公开(公告)号：US06419462B1

公开(公告)日：2002-07-16

申请号：US09627779

申请日：2000-07-28

申请人： Kuniaki Horie ,  Yukio Fukunaga ,  Akihisa Hongo ,  Kiwamu Tsukamoto ,  Kenji Kamoda ,  Hirotake Yamagishi ,  Shinya Uemura

发明人： Kuniaki Horie ,  Yukio Fukunaga ,  Akihisa Hongo ,  Kiwamu Tsukamoto ,  Kenji Kamoda ,  Hirotake Yamagishi ,  Shinya Uemura

IPC分类号： F04B4310

CPC分类号： F04B13/00 ,  F04B43/02 ,  F04B43/073 ,  F04B43/113 ,  F04B53/143 ,  F04B2205/07

摘要： A positive displacement liquid-delivery apparatus includes a positive displacement pump 110 and a differential pressure control unit 142. The positive displacement pump 110 includes a liquid-delivery chamber 128 having a watertight housing 122 with one part formed of a flexible diaphragm 124, and a diaphragm driver 136 linked to the diaphragm 124 for deforming the same to discharge fluid from the liquid-delivery chamber 128. The differential pressure control unit 142 uniformly controls the differential pressure inside and outside the diaphragm 124 during the pumping process.

摘要翻译： 正排量输送装置包括容积泵110和差压控制单元142.正排量泵110包括具有防水外壳122的液体输送室128，其中一部分由柔性膜片124形成， 膜片驱动器136连接到隔膜124，用于使其变形以从液体输送室128排出流体。差压控制单元142在泵送过程期间均匀地控制膜片124内部和外部的压差。

公开(公告)号：US07037853B2

公开(公告)日：2006-05-02

申请号：US10620452

申请日：2003-07-17

申请人： Akihisa Hongo ,  Shinya Morisawa

发明人： Akihisa Hongo ,  Shinya Morisawa

IPC分类号： H01L21/302

CPC分类号： H01L21/6708 ,  B08B3/02 ,  H01L21/67051 ,  Y10S134/902

摘要： An object of the present invention is to provide a wafer cleaning apparatus for cleaning wafers that have received various processing such as copper plating and chemical mechanical polishing. An apparatus for cleaning front and back surfaces of a wafer with solution while rotating the wafer that has been subjected to a fabrication process is disclosed. The apparatus comprises cleaning nozzles for spraying a cleaning solution, respectively, onto a front surface of the wafer that has been processed and onto a back surface thereof and also comprises an etching nozzle for spraying an etching solution onto a vicinity of the outer periphery of the wafer.

摘要翻译： 本发明的目的是提供一种用于清洗已经接受诸如镀铜和化学机械抛光的各种处理的晶片的晶片清洁装置。 公开了一种用于在旋转已经经过制造工艺的晶片的同时用溶液清洁晶片的正面和背面的装置。 该装置包括清洗喷嘴，分别将清洗液喷射到已加工的晶片的前表面上并在其后表面上，并且还包括用于将蚀刻溶液喷涂到所述蚀刻溶液的外周附近的蚀刻喷嘴 晶圆。

公开(公告)号：US06558518B1

公开(公告)日：2003-05-06

申请号：US09612218

申请日：2000-07-07

申请人： Satoshi Sendai ,  Akihisa Hongo ,  Kenya Tomioka ,  Katsumi Tsuda ,  Masayuki Kumekawa ,  Naoaki Ogure ,  Kenichi Sasabe

发明人： Satoshi Sendai ,  Akihisa Hongo ,  Kenya Tomioka ,  Katsumi Tsuda ,  Masayuki Kumekawa ,  Naoaki Ogure ,  Kenichi Sasabe

IPC分类号： C25B1500

CPC分类号： C25D17/12 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/02068 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6723 ,  H01L21/76883

摘要： A substrate such as a semiconductor wafer is plated to fill a metal such as copper (Cu) or the like in interconnection grooves defined in the substrate. An apparatus for plating such a substrate has a plating chamber for holding a plating solution, the plating chamber housing an anode that is immersible in the plating solution held by the plating chamber. A plating solution ejector pipe produces an upward jet of plating solution from a plating solution supplied to the plating chamber from an external source, and a substrate holder removably holds a substrate and positions the substrate such that a surface to be plated of the substrate is held in contact with the jet of plating solution. The plating chamber has a plating solution outlet defined in a bottom thereof for discharging a portion of the supplied plating solution via through-holes defined in the anode and/or around the anode out of the plating chamber.

摘要翻译： 电镀衬底如半导体晶片以在衬底中限定的互连槽中填充铜（Cu）等金属。 用于电镀这种基板的装置具有用于保持电镀液的电镀室，电镀室容纳浸入由电镀室保持的镀液中的阳极。 电镀溶液喷射管从外部源产生从供给到电镀室的镀液的向上喷射的电镀溶液，并且衬底保持器可移除地保持衬底并定位衬底，使得保持衬底的待镀表面 与电镀液接触。 电镀室具有限定在其底部的电镀溶液出口，用于通过限定在阳极中和/或阳极周围的通孔从电镀室中排出一部分供应的电镀溶液。

公开(公告)号：US06517689B1

公开(公告)日：2003-02-11

申请号：US09463019

申请日：2000-01-19

申请人： Akihisa Hongo ,  Kenichi Suzuki ,  Atsushi Chono ,  Mitsuo Tada ,  Akira Ogata ,  Satoshi Sendai ,  Koji Mishima

发明人： Akihisa Hongo ,  Kenichi Suzuki ,  Atsushi Chono ,  Mitsuo Tada ,  Akira Ogata ,  Satoshi Sendai ,  Koji Mishima

IPC分类号： B23H302

CPC分类号： C25D21/12 ,  G01R31/026

摘要： The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.

