公开(公告)号：US5723089A

公开(公告)日：1998-03-03

申请号：US824079

申请日：1997-03-24

申请人： Rikio Chijiiwa ,  Hiroyuki Ogawa ,  Koichi Shinada ,  Yoshinori Ogata ,  Hiroshi Tamehiro ,  Hajime Ishikawa ,  Isamu Kimoto ,  Yoshio Terada

发明人： Rikio Chijiiwa ,  Hiroyuki Ogawa ,  Koichi Shinada ,  Yoshinori Ogata ,  Hiroshi Tamehiro ,  Hajime Ishikawa ,  Isamu Kimoto ,  Yoshio Terada

IPC分类号： B23K35/02 ,  B23K35/30 ,  C22C38/28

CPC分类号： B23K35/3053 ,  B23K35/0261 ,  B23K35/3066 ,  B23K35/308 ,  Y10S148/909

摘要： A wire for gas metal arc welding containing 0.01 to 0.06 wt % of C, 0.10 to 0.60 wt % of Si, 0.9 to 3.1 wt % of Mn, 0.7 to 2.0 wt % of Cr, 0.005 to 0.06% of Ti, not greater than 0.08 wt % of Al and if necessary, 0.05 to 0.30 wt % of Cu, and the balance of Fe and unavoidable impurities. This wire improves the selective corrosion resistance and the low temperature toughness of the resulting weld metal, and is particularly suitable for circumferential welding of line pipes for transporting CO.sub.2 -containing petroleum, natural gases or CO.sub.2.

摘要翻译： 含有C：0.01〜0.06重量％，Si：0.10〜0.60重量％，Mn：0.9〜3.1重量％，Cr：0.7〜2.0重量％，Ti：0.005〜0.06重量％ 0.08重量％的Al，如果需要，为0.05〜0.30重量％的Cu，余量为Fe和不可避免的杂质。 该线材提高了所得到的焊接金属的选择性腐蚀性和低温韧性，特别适用于输送含CO 2的石油，天然气或二氧化碳的管线的周向焊接。

公开(公告)号：US20140004342A1

公开(公告)日：2014-01-02

申请号：US13983614

申请日：2012-01-31

申请人： Midori Tojo ,  Yusuke Nakayama ,  Yoshio Terada ,  Kenji Furuta

发明人： Midori Tojo ,  Yusuke Nakayama ,  Yoshio Terada ,  Kenji Furuta

IPC分类号： C08K3/22 ,  C09J7/02

CPC分类号： C08K3/22 ,  C08K3/016 ,  C09J7/385 ,  C09J133/04 ,  C09J2205/102 ,  Y10T428/2891

摘要： A flame-retardant thermally-conductive pressure-sensitive adhesive sheet includes a flame-retardant thermally-conductive pressure-sensitive adhesive layer containing at least: (a) an acrylic polymer prepared by copolymerizing a monomer component containing an alkyl(meth)acrylate as a main component, containing a polar group-containing monomer, and not substantially containing a carboxyl group-containing monomer and (b) a hydrated metal compound.

摘要翻译： 阻燃性导热性粘合片包括阻燃性导热性粘合剂层，其至少包含：（a）通过使包含（甲基）丙烯酸烷基酯的单体成分共聚而制备的丙烯酸类聚合物， 主要成分，含有含极性基团的单体，基本上不含有含羧基的单体，（b）水合金属化合物。

公开(公告)号：US20130068419A1

公开(公告)日：2013-03-21

申请号：US13699594

申请日：2011-03-25

申请人： Takuya Mase ,  Yoshio Terada ,  Midori Tojo

发明人： Takuya Mase ,  Yoshio Terada ,  Midori Tojo

IPC分类号： F28F21/08 ,  B32B37/06 ,  F28F9/00

CPC分类号： F28F21/084 ,  B32B37/06 ,  C09J7/10 ,  C09J9/00 ,  C09J109/00 ,  C09J115/00 ,  C09J2201/606 ,  C09J2409/00 ,  C09J2415/00 ,  F28F9/00 ,  Y10T156/10

摘要： A thermally conductive reinforcing sheet includes a reinforcing layer. After the thermally conductive reinforcing sheet is attached to an aluminum board having a thickness of 1.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet is 10 N or more and the thermal conductivity of the reinforcing layer is 0.25 W/m·K or more.

