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    Electrochemical fabrication method including elastic joining of structures
    1.
    发明授权
    Electrochemical fabrication method including elastic joining of structures 有权
    包括结构弹性连接的电化学制造方法

    公开(公告)号：US08070931B1

    公开(公告)日：2011-12-06

    申请号：US12345624

    申请日：2008-12-29

    申请人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Dennis R. Smalley

    发明人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC分类号： C25D5/02

    CPC分类号： B29C65/56 ,  B33Y10/00 ,  C25D5/02 ,  Y10T29/49885

    摘要： Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second elements is not accessible to the retention region of the first element.

    摘要翻译： 实施例涉及用于形成多层三维结构的方法，所述多层三维结构涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层三维结构，其中通过以下之一进行接合：（ 1）弹性变形和弹性恢复以及随后元件相对于彼此的保留，（2）至少一个元件的初始部分相对于至少一个元件的另一部分的相对变形，直到至少两个元件处于 期望的保持位置，在此之后，变形被减小或消除，并且至少一个元件的一部分进入位置，其又通过彼此接触将至少两个元件锁定在一起，包括与至少一个元件的初始部分的接触， 或（3）将一个元件的保持区域移动到另一个元件的保持区域中，而不会使任一元件变形，沿着包括装载物 g区域，并且其中在正常使用期间，第一和第二元件相对于彼此构造，使得第二元件的加载区域不能被第一元件的保持区域访问。

    Microneedles, Microneedle Arrays, Methods for Making, and Transdermal and/or Intradermal Applications
    4.
    发明申请
    Microneedles, Microneedle Arrays, Methods for Making, and Transdermal and/or Intradermal Applications 审中-公开
    微针，微针阵列，制造方法和透皮和/或内皮应用

    公开(公告)号：US20100121307A1

    公开(公告)日：2010-05-13

    申请号：US12611108

    申请日：2009-11-02

    申请人： Michael S. Lockard ,  Vacit Arat ,  Adam L. Cohen ,  Kirk G. Nielsen

    发明人： Michael S. Lockard ,  Vacit Arat ,  Adam L. Cohen ,  Kirk G. Nielsen

    IPC分类号： A61M5/32

    CPC分类号： A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0046 ,  A61M2037/0053

    摘要： Embodiments are directed to microneedle array devices for intradermal and/or transdermal interaction with the body of patient to provide therapeutic, diagnostic or preventative treatment wherein portions of the devices may be formed by multi-layer, multi-material electrochemical fabrication methods and wherein individual microneedles may include valve elements or other elements for controlling interaction (e.g. fluid flow). In some embodiments needles are retractable and extendable from a surface of the device. In some embodiments, interaction occurs automatically with movement across the skin of the patient while in other embodiments interaction is controlled by an operator (e.g. doctor, nurse, technician, or patient).

    摘要翻译： 实施例涉及用于与患者体内皮内和/或透皮相互作用的微针阵列装置，以提供治疗，诊断或预防性治疗，其中装置的部分可以通过多层多材料电化学制造方法形成，并且其中单个微针 可以包括用于控制相互作用（例如流体流动）的阀元件或其它元件。 在一些实施例中，针可从装置的表面缩回并延伸。 在一些实施例中，通过穿过患者皮肤的运动自动发生相互作用，而在其他实施例中，相互作用由操作者（例如医生，护士，技术人员或患者）控制。

    Microprobe tips and methods for making
    5.
    发明授权
    Microprobe tips and methods for making 有权
    微型笔尖和制作方法

    公开(公告)号：US07412767B2

    公开(公告)日：2008-08-19

    申请号：US11029217

    申请日：2005-01-03

    申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

    发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

    IPC分类号： H01R43/02 ,  H01R9/00

    CPC分类号： G01R1/0483 ,  G01R1/06716 ,  G01R1/07357 ,  G01R31/2886 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/49213

    摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

    摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

    Fabrication process for co-fabricating multilayer probe array and a space transformer
    7.
    发明授权
    Fabrication process for co-fabricating multilayer probe array and a space transformer 失效
    共同制造多层探针阵列和空间变压器的制造工艺

    公开(公告)号：US07640651B2

    公开(公告)日：2010-01-05

    申请号：US11028945

    申请日：2005-01-03

    申请人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Christopher A. Bang ,  Pavel B. Lembrikov

    发明人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Christopher A. Bang ,  Pavel B. Lembrikov

    IPC分类号： H01F3/04 ,  H01F7/06

    CPC分类号： G01R3/00 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06716 ,  G01R1/07378 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49078 ,  Y10T29/49204 ,  Y10T29/49222

    摘要： Embodiments of the invention provide fabrication processes for the co-fabrication of microprobe arrays along with one or more space transformers wherein the fabrication processes include the forming and adhering of a plurality of layers to previously formed layers and wherein at least a portion of the plurality of layers are formed from at least one structural material and at least one sacrificial material that is at least in part released from the plurality of layers after formation and wherein the space transformer includes a plurality of interconnect elements that connect one side to the array of probes that has a first spacing to another side that has a second spacing where the second spacing is greater than the first spacing. In some embodiments, the fabrication process includes a plurality of electrodeposition operations.

    摘要翻译： 本发明的实施例提供了用于与一个或多个空间变压器共同制造微探针阵列的制造工艺，其中制造工艺包括将多个层形成和粘附到先前形成的层，并且其中多个 层由至少一种结构材料和至少一种牺牲材料形成，所述至少一种牺牲材料在形成之后至少部分地从所述多个层释放，并且其中所述空间变换器包括将一侧连接到所述探针阵列的多个互连元件， 具有第二间隔，第二间隔具有第二间隔，其中第二间隔大于第一间隔。 在一些实施例中，制造工艺包括多个电沉积操作。

    Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers
    9.
    发明申请
    Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers 审中-公开
    具有小于单个层的形成的最小特征尺寸的特征的多层三维结构

    公开(公告)号：US20090068460A1

    公开(公告)日：2009-03-12

    申请号：US12203094

    申请日：2008-09-02

    申请人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

    发明人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

    IPC分类号： B32B5/00

    CPC分类号： C25D1/08 ,  B33Y70/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  Y10T137/86759 ,  Y10T428/12361 ,  Y10T428/12479 ,  Y10T428/19 ,  Y10T428/24975 ,  Y10T428/249981 ,  Y10T428/29

    摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

    摘要翻译： 多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙） 用于形成结构。 在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或 第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于 最小特征尺寸。

    Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers
    10.
    发明授权
    Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers 有权
    具有小于与单独层的形成相关联的最小特征尺寸的特征的多层三维结构

    公开(公告)号：US07498714B2

    公开(公告)日：2009-03-03

    申请号：US10949744

    申请日：2004-09-24

    申请人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

    发明人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

    IPC分类号： H02N1/00 ,  F16K31/02

    CPC分类号： C25D1/08 ,  B33Y70/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  Y10T137/86759 ,  Y10T428/12361 ,  Y10T428/12479 ,  Y10T428/19 ,  Y10T428/24975 ,  Y10T428/249981 ,  Y10T428/29

    摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

    摘要翻译： 多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙） 用于形成结构。 在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或 第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于 最小特征尺寸。