摘要翻译： 本发明提供一种能够检测与基板的导体层的馈电触点的导电性（接触状态）的导电检测装置。 本发明还提供了一种电镀设备，其能够产生均匀的电流以流过每个馈电触点。 该装置具有电镀槽，其中电极与衬底相对设置，该衬底通过多个馈电触点电连接到电镀夹具上，用于在电极和设置在衬底的电镀表面上的导电层之间施加特定电压 。 电镀电流从电镀夹具通过馈电触点流到基板。 提供导电检测装置以检测多个馈电触点与基板上的导电层之间的导电状态。

公开(公告)号：US06294059B1

公开(公告)日：2001-09-25

申请号：US09154895

申请日：1998-09-17

申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

IPC分类号： C25D1700

CPC分类号： H01L21/67167 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/76849 ,  H01L21/76877 ,  Y10S134/902

摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

摘要翻译： 基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。 基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元， 互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印 第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。 第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。

公开(公告)号：US06269548B1

公开(公告)日：2001-08-07

申请号：US09172147

申请日：1998-10-14

申请人： Hiroyuki Shinozaki ,  Junichiro Yoshioka ,  Kazuaki Maeda ,  Akihisa Hongo

发明人： Hiroyuki Shinozaki ,  Junichiro Yoshioka ,  Kazuaki Maeda ,  Akihisa Hongo

IPC分类号： F26B1724

CPC分类号： H01L21/68792 ,  F16C2300/62

摘要： A spin processing apparatus can prevent contamination of workpieces by wear particles, and can operate at high efficiency while lowering the noise level associated with the operation of the apparatus. The spin processing apparatus includes a chamber, a spin holder disposed inside the chamber for holding workpieces, and driver device for rotating the spin holder. A supporting device is provided for rotatably supporting the spin holder in a non-contact manner through a magnetically-operated mechanism.

摘要翻译： 旋转处理装置可以防止磨损颗粒对工件的污染，并且可以在降低与装置的操作相关的噪声水平的同时高效率地操作。 旋转处理装置包括：室，设置在室内用于保持工件的旋转架，以及用于旋转旋转架的驱动装置。 提供支撑装置，用于通过磁力操作机构以非接触方式可旋转地支撑旋转保持器。

公开(公告)号：US6036783A

公开(公告)日：2000-03-14

申请号：US834593

申请日：1997-04-07

申请人： Yukio Fukunaga ,  Takeshi Murakami ,  Naoaki Ogure ,  Akihisa Hongo

发明人： Yukio Fukunaga ,  Takeshi Murakami ,  Naoaki Ogure ,  Akihisa Hongo

IPC分类号： C23C16/44 ,  C23C16/448 ,  C23C16/455 ,  C23C16/00

CPC分类号： C23C16/4557 ,  C23C16/4486 ,  C23C16/45565

摘要： A vaporizer apparatus enables efficient vaporization of a liquid material for the production of high dielectric thin film devices by allowing a sufficient dwell time for complete vaporization of the feed liquid. The vaporizer apparatus also prevents degradation of the feed gas after vaporization and provides a stable supply of the vaporized feed gas to the substrate. The vaporizer apparatus comprises an outer member having a cylindrical inner surface, and an inner member having a cylindrical outer surface opposing the cylindrical inner surface of the outer member. A feed material passage having a spiral configuration is formed on at least one of the cylindrical inner surface and the cylindrical outer surface. The feed material passage communicates with a feed liquid entry opening and a feed gas exit opening. A heating device is provided for heating at least one of the outer member and inner member.

摘要翻译： 蒸发器装置能够通过允许足够的停留时间来充分蒸发进料液体，从而有效地蒸发用于生产高介电薄膜装置的液体材料。 汽化器装置还防止蒸发后的进料气体的劣化并且提供稳定的气化进料气体供应到基材。 蒸发器装置包括具有圆柱形内表面的外部构件和具有与外部构件的圆柱形内表面相对的圆柱形外表面的内部构件。 在圆柱形内表面和圆柱形外表面中的至少一个上形成具有螺旋构造的进给材料通道。 进料材料通道与进料液入口和进料气体出口开口连通。 提供加热装置用于加热外部构件和内部构件中的至少一个。

公开(公告)号：US5862605A

公开(公告)日：1999-01-26

申请号：US862155

申请日：1997-05-22

申请人： Kuniaki Horie ,  Naoaki Ogure ,  Yukio Fukunaga ,  Akihisa Hongo

发明人： Kuniaki Horie ,  Naoaki Ogure ,  Yukio Fukunaga ,  Akihisa Hongo

IPC分类号： B01D1/00 ,  C23C16/448 ,  F26B19/00

CPC分类号： B01D1/00 ,  C23C16/4481

摘要： Heat can be supplied effectively to a porous member of a vaporizer apparatus so that a vaporizing operation can be carried out smoothly and efficiently. The vaporizer apparatus includes a vaporizer section having a porous member including a liquid receiving surface and a vapor discharge surface. A feed supply section supplies a liquid feed material to the liquid receiving surface of the porous member. A heating medium passage is in thermal contact with the porous member. A heating medium supply system flows a heating medium of a temperature higher than a vaporization temperature of the liquid feed material through the heating medium passage.

摘要翻译： 可以有效地将热量提供给蒸发器装置的多孔构件，从而可以平稳有效地进行蒸发操作。 蒸发器装置包括具有包括液体接收表面和蒸汽排放表面的多孔构件的蒸发器部分。 供给部供给液体供给材料到多孔构件的液体接收表面。 加热介质通道与多孔构件热接触。 加热介质供应系统通过加热介质通道流动高于液体进料的蒸发温度的加热介质。