wearable electronic device. In some embodiments the attachment mechanism includes a pair of lugs that extend, from opposite ends of the housing, above the housing towards a center of the auxiliary device and are adapted to fit within corresponding recesses of the wearable electronic device.

公开(公告)号：US09911551B2

公开(公告)日：2018-03-06

申请号：US15017417

申请日：2016-02-05

Applicant: APPLE INC.

Inventor： Tyler S. Bushnell ,  David I. Nazzaro ,  Benjamin J. Kallman

IPC: H01R13/44 ,  H01H13/00

CPC classification number: H01H13/00 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1671 ,  H01R13/703

Abstract: An electronic device has a concealed external electrical connector that may be activated by a pin of a mating connector. When the pin applies a force to an electrically conductive and flexible region of an exterior housing of an electronic device the electrically conductive region deflects inwards coupling to a contact within the electronic device. A bi-directional communications path is then established from the pin of the connector, through the conductive portion of the housing, to the contact and to circuitry within the housing of the electronic device.

公开(公告)号：US09888561B2

公开(公告)日：2018-02-06

申请号：US14804486

申请日：2015-07-21

Applicant: Apple Inc.

Inventor： Ryan C. Perkins ,  Trevor J. Ness ,  Tyler S. Bushnell ,  Steven P. Cardinali

IPC: H05K1/16 ,  H05K1/02 ,  H01L23/60 ,  H05K1/18 ,  H05K7/00 ,  H05K9/00 ,  H01L31/048 ,  H01L23/00 ,  H01L23/28 ,  H05K1/14 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H01L23/28 ,  H01L23/564 ,  H01L23/60 ,  H01L31/048 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/147 ,  H05K1/167 ,  H05K1/185 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/0133 ,  H05K2201/0707 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10371 ,  H05K2201/10977 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: Electrical components such as integrated circuits and other components may be mounted on a substrate such as a printed circuit substrate. A molded plastic cap may cover the components and a portion of the printed circuit substrate to form a packaged electrical device. Metal structures such as springs, posts, and other metal members may be insert molded within the plastic cap. A metal layer on the surface of the cap may be patterned to from electromagnetic shielding, signal paths, contact pads, sensor electrodes, antennas, and other structures. Multiple substrates each with a respective set of mounted electrical components may be joined using a flexible printed circuit. The flexible printed circuit may be covered with a rigid cap portion or an elastomeric material or may be left uncovered.

公开(公告)号：US09867285B2

公开(公告)日：2018-01-09

申请号：US14843000

申请日：2015-09-02

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Tyler S. Bushnell ,  Jason C. Sauers

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0295 ,  H05K3/301 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/094 ,  H05K2201/09954 ,  H05K2201/1031 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10962 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.

公开(公告)号：US20170082433A1

公开(公告)日：2017-03-23

申请号：US14857540

申请日：2015-09-17

Applicant: Apple Inc.

Inventor： Edward S. Huo ,  Scott A. Myers ,  Martin J. Auclair ,  William C. Lukens ,  Tyler S. Bushnell

IPC: G01C13/00 ,  G01F23/14

CPC classification number: G01C5/06 ,  A61B5/6802 ,  A61B5/681 ,  A61B2562/0261 ,  G01L1/00 ,  G01L1/26 ,  G01L23/10 ,  G04G21/02 ,  G04G21/08 ,  G06F1/163 ,  G06F1/1684 ,  G06F3/0362

Abstract: An electronic device includes at least a housing having a force transmissive surface capable of receiving a force, a force sensor configured to sense the force received from the force transmissive surface in accordance with a force path and respond by outputting a signal that indicates a magnitude of the force at a first sensitivity level when the magnitude of the force is less than a threshold level, otherwise, the signal indicates the magnitude of the force in accordance with a second sensitivity level. The electronic device includes a processor in communication with the force sensor that uses the signal to alter an operation of the electronic device. In one embodiment, the electronic device is wearable.

公开(公告)号：US20160258981A1

公开(公告)日：2016-09-08

申请号：US14641150

申请日：2015-03-06

Applicant: Apple Inc.

