公开(公告)号：US20180071886A1

公开(公告)日：2018-03-15

申请号：US15818366

申请日：2017-11-20

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Benjamin Cherian

IPC: B24B37/013 ,  B24B49/12 ,  H01L21/306 ,  H01L21/66

CPC classification number: B24B37/013 ,  B24B49/12 ,  G01B11/06 ,  G01B11/0625 ,  H01L21/30625 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.

公开(公告)号：US09886026B2

公开(公告)日：2018-02-06

申请号：US14626147

申请日：2015-02-19

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Harry Q. Lee ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek

IPC: G05B19/418 ,  B24B37/013 ,  B24B37/04 ,  B24B37/20 ,  B24B49/12

CPC classification number: G05B19/418 ,  B24B37/013 ,  B24B37/042 ,  B24B37/205 ,  B24B49/12 ,  G05B2219/45232

Abstract: In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.

公开(公告)号：US09472475B2

公开(公告)日：2016-10-18

申请号：US13774843

申请日：2013-02-22

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Ingemar Carlsson ,  Tzu-Yu Liu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

IPC: H01L21/66 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12

CPC classification number: H01L22/26 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12 ,  H01L22/12

Abstract: A method of controlling polishing includes storing a desired ratio representing a ratio for a clearance time of a first zone of a substrate to a clearance time of a second zone of the substrate. During polishing of a first substrate, an overlying layer is monitored, a sequence of measurements is generated, and the measurements are sorted a first group associated with the first zone of the substrate and a second group associated with the second zone on the substrate. A first time and a second time at which the overlying layer is cleared is determined based on the measurements from the first group and the second group, respectively. At least one adjusted polishing pressure is calculated for the first zone based on a first pressure applied in the first zone during polishing the first substrate, the first time, the second time, and the desired ratio.

Abstract translation: 控制抛光的方法包括将表示基材的第一区域的间隙时间的比率与基材的第二区域的间隙时间的所需比率进行存储。 在第一衬底的抛光期间，监测上覆层，产生一系列测量，并且对与衬底的第一区域相关联的第一组和与衬底上的第二区域相关联的第二组对第一组进行测量。 基于来自第一组和第二组的测量，分别确定覆盖层被清除的第一次和第二次。 基于在抛光第一基板期间第一区域中施加的第一压力，第一时间，第二时间和期望比率，针对第一区域计算至少一个调整的抛光压力。

公开(公告)号：US20160101497A1

公开(公告)日：2016-04-14

申请号：US14973044

申请日：2015-12-17

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Doyle E. Bennett ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Allen L. D'Ambra ,  Jagan Rangarajan

IPC: B24B37/005

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract translation: 抛光装置包括支撑在平台上的多个工位，所述多个工位包括至少两个抛光站和转移站，每个抛光站包括用于支撑抛光垫的压板，多个托架头悬挂并可沿其移动 轨道，使得每个抛光站可选择性地定位在车站处;以及控制器，被配置为控制承载头沿着轨道的运动，使得在每个抛光站的抛光期间，只有单个承载头位于抛光台中。

公开(公告)号：US09281253B2

公开(公告)日：2016-03-08

申请号：US14066571

申请日：2013-10-29

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Doyle E. Bennett ,  Wen-Chiang Tu ,  Hassan G. Iravani ,  Tzu-Yu Liu

IPC: G06F19/00 ,  H01L21/66 ,  H01L21/321 ,  B24B37/013 ,  B24B49/10

CPC classification number: B24B37/013 ,  B24B49/105 ,  H01L21/3212 ,  H01L21/67092 ,  H01L21/67248 ,  H01L22/14 ,  H01L22/26

Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.

