公开(公告)号：US20130207144A1

公开(公告)日：2013-08-15

申请号：US13808705

申请日：2011-07-01

申请人： Johann Ramchen ,  Jörg Erich Sorg ,  Simon Jerebic ,  Bert Braune

发明人： Johann Ramchen ,  Jörg Erich Sorg ,  Simon Jerebic ,  Bert Braune

IPC分类号： H01L33/52 ,  H01L31/18 ,  H01L31/0203

CPC分类号： H01L33/52 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A component with an optoelectronic semiconductor chip fixed to a connection carrier by a bonding layer and embedded in an encapsulation, wherein a decoupling layer is arranged at least in places between the bonding layer and the encapsulation.

摘要翻译： 具有通过结合层固定到连接载体并嵌入封装中的光电子半导体芯片的部件，其中去耦层至少布置在接合层和封装之间的位置。

公开(公告)号：US20110309377A1

公开(公告)日：2011-12-22

申请号：US13121128

申请日：2009-08-25

申请人： Bert Braune ,  Jörg Erich Sorg ,  Walter Wegleiter ,  Karl Weidner ,  Oliver Wutz

发明人： Bert Braune ,  Jörg Erich Sorg ,  Walter Wegleiter ,  Karl Weidner ,  Oliver Wutz

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L2224/24105 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

摘要： An optoelectronic module is specified, comprising a carrier substrate (1) and a plurality of radiation-emitting semiconductor components (2). The carrier substrate (1) comprises structured conductor tracks. The radiation-emitting semiconductor components (2) each comprise an active layer (2a) suitable for generating electromagnetic radiation, a first contact area (21) and a second contact area (22), wherein the first contact area (21) is in each case arranged on that side of the radiation-emitting semiconductor components (2) which is remote from the carrier substrate (1). The radiation-emitting semiconductor components (2) are provided with an electrically insulating layer (4), which in each case has a cutout in a region of the first contact area (21). Conductive structures (8) are arranged in regions on the electrically insulating layer (4). One of the conductive structures (8) electrically conductively connects at least the first contact area (21) of a radiation-emitting semiconductor component (2) to a further first contact area (21) of a further radiation-emitting semiconductor component (2) or to a conductor track of the carrier substrate (1). Furthermore, a method for producing such a module is specified.

摘要翻译： 规定了光电子模块，其包括载体衬底（1）和多个辐射发射半导体部件（2）。 载体基板（1）包括结构化的导体轨道。 辐射发射半导体部件（2）各自包括适于产生电磁辐射的有源层（2a），第一接触区域（21）和第二接触区域（22），其中第一接触区域（21）在每个 辐射发射半导体部件（2）的远离载体基板（1）的那一侧的情况。 辐射发射半导体部件（2）设置有电绝缘层（4），其在每种情况下在第一接触区域（21）的区域中具有切口。 导电结构（8）布置在电绝缘层（4）上的区域中。 导电结构（8）中的一个导电地将辐射发射半导体部件（2）的至少第一接触区域（21）导电连接到另外的辐射发射半导体部件（2）的另外的第一接触区域（21） 或载体衬底（1）的导体轨道。 此外，规定了这种模块的制造方法。

公开(公告)号：US07948046B2

公开(公告)日：2011-05-24

申请号：US12879130

申请日：2010-09-10

申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

IPC分类号： H01L31/113

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

摘要翻译： 具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。 为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。 这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于 填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。

公开(公告)号：US07795633B2

公开(公告)日：2010-09-14

申请号：US12242170

申请日：2008-09-30

申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

摘要翻译： 具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。 为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。 这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于 填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。

公开(公告)号：US20100019266A1

公开(公告)日：2010-01-28

申请号：US12523487

申请日：2008-01-23

申请人： Bert Braune ,  Gertrud Kraeuter

发明人： Bert Braune ,  Gertrud Kraeuter

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/507 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： An arrangement and a method for producing such an arrangement serve for generating mixed light. In this case, a semiconductor chip that emits an electromagnetic primary radiation has a luminescence conversion element in the beam path of the primary radiation. Furthermore, the arrangement includes a connecting element and a carrier element, wherein the carrier element carries and shapes the luminescence conversion element and the connecting element.

