公开(公告)号：US5629835A

公开(公告)日：1997-05-13

申请号：US277387

申请日：1994-07-19

Applicant: Deepak Mahulikar ,  Paul R. Hoffman ,  Jeffrey S. Braden

Inventor： Deepak Mahulikar ,  Paul R. Hoffman ,  Jeffrey S. Braden

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/13 ,  H01L23/14 ,  H01L23/24 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/10 ,  H05K7/20 ,  H01L23/34

CPC classification number: H01L25/0657 ,  H01L21/4828 ,  H01L23/13 ,  H01L23/142 ,  H01L23/24 ,  H01L23/49816 ,  H01L25/105 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/181 ,  H01L2924/3025

Abstract: There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.

Abstract translation: 公开了具有整体凸块的用于电子封装应用的部件。 通过从一侧蚀刻金属带形成向外延伸的基本垂直的整体凸块来形成引线框架。 然后从相对侧蚀刻金属条形成单个引线。 当整体凸起的部件是封装基座时，焊球的疲劳减小。

公开(公告)号：US5578869A

公开(公告)日：1996-11-26

申请号：US413149

申请日：1994-03-29

Applicant: Paul R. Hoffman ,  Deepak Mahulikar ,  George A. Brathwaite ,  Dawit Solomon ,  Arvind Parthasarathi

Inventor： Paul R. Hoffman ,  Deepak Mahulikar ,  George A. Brathwaite ,  Dawit Solomon ,  Arvind Parthasarathi

IPC: H01L23/057 ,  H01L23/31 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/065 ,  H01L23/52 ,  H01L23/34 ,  H01L23/48 ,  H01L23/04

CPC classification number: H01L23/057 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/49894 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107

Abstract: There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.

Abstract translation: 提供了用于电子封装的金属部件。 该部件涂覆有非导电层，并且在表面上形成多个导电电路迹线。 电路迹线直接焊接到集成电路器件的输入/输出焊盘和第二多个电路迹线。 该组件可以包括散热器，以增强来自封装的集成电路器件的散热。

公开(公告)号：US5506446A

公开(公告)日：1996-04-09

申请号：US450292

申请日：1995-05-25

Applicant: Paul R. Hoffman ,  George A. Brathwaite ,  Doanh D. Bui ,  Deepak Mahulikar

Inventor： Paul R. Hoffman ,  George A. Brathwaite ,  Doanh D. Bui ,  Deepak Mahulikar

IPC: H01L23/057 ,  H01L23/498 ,  H01L23/06 ,  H01L23/10

CPC classification number: H01L24/32 ,  H01L23/057 ,  H01L23/49861 ,  H01L2224/32013 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181

Abstract: There is provided a base for an electronic package. The base includes a peripheral portion for a polymer adhesive and a central portion for one or more semiconductor devices. A lead support is adjacent the substrate and located between the peripheral portion and the central portion. When a polymer adhesive bonds a leadframe to the package base, the lead support prevents deflection of the inner lead tips.

Abstract translation: 为电子包装提供了一个基地。 基座包括用于聚合物粘合剂的周边部分和用于一个或多个半导体器件的中心部分。 引线支撑件邻近基板并且位于周边部分和中心部分之间。 当聚合物粘合剂将引线框结合到封装基底时，引线支撑件防止内部引线端部的偏转。

公开(公告)号：US5403975A

公开(公告)日：1995-04-04

申请号：US114994

申请日：1993-08-31

Applicant: Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Satish K. Jalota ,  Andrew J. Brock

Inventor： Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Satish K. Jalota ,  Andrew J. Brock

IPC: C25D11/04 ,  C25D11/06 ,  C25D11/14 ,  H01L23/06 ,  H05K3/44 ,  H01L23/02

CPC classification number: C25D11/14 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H05K3/44

Abstract: A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 80 amps per square foot and then allowed to gradually decrease as a function of oxide growth.

Abstract translation: 公开了一种从铝合金制造电子封装部件的方法。 这些组件通过整体颜色阳极氧化处理具有黑色。 所需的颜色，厚度和表面光洁度是通过在阳极氧化期间调节电流强度来实现的。 电流强度迅速升高至超过80安培/平方英尺，然后随着氧化物生长而逐渐降低。

公开(公告)号：US5122858A

公开(公告)日：1992-06-16

申请号：US580696

申请日：1990-09-10

Applicant: Deepak Mahulikar ,  Julius C. Fister ,  Gerald N. Violette

Inventor： Deepak Mahulikar ,  Julius C. Fister ,  Gerald N. Violette

IPC: H01L23/31 ,  H01L23/495

CPC classification number: H01L23/49586 ,  H01L23/3142 ,  H01L23/49579 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181

Abstract: A composite leadframe for electronic packages is provided. A polymer layer coats a portion of the leadframe. The polymer layer increases the adhesive bond between the leadframe and a molding resin. Water vapor does not accumulate under the leads and die attach paddle minimizing the popcorn effect.

Abstract translation: 提供了一种用于电子封装的复合引线框架。 聚合物层涂覆引线框架的一部分。 聚合物层增加了引线框和模制树脂之间的粘结。 水蒸气不会积聚在引线下方，并附着桨叶使爆米花效果最小化。

公开(公告)号：US5103292A

公开(公告)日：1992-04-07

申请号：US442877

申请日：1989-11-29

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: H01L23/02 ,  H01L23/04 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/12 ,  H01L23/14 ,  H01L23/498 ,  H01L23/50

CPC classification number: H01L23/04 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/142 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/3025

Abstract: A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.