Abstract translation: 控制抛光的方法包括：在第一抛光台处抛光衬底，用第一涡流监测系统监测衬底以产生第一信号，确定第一信号的结束值，以便在第一抛光站抛光衬底 抛光站，确定第一抛光站的第一温度，在第二抛光站抛光衬底，用第二涡流监测系统监测衬底以产生第二信号，确定第二信号的起始值以开始 在所述第二研磨站处抛光所述基板，基于所述结束值，所述起始值和所述第一温度确定所述第二抛光站的增益，以及基于所述第二信号和所述增益来计算第三信号。

公开(公告)号：US20150371907A1

公开(公告)日：2015-12-24

申请号：US14312470

申请日：2014-06-23

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhihong Wang ,  Wen-Chiang Tu ,  Zhefu Wang ,  Hassan G. Iravani ,  Boguslaw A. Swedek ,  Fred C. Redeker ,  William H. McClintock

IPC: H01L21/66 ,  H01L21/306

CPC classification number: H01L22/14 ,  H01L21/3212 ,  H01L22/26 ,  H01L22/30

Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.

Abstract translation: 用于制造集成电路的衬底具有具有多个导电互连的层。 衬底包括半导体本体，设置在半导体本体上的电介质层，设置在电介质层中的第一沟槽中的导电材料的多条导电线，以提供导电互连，以及设置导电材料的闭合导电环结构 在介质层的第二沟槽中。 闭合的导电回路不与任何导电线电连接。

公开(公告)号：US20150364390A1

公开(公告)日：2015-12-17

申请号：US14832997

申请日：2015-08-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Dominic J. Benvegnu ,  Jeffrey Drue David ,  Boguslaw A. Swedek

IPC: H01L21/66 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/306

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  B24D7/14 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253

Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.

Abstract translation: 用于基于频谱的终点的方法和装置。 终点方法包括选择参考频谱。 参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。 对于特定的基于频谱的端点确定逻辑，经验地选择参考频谱，使得当通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得当前频谱。 目前的光谱是当感兴趣的薄膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二基板上从感兴趣的薄膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。 该确定基于参考和当前光谱。

公开(公告)号：US08992286B2

公开(公告)日：2015-03-31

申请号：US13777672

申请日：2013-02-26

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jun Qian ,  Thomas H. Osterheld

IPC: B24B1/00 ,  B24B49/12 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/013

Abstract: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.

Abstract translation: 控制抛光操作的方法包括测量衬底上多个不同位置处的多个光谱以提供多个测量光谱。 对于多个测量光谱的每个测量光谱，基于测量的光谱产生表征值。 对于每个特征值，确定测量的光谱与生成表征值所使用的另一光谱的拟合度。 通过将回归应用于具有多个适合度的拟合优点用作回归中的加权因子来生成晶片级特征值映射。 基于晶片级特征图调整抛光装置的抛光终点或抛光参数，并且在抛光装置中用调整的抛光终点或抛光参数对衬底或随后的衬底进行抛光。

公开(公告)号：US08932107B2

公开(公告)日：2015-01-13

申请号：US14027070

申请日：2013-09-13

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Sivakumar Dhandapani

IPC: B24B1/00 ,  B24B49/12 ,  B24B37/013 ,  B24B37/10

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B37/105

Abstract: A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.

Abstract translation: 抛光装置包括用于保持具有多个光学孔的抛光垫的压板，用于将衬底保持在抛光垫上的载体头，用于在承载头和压板之间产生相对运动的电动机以及光学监控系统。 所述光学监视系统包括至少一个光源，公共检测器和配置成将来自所述至少一个光源的光引导到所述压板中的多个分离位置中的每一个的光学组件，以引导来自所述至少一个光源的每个位置的光 当衬底越过所述每个位置时，多个分离的位置到衬底，以在衬底经过所述每个位置时接收来自衬底的反射光，并将来自多个分离位置中的每一个的反射光引导到公共检测器 。

公开(公告)号：US20150004888A1

公开(公告)日：2015-01-01

申请号：US14485386

申请日：2014-09-12

Applicant: Applied Materials, Inc.

Inventor： Boguslaw A. Swedek ,  Manoocher Birang

IPC: B24B37/26

CPC classification number: B24B37/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/02 ,  B24B49/10 ,  B24B49/105 ,  B24B49/12 ,  B24D11/02 ,  G01B7/105

Abstract: A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.

Abstract translation: 一种用具有研磨面和背面的研磨层形成研磨垫的方法。 在研磨面上形成有多个凹槽，在研磨层的背面形成有凹部。 与后表面的凹部对应的研磨面上的区域没有凹槽或具有较浅的凹槽。