摘要翻译： 用于制造这种布置的布置和方法用于产生混合光。 在这种情况下，发射电磁一次辐射的半导体芯片在一次辐射的光束路径中具有发光转换元件。 此外，该装置包括连接元件和载体元件，其中载体元件承载和成形发光转换元件和连接元件。

公开(公告)号：US20090197361A1

公开(公告)日：2009-08-06

申请号：US12421814

申请日：2009-04-10

申请人： Bert Braune ,  Herbert Brunner

发明人： Bert Braune ,  Herbert Brunner

IPC分类号： H01L21/56

CPC分类号： H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

摘要： The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to whose surface a luminescence conversion material is applied in the form of a thin layer. Prior to coating, the front-side electrical contact is raised by the application of an electrically conductive material to the electrical contact surface. The method enables specific color coordinates to be adjusted selectively by monitoring the color coordinates (IEC chromaticity diagram) and thinning the layer of luminescence conversion material. In addition, the method is suited in particular for simultaneously producing a plurality of LED light sources from a multiplicity of similar chips in a wafer composite.

摘要翻译： 本发明描述了一种用于制造发光二极管（LED）光源的方法，特别地包括混合彩色LED，其中由芯片发射的初级辐射的至少一部分通过发光转换而变换。 所述芯片包括前表面（即面向辐射方向的一侧）电接触，其表面以薄层的形式施加发光转换材料。 在涂覆之前，通过将导电材料施加到电接触表面来提高前侧电接触。 该方法通过监视颜色坐标（IEC色度图）和稀释发光转换材料层来选择性地调整特定的颜色坐标。 此外，该方法特别适用于从晶片复合材料中的多个类似的芯片同时制造多个LED光源。

公开(公告)号：US07256428B2

公开(公告)日：2007-08-14

申请号：US10481528

申请日：2002-06-19

申请人： Bert Braune ,  Patrick Kromotis

发明人： Bert Braune ,  Patrick Kromotis

IPC分类号： H01L33/00 ,  H01L29/24

CPC分类号： H01L33/54 ,  B29D11/00 ,  G02B3/08 ,  G02B6/4206 ,  H01L31/0232 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： In order to apply an optical element such as a lens, for example, to an optoelectronic component, the surface (3B), averted from the transmitter or receiver (2), of the filling material (3) is designed directly with a lens profile (7). This is done by filling a defined quantity of the transparent filling material (3) into the recess (1A) of the carrier body (1) for the purpose of embedding the transmitter or receiver (2), and by subsequently impressing a lens profile (7) onto the surface (3B), averted from the transmitter or receiver, of the transparent filling material (3) by means of a punch (8), before the transparent filling material with the lens profile (7) thus impressed is completely cured.

摘要翻译： 为了将诸如透镜的光学元件例如应用于光电子部件，从填充材料（3）的发射器或接收器（2）避开的表面（3B）直接设置有透镜 个人资料（7）。 这通过将限定量的透明填充材料（3）填充到载体主体（1）的凹部（1A）中以便嵌入发射器或接收器（2），并且随后施加透镜轮廓 （7）通过冲头（8）从透明填充材料（3）避开的表面（3B）上，在具有如此印刷的透镜轮廓（7）的透明填充材料之前是 完全治愈

公开(公告)号：US20060003477A1

公开(公告)日：2006-01-05

申请号：US10532848

申请日：2003-10-21

申请人： Bert Braune ,  Herbert Brunner

发明人： Bert Braune ,  Herbert Brunner

IPC分类号： H01L21/00

CPC分类号： H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

摘要： The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to whose surface a luminescence conversion material is applied in the form of a thin layer. Prior to coating, the front-side electrical contact is raised by the application of an electrically conductive material to the electrical contact surface. The method enables specific color coordinates to be adjusted selectively by monitoring the color coordinates (IEC chromaticity diagram) and thinning the layer of luminescence conversion material. In addition, the method is suited in particular for simultaneously producing a plurality of LED light sources from a multiplicity of similar chips in a wafer composite.