摘要翻译： 导热性增强片包括增强层。 在将导热性增强片粘贴在厚度为1.0mm的铝板上并在80℃加热10分钟后，得到的片材的位移1mm的弯曲强度为10N以上， 加强层的导热率为0.25W / m·K以上。

公开(公告)号：US20110290468A1

公开(公告)日：2011-12-01

申请号：US13147124

申请日：2010-01-13

申请人： Junichi Nakayama ,  Yoshio Terada ,  Kenji Furuta ,  Takashi Wano

发明人： Junichi Nakayama ,  Yoshio Terada ,  Kenji Furuta ,  Takashi Wano

IPC分类号： F28F7/00 ,  C09K5/00

CPC分类号： C09J133/08 ,  C08K7/00 ,  C08K2003/382 ,  C09J9/00 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 μm or more and 300 μm or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 μm or more and 20 μm or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 μm and 60 μm or less, 1.0 to 40% by volume of boron nitride particles having a particle size of more than 60 μm and 300 μm or less.

摘要翻译： 本发明的目的是提供一种能够形成具有良好导热性的成型体的氮化硼粒子和丙烯酸类聚合物的导热性粘合剂组合物，其中具有良好导热性的粘合剂组合物的导热性粘合剂片材 导热性和结合强度。 提供含有氮化硼颗粒和丙烯酸类聚合物组分的导热粘合剂组合物，并且上述氮化硼颗粒含有粒径为3μm以上至300μm以下的氮化硼颗粒，其中氮化硼颗粒含有5 至45体积％的粒径为3μm以上且20μm以下的氮化硼粒子，30〜70体积％的粒径为20μm以上且60μm以下的氮化硼粒子，1.0 至40体积％的粒径为60μm以上且300μm以下的氮化硼粒子。

公开(公告)号：US08048690B2

公开(公告)日：2011-11-01

申请号：US12513316

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  C08K3/017 ,  C08K7/06 ,  C09J7/21 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/263 ,  G01L1/20 ,  G01R31/026 ,  G01R31/2886 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/3511 ,  Y10T428/24331 ,  Y10T428/28 ,  Y10T428/2848

摘要： A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

摘要翻译： 根据本发明的压敏粘合片是在基膜上设置压敏粘合剂层的压敏粘合片，其中基膜含有导电纤维，其中导电路径为 形成在压敏粘合剂层和基膜之间。 利用这种结构，即使在通过切割半导体晶片形成的半导体晶片或半导体芯片被施加的状态下，也可以进行电连续性测试，并且半导体晶片的变形（翘曲）和损坏以及缺陷和划痕的产生 在测试中可以防止背面。

公开(公告)号：US20100313667A1

公开(公告)日：2010-12-16

申请号：US12513230

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： G01L9/00 ,  H01L21/66

CPC分类号： G01R1/0735 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/205 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/516 ,  B32B2307/518 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  G01R31/2853 ,  H01L21/67132 ,  H01L21/67253

摘要： Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

摘要翻译： 公开了一种用于检查的粘合片，其通过在基膜上布置粘合剂层而获得。 基膜和粘合剂层是导电的，并且在基膜和粘合剂层之间形成导电路径。 因此，可以在将半导体晶片或半导体芯片粘合到粘合片上的同时，进行通过切割半导体晶片获得的半导体晶片或半导体芯片的导电性的检查。 此外，该检查用粘合片能够防止半导体晶片的变形（翘曲）或断裂，或者在检查时在半导体晶片的背面产生裂纹或划痕。

公开(公告)号：US20100203323A1

公开(公告)日：2010-08-12

申请号：US12677405

申请日：2008-08-26

申请人： Yoshio Terada ,  Shozo Kawazoe ,  Yoshinori Yoshida

发明人： Yoshio Terada ,  Shozo Kawazoe ,  Yoshinori Yoshida

IPC分类号： B32B7/10 ,  B05D5/10

CPC分类号： B08B7/0028 ,  C09J7/00 ,  C09J2201/626 ,  H01L21/6836 ,  Y10T428/26

摘要： Provided are a pressure-sensitive adhesive tape, which has a needed pressure-sensitive adhesive force for an adherend, can remove even foreign matter at a submicron level without contaminating a cleaning site, is excellent in heat resistance, exerts a sufficient pressure-sensitive adhesive force and a sufficient cohesive force even at a high temperature, and can be easily peeled without generating any adhesive residue on the adherend upon peeling from the adherend after its use, and a method of producing the tape. The pressure-sensitive adhesive tape of the present invention includes, on a surface of a support, an assembly layer of oblique columnar structures each protruding at an elevation angle of less than 90° from the surface of the support, the oblique columnar structures each having an aspect ratio of 1 or more. The method of producing a pressure-sensitive adhesive tape of the present invention is a method of producing, on a surface of a support, a pressure-sensitive adhesive tape including an assembly layer of oblique columnar structures each protruding at an elevation angle of less than 90° from the surface of the support, the oblique columnar structures each having an aspect ratio of 1 or more, the method including forming the oblique columnar structures on the surface of the support by an oblique deposition process.

