公开(公告)号：US20100094320A1

公开(公告)日：2010-04-15

申请号：US12614006

申请日：2009-11-06

申请人： Vacit Arat ,  Richard T. Cohen ,  Ming Ting Wu ,  Pavel B. Lembrikov ,  Adam L. Cohen

发明人： Vacit Arat ,  Richard T. Cohen ,  Ming Ting Wu ,  Pavel B. Lembrikov ,  Adam L. Cohen

IPC分类号： A61B17/22

CPC分类号： A61B17/320725 ,  A61B17/320758 ,  A61B2017/003 ,  A61B2017/22071 ,  A61B2017/320004 ,  A61B2017/320008

摘要： Embodiments are directed to devices for removing material from interior walls of vessels such as during atherectomy or thrombectomy procedures where the devices includes an ablation tool and at least one ablation tool stabilizer that can be used to radially position the ablation tool at desired locations within a vessel. In some embodiments, the ablation tool may a rotary cutting element that has an axis of rotation that is approximately parallel to the local axis of a vessel to be cleared. In some embodiments, the ablation tool may have a single side and or a top that allows clearing of material and which is capable of both radial positioning and rotational positioning via the stabilization device or devices and which may also be capable of axial motion via the stabilization device.

摘要翻译： 实施例涉及用于从血管内壁移除材料的装置，例如在动脉粥样硬化切除术或血栓切除术过程期间，其中装置包括消融工具和至少一个消融工具稳定器，其可用于将消融工具径向定位在容器内的期望位置处 。 在一些实施例中，消融工具可以具有旋转切割元件，旋转切割元件具有大致平行于待清除的容器的局部轴线的旋转轴线。 在一些实施例中，消融工具可以具有允许清除材料并且能够经由稳定装置或装置进行径向定位和旋转定位的单侧和/或顶部，并且还可以通过稳定性轴向运动 设备。

公开(公告)号：US20080142369A1

公开(公告)日：2008-06-19

申请号：US11943536

申请日：2007-11-20

申请人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard

发明人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard

IPC分类号： C25D5/02

CPC分类号： C25D1/003 ,  C23C18/16 ,  C23C18/1605 ,  C23C18/1651 ,  C25D5/02 ,  C25D5/022 ,  C25D5/10 ,  H01L21/48 ,  H01L21/4857 ,  H01L21/50 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2224/0401 ,  H01L2924/014

摘要： Embodiments of the invention provide a package for holding an integrated circuit or other electronic component and/or a packaged integrated circuit or electronic component which is formed at least in part via an electrochemical fabrication process from a plurality of adhered layers of conductive and dielectric materials.

摘要翻译： 本发明的实施例提供一种用于保持集成电路或其它电子部件和/或封装的集成电路或电子部件的封装，所述集成电路或电子部件至少部分地通过电化学制造工艺从多个粘附的导电和介电材料层形成。

公开(公告)号：US07363705B2

公开(公告)日：2008-04-29

申请号：US11028962

申请日：2005-01-03

申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

IPC分类号： H01R9/00

CPC分类号： G01R3/00 ,  G01R1/06744 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49222

摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US20130045774A1

公开(公告)日：2013-02-21

申请号：US13558270

申请日：2012-07-25

申请人： Vacit Arat

发明人： Vacit Arat

IPC分类号： H04W88/02

CPC分类号： G06F3/0321 ,  G06F1/1694 ,  G06F3/03545 ,  G06F2200/1637

摘要： Embodiments are directed to apparatus, methods and systems for capturing and using writing or drawing motions made while holding a handheld electronic device (e.g. smart phone) that include one or more of a variety of sensors (e.g. inertial sensors, touch sensors, pressure sensors, optical sensors, and the like). The writing or drawing movements are processed into writing or drawing data that may be used as communication data or as verification data when compared to previously recorded data.

摘要翻译： 实施例涉及用于捕获和使用在保持包括各种传感器（例如惯性传感器，触摸传感器，压力传感器等）中的一个或多个的手持电子设备（例如智能电话）时进行的书写或绘图动作的装置，方法和系统， 光学传感器等）。 写入或绘图移动被处理为可以用作通信数据的写入或绘图数据，或者与之前记录的数据相比时作为验证数据。

公开(公告)号：US20080168309A1

公开(公告)日：2008-07-10

申请号：US11424610

申请日：2006-06-16

申请人： Bulent Dervisoglu ,  Laurence H. Cooke ,  Vacit Arat

发明人： Bulent Dervisoglu ,  Laurence H. Cooke ,  Vacit Arat

IPC分类号： G06F11/00

CPC分类号： G01R31/318572 ,  G01R31/31705 ,  G01R31/31723 ,  G01R31/318385 ,  G01R31/318566

摘要： An integrated circuit is described that includes a stored program processor for test and debug of user-definable logic plus external interface between the test/debug circuits and the component pins. The external interface may be via an existing test interface or a separate serial or parallel port. Test and debug circuits may contain scan strings that may be used to observe states in user-definable logic or be used to provide pseudo-random bit sequences to user-definable logic. Test and debug circuits may also contain an on-chip logic analyzer for capturing sequences of logic states in user-definable circuits. Test and debug circuits may be designed to observe states in user-definable circuits during the normal system operation of said user-definable circuits.