Inventor： Tyler S. Bushnell ,  Vikram Garg

IPC: G01R1/04 ,  H05K3/10 ,  G06F3/044

CPC classification number: G01R1/04 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  H05K3/0014 ,  H05K3/103 ,  H05K3/105 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/10151

Abstract: Capacitive sensor assemblies for electronic devices, and methods of forming capacitive sensor assemblies. The capacitive sensor assembly may include a top component having an intermediate layer formed on the top component, a bottom component positioned opposite the top component, a silicone layer positioned between the top component and the bottom component, and a first electrical trace positioned adjacent the silicone layer.

Abstract translation: 用于电子设备的电容式传感器组件，以及形成电容式传感器组件的方法。 电容传感器组件可以包括顶部部件，其具有形成在顶部部件上的中间层，与顶部部件相对定位的底部部件，位于顶部部件和底部部件之间的硅树脂层，以及邻近硅氧烷定位的第一电迹线 层。

公开(公告)号：US20160204537A1

公开(公告)日：2016-07-14

申请号：US15079785

申请日：2016-03-24

Applicant: APPLE INC.

Inventor： David I. Nazzaro ,  Tyler S. Bushnell ,  Ibuki Kamei

IPC: H01R13/44 ,  H01R13/52

CPC classification number: H01R13/5216 ,  H01R13/44 ,  H01R13/453 ,  H01R13/46 ,  H01R13/52 ,  H01R24/58

Abstract: An electronic device has a self-healing elastomer applied over one or more external electronic connectors. The self-healing elastomer may obscure the electronic connectors from the user as well as provide environmental protection for the connector and the electronic device. Electronic probes may temporarily penetrate the self-healing elastomer to mate with the electronic connector. After removal of the probes the self-healing elastomer may elastically reform and self-heal.

公开(公告)号：US20160064719A1

公开(公告)日：2016-03-03

申请号：US14832683

申请日：2015-08-21

Applicant: Apple Inc.

Inventor： Tyler S. Bushnell ,  Charles W. Werley ,  Richard M. Mank ,  Xiaoyun Hu ,  Thai T. Ton ,  George V. Anastas ,  Vijayasekaran Boovaragavan

IPC: H01M2/22 ,  H01M2/34 ,  B23K26/22 ,  H01M10/42

CPC classification number: H01M2/22 ,  B23K26/22 ,  B23K26/323 ,  B23K2101/36 ,  B23K2101/38 ,  B23K2103/10 ,  B23K2103/18 ,  B23K2103/26 ,  H01M10/425

Abstract: A battery assembly includes a battery cell with leads extending from the battery and a circuit including a substrate and contacts that extend from the substrate. The leads are coupled to the contacts by mechanical or adhesive bonds located on sections of the contacts extending from the substrate. In various implementations, the circuit may include a variety of different components coupled to the substrate. Such components may be operable to perform a variety of functions such as regulating, monitoring, controlling, and/or otherwise managing the battery cell. Such components may include one or more battery management units, safety circuits, capacity gauges, and/or other components.

Abstract translation: 电池组件包括具有从电池延伸的引线的电池单元和包括基板和从基板延伸的触点的电路。 引线通过位于从基板延伸的触点的部分上的机械或粘合剂结合到触头。 在各种实现中，电路可以包括耦合到衬底的各种不同的组件。 这样的组件可以用于执行各种功能，例如调节，监视，控制和/或以其他方式管理电池单元。 这样的组件可以包括一个或多个电池管理单元，安全电路，容量计和/或其他组件。

公开(公告)号：US20150346782A1

公开(公告)日：2015-12-03

申请号：US14295051

申请日：2014-06-03

Applicant: Apple Inc.

Inventor： Tyler S. Bushnell ,  Jason C. Sauers

IPC: G06F1/18 ,  H05K3/00

CPC classification number: G06F1/181 ,  G06F1/1679 ,  G06F1/183 ,  H01R4/726 ,  H05K13/00 ,  Y10T29/49119

Abstract: An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.

Abstract translation: 电子设备具有使用附接结构组装的结构。 附件结构改变形状以帮助将电子设备结构连接在一起。 可以连接在一起的结构可以包括电子设备外壳结构，显示结构，内部设备部件，电气部件以及电子设备的其它部分。 附接结构可以包括热激活附着结构，使用其他类型的施加能量激活的结构，以及由于施加化学物质或其它处理而改变形状的结构。