摘要翻译： 提供一种对被粘物具有必要的压敏粘合力的压敏粘合带，能够在不污染清洁部位的情况下除去亚微米级的异物，耐热性优异，施加足够的压敏粘合剂 并且即使在高温下也具有足够的内聚力，并且在使用后剥离被粘附体时，可以容易地剥离被粘物而不会在被粘物上产生粘合残留物，以及该带的制造方法。 本发明的压敏粘合带在支撑体的表面上包括倾斜柱状结构的组装层，每个倾斜柱状结构从支撑体的表面以低于90°的仰角突出，倾斜柱状结构各自具有 长宽比为1以上。 本发明的粘合带的制造方法是在支撑体的表面上制造压敏粘合带的方法，所述粘合带包括倾斜柱状结构的组装层，每个倾斜柱状结构以小于 从支撑体的表面90°，倾斜柱状结构各自具有1以上的纵横比，该方法包括通过倾斜沉积工艺在支撑体的表面上形成倾斜柱状结构。

公开(公告)号：US20070293597A1

公开(公告)日：2007-12-20

申请号：US11665772

申请日：2005-10-19

申请人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

发明人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

IPC分类号： C08G73/10 ,  C08L79/08

CPC分类号： C08G73/1025 ,  C08G73/10 ,  C08K3/04 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0387 ,  Y10T428/254 ,  Y10T428/2822 ,  Y10T428/31663

摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。

公开(公告)号：US20050048241A1

公开(公告)日：2005-03-03

申请号：US10497469

申请日：2002-10-31

申请人： Yoshio Terada ,  Makoto Namikawa

发明人： Yoshio Terada ,  Makoto Namikawa

IPC分类号： B08B1/00 ,  B08B7/00 ,  B32B7/06 ,  B32B27/00 ,  C11D17/04 ,  B32B9/00

CPC分类号： B08B7/0028 ,  C11D17/049 ,  Y10T428/14 ,  Y10T428/1452 ,  Y10T428/1457 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/2839 ,  Y10T428/2848

摘要： A cleaning sheet comprising: a cleaning layer; and a protective film treated with a releasing agent comprising a silicone, the protective film being provided as a separator on at least one side of the cleaning layer, wherein an amount of silicone attached to the cleaning layer when the separator is peeled off from the cleaning layer is 0.005 g/m2 or less as calculated in terms of polydimethylsiloxane.

摘要翻译： 一种清洁片，包括：清洁层; 以及由包含硅酮的脱模剂处理的保护膜，所述保护膜作为隔膜设置在所述清洁层的至少一侧上，其中当所述隔板从所述清洁层剥离时附着到所述清洁层上的硅氧化物量 层以聚二甲基硅氧烷计算为0.005g / m 2以下。

公开(公告)号：US06602599B1

公开(公告)日：2003-08-05

申请号：US09590131

申请日：2000-06-09

申请人： Eiji Toyoda ,  Makoto Namikawa ,  Yoshio Terada

发明人： Eiji Toyoda ,  Makoto Namikawa ,  Yoshio Terada

IPC分类号： B32B2730

CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J2203/31 ,  C09J2203/326 ,  H01L2221/68327 ,  Y10T428/1452 ,  Y10T428/1462 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： A low-staining adhesive sheet provided with an adhesive layer containing as the main component a pressure-sensitive adhesive polymer on a base film, wherein the pressure-sensitive adhesive polymer is substantially free from oligomeric low-molecular weight matters; and a method for removing a resist material by using this low-staining adhesive sheet. This low-staining adhesive sheet gives no organic staining matters remaining on the surface of article (for example, substrate) to be used as an adherend and is useful in removing a resist material and foreign matters, and re-peeling surface-protectors, masking materials, and other materials.

摘要翻译： 一种低染色粘合片，其具有在基膜上含有压敏粘合剂聚合物作为主要成分的粘合剂层，其中该粘合剂聚合物基本上不含低聚物低分子量物质; 以及通过使用该低色粘接片除去抗蚀剂材料的方法。 这种低染色粘合片不会在用作被粘物的物品（例如基材）的表面上残留有机染色物质，并且可用于除去抗蚀剂材料和异物，并且再剥离表面保护剂，掩蔽 材料等材料。