摘要翻译： 描述了一种集成电路，其包括存储的程序处理器，用于测试和调试用户可定义逻辑以及测试/调试电路和组件引脚之间的外部接口。 外部接口可以通过现有的测试接口或单独的串行或并行端口。 测试和调试电路可能包含可用于观察用户可定义逻辑状态的扫描串，或用于向用户定义的逻辑提供伪随机位序列。 测试和调试电路还可以包含用于捕获用户可定义电路中的逻辑状态序列的片上逻辑分析器。 测试和调试电路可以被设计为在所述用户可定义电路的正常系统操作期间观察用户可定义电路中的状态。

公开(公告)号：US20080105558A1

公开(公告)日：2008-05-08

申请号：US11927680

申请日：2007-10-30

申请人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

发明人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC分类号： C25D5/10

CPC分类号： B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

摘要翻译： 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20070045121A1

公开(公告)日：2007-03-01

申请号：US11435809

申请日：2006-05-16

申请人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

发明人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC分类号： C25D5/02

CPC分类号： B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

摘要翻译： 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20100162046A1

公开(公告)日：2010-06-24

申请号：US12717391

申请日：2010-03-04

申请人： Bulent Dervisoglu ,  Laurence H. Cooke ,  Vacit Arat

发明人： Bulent Dervisoglu ,  Laurence H. Cooke ,  Vacit Arat

IPC分类号： G06F11/26

CPC分类号： G01R31/318572 ,  G01R31/31705 ,  G01R31/31723 ,  G01R31/318385 ,  G01R31/318566

摘要： An integrated circuit is described that includes a stored program processor for test and debug of user-definable logic plus external interface between the test/debug circuits and the component pins. The external interface may be via an existing test interface or a separate serial or parallel port. Test and debug circuits may contain scan strings that may be used to observe states in user-definable logic or be used to provide pseudo-random bit sequences to user-definable logic. Test and debug circuits may also contain an on-chip logic analyzer for capturing sequences of logic states in user-definable circuits. Test and debug circuits may be designed to observe states in user-definable circuits during the normal system operation of said user-definable circuits.

摘要翻译： 描述了一种集成电路，其包括存储的程序处理器，用于测试和调试用户可定义逻辑以及测试/调试电路和组件引脚之间的外部接口。 外部接口可以通过现有的测试接口或单独的串行或并行端口。 测试和调试电路可能包含可用于观察用户可定义逻辑状态的扫描串，或用于向用户定义的逻辑提供伪随机位序列。 测试和调试电路还可以包含用于捕获用户可定义电路中的逻辑状态序列的片上逻辑分析器。 测试和调试电路可以被设计为在所述用户可定义电路的正常系统操作期间观察用户可定义电路中的状态。

公开(公告)号：US20080111573A1

公开(公告)日：2008-05-15

申请号：US11929487

申请日：2007-10-30

申请人： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Vacit Arat ,  Daniel I. Feinberg

发明人： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Vacit Arat ,  Daniel I. Feinberg

IPC分类号： G01R1/067 ,  G01R31/02

CPC分类号： G01R3/00 ,  G01R1/06722 ,  G01R1/06738 ,  G01R1/0675 ,  G01R1/07314

摘要： Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

摘要翻译： 提供引脚探针和引脚探针阵列，其允许用选定的电子电路部件进行电接触。 一些实施例包括位于护套内的一个或多个柔性销元件。 一些实施例包括销探针，其包括可用于将探针的引脚部分固定到护套中的锁定或闭锁元件。 一些实施例提供使用多层电化学制造方法制造探针。

公开(公告)号：US20070198038A1

公开(公告)日：2007-08-23

申请号：US11625807

申请日：2007-01-22

申请人： Adam Cohen ,  Vacit Arat ,  Dennis Smalley

发明人： Adam Cohen ,  Vacit Arat ,  Dennis Smalley

IPC分类号： A61B17/04

CPC分类号： A61B17/0401 ,  A61B17/0469 ,  A61B17/0482 ,  A61B17/0487 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/0462 ,  A61B2017/0488 ,  A61B2017/0496 ,  A61B2017/06052 ,  A61B2017/06176 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10

摘要： Embodiments of invention are directed to micro-scale of mesoscale tissue approximation instruments that may be delivered to the body of a patient during minimally invasive or other surgical procedures. In one group of embodiments, the instrument has an elongated (longitudinal) configuration while with two sets of expandable wings that each have a toggle configuration that can be made to expand when located on opposite sides of a distal tissue region and a proximal tissue region and can then be made to move toward one another to bring the two tissue regions into more a proximal position. In some embodiments, multiple tissue approximation instruments are located within a delivery system for sequential delivery to a patient's body.

摘要翻译： 本发明的实施例涉及可在微创或其它外科手术过程中递送至患者体内的中尺度组织近似仪器的微尺度。 在一组实施例中，仪器具有细长（纵向）构造，同时具有两组可扩张翼，每组具有肘节配置，当位于远端组织区域和近端组织区域的相对侧时，可以使其膨胀， 然后可以使得彼此移动以使两个组织区域进入更靠近的位置。 在一些实施例中，多个组织近似仪器位于递送系统内，用于顺序递送给患者的身体。