Abstract translation: 提供了一种金属针格栅阵列封装和用于组装封装的工艺。 该封装包括具有有序阵列的孔的金属或金属合金基底部件。 端子引脚电连接到所需的电路并延伸穿过有序阵列的孔。 电介质聚合物密封剂将覆盖组分粘合到电路和基底组分上。 在包装组装过程中，聚合物密封剂流入包括有序排列的孔的孔，使端子销与基座部件电隔离。

公开(公告)号：US5096508A

公开(公告)日：1992-03-17

申请号：US563766

申请日：1990-07-27

Applicant: John F. Breedis ,  George J. Muench ,  Deepak Mahulikar

Inventor： John F. Breedis ,  George J. Muench ,  Deepak Mahulikar

IPC: C23C8/80 ,  C23C14/48

CPC classification number: C23C14/48 ,  C23C8/80 ,  Y10T428/12882

Abstract: A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitride former to modify the surface. A continuous surface film is formed by heating in a nitrogen containing gas. A dispersion of nitride precipitate in a copper matrix is formed by implanting nitrogen ions.

Abstract translation: 提供具有改性表面的复合铜合金。 可溶于铜和与氮反应的元素或组合的元素或铜组合形成固态溶液。 该合金与氮化物形成剂反应以改变表面。 通过在含氮气体中加热形成连续的表面膜。 通过注入氮离子形成氮化物沉淀物在铜基质中的分散体。

公开(公告)号：US5023398A

公开(公告)日：1991-06-11

申请号：US504741

申请日：1990-04-04

Applicant: Deepak Mahulikar ,  James M. Popplewell

Inventor： Deepak Mahulikar ,  James M. Popplewell

IPC: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/14

CPC classification number: H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/142 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/16195

Abstract: The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.

Abstract translation: 本发明涉及一种适于容纳诸如半导体集成电路的电子设备的封装。 封装部件由铝基合金组成。 包装部件的表面的至少一部分被阳极化以增强耐腐蚀性并增加粘结强度。 基于铝的包装的特征在于比基于铜的包装更轻的重量，并且比基于塑料的包装具有更好的导热性。

公开(公告)号：US4821151A

公开(公告)日：1989-04-11

申请号：US811911

申请日：1985-12-20

Applicant: Michael J. Pryor ,  Narendra N. Singhdeo ,  Deepak Mahulikar

Inventor： Michael J. Pryor ,  Narendra N. Singhdeo ,  Deepak Mahulikar

IPC: H01L21/48 ,  H01L23/04 ,  H01L23/538 ,  H05K7/10

CPC classification number: H01L23/04 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701

Abstract: A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having at least one cavity adapted for receiving a semiconductor die is sealed to the multi-layer circuit device. Electrical leads are connected to the semiconductor device and extend outward from the package for connection to the conductive circuit pattern within the multi-layer circuit.

Abstract translation: 一种适于容纳多个半导体器件的气密密封封装。 封装包括由多个陶瓷基板和设置在其间的导电电路图形成的多层电路器件。 具有适于接收半导体管芯的至少一个腔的陶瓷盖被密封到多层电路器件。 电引线连接到半导体器件并从封装向外延伸以连接到多层电路内的导电电路图案。

公开(公告)号：US4704626A

公开(公告)日：1987-11-03

申请号：US752872

申请日：1985-07-08

Applicant: Deepak Mahulikar ,  Satyam C. Cherukuri

Inventor： Deepak Mahulikar ,  Satyam C. Cherukuri

IPC: H01L23/10 ,  H01L23/373 ,  H01L23/02 ,  H01L23/06 ,  H01L23/48

CPC classification number: H01L23/10 ,  H01L23/373 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195

Abstract: A graded seal assembly adapted for hermetically sealing a semiconductor package is disclosed. First and second members having first and second coefficients of thermal expansion respectively are provided. A leadframe is disposed between the first and second members. A first sealing glass is bonded to opposite surfaces of the leadframe and is disposed between the leadframe and the first member for sealing the leadframe to the first member. The second sealing glass is bonded to the second member. The second sealing glass has a third CTE which has a mismatch of less than about 5.times.10.sup.-7 in/in/.degree.C. with said second member. A graded interface zone having stratified layers fuses the first and second sealing glasses. Each of the layers in the zone has a coefficient of thermal expansion which is mismatched less than about 5.times.10.sup.-7 in/in/.degree.C. with an adjacent layer to absorb thermal stress formed by exposure of the semiconductor package to thermal cycling.

Abstract translation: 公开了一种适于气密密封半导体封装的分级密封组件。 提供具有第一和第二热膨胀系数的第一和第二构件。 引线框设置在第一和第二构件之间。 第一密封玻璃结合到引线框架的相对表面，并且设置在引线框架和第一构件之间，用于将引线框架密封到第一构件。 第二密封玻璃结合到第二构件。 第二密封玻璃具有与所述第二构件不匹配的小于约5×10 -7 in / in /℃的第三CTE。 具有分层的分级界面区使第一和第二密封眼镜融合。 区域中的每个层具有小于约5×10 -7 in / in /℃的失配系数，具有相邻层以吸收由半导体封装暴露于热循环形成的热应力。