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    Methods for assembling electronic devices using embedded light guide structures
    31.
    发明授权
    Methods for assembling electronic devices using embedded light guide structures 有权
    使用嵌入式导光结构组装电子设备的方法

    公开(公告)号：US08944659B2

    公开(公告)日：2015-02-03

    申请号：US13401692

    申请日：2012-02-21

    申请人： Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    发明人： Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    IPC分类号： F21V8/00

    CPC分类号： G02B6/0081 ,  C09J5/00 ,  C09J2203/318 ,  C09J2205/31 ,  G02B6/001 ,  G02B6/0086 ,  G02B6/102

    摘要： Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.

    摘要翻译： 电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。 导光结构可以安装在组件中。 在制造电子装置时，可以将紫外光注入导光结构中以固化光固化液体粘合剂。 光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。 导光结构可以包括掩模部分，刚性支撑构件和一个或多个开口。 在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。 可以使用粘合剂施加器将粘合剂施加到组件的部分。 外部光源可以用于将固化粘合剂的光注入光导结构中。

    Insert Molded Cowling Structures
    33.
    发明申请
    Insert Molded Cowling Structures 有权
    插入成型的结构结构

    公开(公告)号：US20140071651A1

    公开(公告)日：2014-03-13

    申请号：US13607440

    申请日：2012-09-07

    申请人： Michael B. Wittenberg ,  Sawyer I. Cohen ,  Jared M. Kole ,  Shayan Malek ,  David A. Pakula ,  Ashutosh Y. Shukla

    发明人： Michael B. Wittenberg ,  Sawyer I. Cohen ,  Jared M. Kole ,  Shayan Malek ,  David A. Pakula ,  Ashutosh Y. Shukla

    IPC分类号： H05K5/04 ,  H05K13/00

    CPC分类号： H01Q1/243

    摘要： Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.

    摘要翻译： 电子设备可以设置有固定电子部件的电子部件和整流罩结构。 整流罩结构可以包括已经插入模制到金属部分上的金属部分和绝缘部分。 金属部分和嵌入成型的绝缘部分可以各自具有容纳螺钉的开口。 螺钉可以穿过相应的开口并附着到基底上。 衬底可以是用于器件显示的透明覆盖层。 整流罩结构可以将电子部件压靠在透明基板层上。 该装置可以包括天线。 插入成型的绝缘部分可以沿着天线的方向从金属部分的边缘延伸。 插入成型的绝缘部分可以防止其中一个螺钉与金属部分形成电连接。

    LOW PROFILE HINGE AND PIN MOUNT
    34.
    发明申请
    LOW PROFILE HINGE AND PIN MOUNT 审中-公开
    低剖面铰链和针脚安装

    公开(公告)号：US20140055019A1

    公开(公告)日：2014-02-27

    申请号：US13592240

    申请日：2012-08-22

    申请人： Andriy PLETENETSKYY ,  Tang Yew Tan ,  David A. Pakula

    发明人： Andriy PLETENETSKYY ,  Tang Yew Tan ,  David A. Pakula

    IPC分类号： H05K7/16 ,  B23P11/00

    CPC分类号： H04M1/026 ,  Y10T29/49947

    摘要： Described embodiments provide a low profile hinge and pin mount to be mounted within a small encasement. The mount has a low profile and takes up minimal space within the small encasement without sacrificing structural support for a component and external forces placed on the mount. The mount includes a bracket, a pin and a fastener. The bracket includes a rounded end, a fastening end and a beam configured to support the component placed between the rounded end and the fastening end. The rounded end of the bracket is sized and shaped to fit in an enclosure of the encasement and to pivot about the pin during a rework process. Methods for installing and reworking the low profile hinge and pin mount are described.

    摘要翻译： 所描述的实施例提供了一种小型铰链和销安装件，以安装在小的装置内。 安装座具有低外形，并且在小包装内占用最小的空间，而不会牺牲部件的结构支撑和安装在安装座上的外力。 支架包括支架，销和紧固件。 支架包括圆形端部，紧固端部和被配置为支撑放置在圆形端部和紧固端部之间的部件的梁。 支架的圆形端部的尺寸和形状适于装在外壳的外壳中，并在返工过程中围绕销枢转。 描述了用于安装和重新加工低剖面铰链和销安装件的方法。

    Compact Portable Electronic Device Having Augmented Back Volume for Speaker
    36.
    发明申请
    Compact Portable Electronic Device Having Augmented Back Volume for Speaker 审中-公开
    紧凑型便携式电子设备增强扬声器背部音量

    公开(公告)号：US20130260823A1

    公开(公告)日：2013-10-03

    申请号：US13436924

    申请日：2012-03-31

    申请人： Ashutosh Y. Shukla ,  David A. Pakula ,  Mathew D. Hill ,  Richard Hung Minh Dinh ,  Sawyer I. Cohen ,  Terence N. Tam

    发明人： Ashutosh Y. Shukla ,  David A. Pakula ,  Mathew D. Hill ,  Richard Hung Minh Dinh ,  Sawyer I. Cohen ,  Terence N. Tam

    IPC分类号： H04M1/00 ,  H04R1/02

    CPC分类号： H04M1/0264 ,  H04M1/035 ,  H04R1/2815 ,  H04R2499/11

    摘要： Improved approaches to providing a sealed acoustic chamber (e.g., a back volume) for an acoustic component (e.g., speaker) resident in a compact portable electronic device are disclosed. In one embodiment, a compact portable electronic device includes an internal module (or housing), such as an optical camera module that includes optical components, which contains a module volume. The module volume can be provided with a port (e.g., opening) but is otherwise a substantially enclosed (e.g., at least substantially sealed) volume. By acoustically coupling the acoustic component to the port, the module volume can be used as some or all of the back volume for the acoustic component. Advantageously, a compact portable electronic can provide quality acoustic audio output while requiring only a limited amount of dedicated space.

    摘要翻译： 公开了用于为驻留在紧凑型便携式电子设备中的声学组件（例如，扬声器）提供密封声学室（例如，后部体积）的改进方法。 在一个实施例中，紧凑型便携式电子设备包括内部模块（或外壳），诸如包含模块体积的光学组件的光学相机模块。 模块体积可以设置有端口（例如开口），但是可以设置为基本封闭的（例如，至少基本上密封的）体积。 通过将声学组件声学耦合到端口，模块体积可以用作声学部件的后部体积的一些或全部。 有利地，紧凑型便携式电子器件可以提供质量良好的声学音频输出，同时仅需要有限量的专用空间。

    System With Multiple Electronic Devices
    40.
    发明申请
    System With Multiple Electronic Devices 有权

    公开(公告)号：US20220083382A1

    公开(公告)日：2022-03-17

    申请号：US17522730

    申请日：2021-11-09

    申请人： James R. Wilson ,  David A. Pakula

    发明人： James R. Wilson ,  David A. Pakula

    IPC分类号： G06F9/50 ,  H01F7/02 ,  H04M1/72409 ,  H04M1/72454

    摘要： Multiple electronic devices may be used together in a system. The electronic devices may use sensor measurements and other information to detect when an edge of a first electronic device is adjacent to an edge of a second electronic device. In response to detection of adjacency between the edges of the first and second devices, the devices may transition from an independent operating mode in which each device operates separately to a joint operating mode in which resources of the devices are shared. In the joint operating mode, images may extend across displays in the devices, speakers in the devices may be used to play different channels of an audio track, cameras and other sensors may be used in cooperation with each other, and other resources may be shared. Magnetic components may hold devices together in a variety of orientations.