-
公开(公告)号：US12233483B2
公开(公告)日：2025-02-25
申请号：US17286704
申请日：2019-10-23
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Rahul Raut , Nirmalyakumar Chaki , Bawa Singh , Ranjit Pandher , Siuli Sarkar
IPC: B23K35/02 , B23K35/26 , B23K35/362 , C22C12/00 , B23K101/42 , B23K103/08
Abstract: A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.
-
公开(公告)号：US20240413117A1
公开(公告)日：2024-12-12
申请号：US18806922
申请日：2024-08-16
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
IPC: H01L23/00 , B22F1/052 , B22F1/102 , B22F1/107 , B22F1/17 , B22F7/04 , B23K1/00 , B23K35/02 , B23K35/30 , B23K35/36 , B23K35/365 , B23K101/40 , B23K103/00 , H01B1/22 , H01L25/00 , H05K3/32 , H10K50/842
Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
-
公开(公告)号：US12084583B2
公开(公告)日：2024-09-10
申请号：US17524891
申请日：2021-11-12
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari Pujari , Jayaprakash Sundaramurthy , Siuli Sarkar , Ravindra M. Bhatkal
IPC: C09D11/322 , B41F15/40 , B41M5/00 , C09D11/037 , C09D11/101 , C09D11/102 , C09D11/104 , C09D11/107 , C09D11/38 , H05K1/03 , H05K3/00 , C09D11/30
CPC classification number: C09D11/322 , B41F15/40 , B41M5/0023 , C09D11/037 , C09D11/101 , C09D11/102 , C09D11/104 , C09D11/107 , C09D11/38 , H05K1/0393 , H05K3/0011 , C09D11/30 , H05K2201/0133 , C09D11/10 , C09D11/52
Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.
-
公开(公告)号：US11929341B2
公开(公告)日：2024-03-12
申请号：US17255289
申请日：2019-06-21
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Shamik Ghosal , Remya Chandran , Venodh Manoharan , Siuli Sarkar , Bawa Singh , Rahul Raut
IPC: B22F1/102 , B22F1/052 , B22F1/07 , B22F5/00 , B22F9/24 , B23K35/02 , B23K35/30 , H01L23/00 , B82Y40/00
CPC classification number: H01L24/29 , B22F1/052 , B22F1/07 , B22F1/102 , B22F5/006 , B22F9/24 , B23K35/025 , B23K35/302 , B22F2301/10 , B22F2304/054 , B22F2304/056 , B22F2304/058 , B82Y40/00
Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
-
公开(公告)号：US11193031B2
公开(公告)日：2021-12-07
申请号：US16613344
申请日：2018-05-14
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari Pujari , Jayaprakash Sundaramurthy , Siuli Sarkar , Ravindra M. Bhatkal
IPC: C09D11/322 , B41F15/40 , B41M5/00 , C09D11/037 , C09D11/101 , C09D11/102 , C09D11/104 , C09D11/107 , C09D11/38 , H05K1/03 , H05K3/00 , C09D11/30
Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.
-
Patent Agency Ranking
公开(公告)号：US11090768B2
公开(公告)日：2021-08-17
申请号：US14698450
申请日：2015-04-28
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Anil Kumar , Siuli Sarkar , Ranjit Pandher , Ravi Bhatkal , Bawa Singh
IPC: B23K1/00 , B23K1/19 , C22C13/00 , C22C13/02 , B23K35/26 , H05K3/34 , B23K35/02 , B23K1/012 , B23K1/08 , B23K1/002 , B23K1/005 , B23K1/20 , B23K103/12
Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
-
公开(公告)号：US20190389012A1
公开(公告)日：2019-12-26
申请号：US16098367
申请日：2017-05-02
Applicant: Alpha Assembly Solutions Inc.
Inventor： Morgana De Avila Ribas , Suresh Telu , Pritha Choudhury , Anil K.N. Kumar , Siuli Sarkar
Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.
-
公开(公告)号：US20190262951A1
公开(公告)日：2019-08-29
申请号：US16404909
申请日：2019-05-07
Applicant: ALPHA ASSEMBLY SOLUTIONS, INC.
Inventor： Ranjit Pandher , Bawa Singh , Siuli Sarkar , Sujatha Chegudi , Anil K. N. Kumar , Kamanio Chattopadhyay , Dominic Lodge , Morgana de Avila Ribas
Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0 to 1 wt % Cu; from 0 to 0.5 wt % Co; from 0.0001 to 1.0% Sb; and the balance Sn, together with any unavoidable impurities.
-
公开(公告)号：US10259980B2
公开(公告)日：2019-04-16
申请号：US14438888
申请日：2013-10-29
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
-
公开(公告)号：US10130995B2
公开(公告)日：2018-11-20
申请号：US15302712
申请日：2015-04-10
Applicant: Alpha Assembly Solutions Inc.
Inventor： Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Sutapa Mukherjee
IPC: B22F9/24 , B22F1/00 , B22F1/02 , C09C1/62 , B22F9/04 , C09J1/00 , C09J9/02 , C09J11/04 , H01L23/00
Abstract: A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.
-
-
-
-
-
-
-
-
-
Search Results
42
records
(took 0.021 seconds)