摘要翻译： 本发明描述了一种用于制造发光二极管（LED）光源的方法，特别地包括混合彩色LED，其中由芯片发射的初级辐射的至少一部分通过发光转换而变换。 所述芯片包括前表面（即面向辐射方向的一侧）电接触，其表面以薄层的形式施加发光转换材料。 在涂覆之前，通过将导电材料施加到电接触表面来提高前侧电接触。 该方法通过监视颜色坐标（IEC色度图）和稀释发光转换材料层来选择性地调整特定的颜色坐标。 此外，该方法特别适用于从晶片复合材料中的多个类似的芯片同时制造多个LED光源。

公开(公告)号：US6162853A

公开(公告)日：2000-12-19

申请号：US230358

申请日：1999-01-25

申请人： Bert Braune ,  Elisabeth Geiter ,  Herbert Krug ,  Peter Mueller ,  Helmut Schmidt

发明人： Bert Braune ,  Elisabeth Geiter ,  Herbert Krug ,  Peter Mueller ,  Helmut Schmidt

IPC分类号： C08F283/12 ,  C08F299/08 ,  C08L51/08 ,  C08L57/00 ,  C08L83/05 ,  C08L83/07 ,  G02B1/04 ,  C08K3/10

CPC分类号： C08L51/08 ,  C08F283/124 ,  G02B1/041 ,  C08L51/085

摘要： Described is a process for preparing a molding suitable for optical purposes, which process comprises the conjoint free-radical polymerization of a precondensate (A) which is derived from at least one hydrolytically condensable silane (a) having at least one free-radically polymerizable group X, and of a monomer (B) having at least two free-radically polymerizable groups Y, the numerical ratio of groups X to groups Y being not greater than 5:1. The moldings obtainable by this process are characterized by high transparency and homogeneity, freedom from stress, scratch and abrasion resistance, high mechanical strength, etc.

摘要翻译： PCT No.PCT / EP97 / 04020 Sec。 371日期1999年1月25日 102（e）日期1999年1月25日PCT提交1997年7月24日PCT公布。 公开号WO98 / 04604 日期1998年2月5日描述了一种制备适合于光学目的的模制品的方法，该方法包括预缩合物（A）的联合自由基聚合，所述预缩合物（A）衍生自至少一种可水解缩合的硅烷（a），其具有至少一个 可自由基聚合的基团X和具有至少两个可自由基聚合的基团Y的单体（B），基团X与基团Y的数值比不大于5:1。 通过该方法获得的模制品的特征在于高透明度和均匀性，不受应力，耐划伤和耐磨性，高机械强度等。

公开(公告)号：US20130256737A1

公开(公告)日：2013-10-03

申请号：US13825525

申请日：2011-08-19

申请人： Johann Ramchen ,  Christina Keith ,  Bert Braune

发明人： Johann Ramchen ,  Christina Keith ,  Bert Braune

IPC分类号： H01L33/64

CPC分类号： H01L33/641 ,  H01L31/0203 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An electronic component has a housing body which comprises a semiconductor chip in a recess. The semiconductor chip in the recess is embedded in a casting compound made of a first plastic material having a first glass transition temperature. A cover element made of a second plastic material having a second glass transition temperature is arranged above the recess. The second glass transition temperature is lower than the first glass transition temperature.

摘要翻译： 电子部件具有包括凹部中的半导体芯片的壳体。 凹部中的半导体芯片嵌入由具有第一玻璃化转变温度的第一塑料材料制成的铸塑料中。 由具有第二玻璃化转变温度的第二塑料材料制成的盖元件设置在凹部上方。 第二玻璃化转变温度低于第一玻璃化转变温度。