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公开(公告)号：US20090079096A1
公开(公告)日：2009-03-26
申请号：US11858588
申请日：2007-09-20
IPC分类号： H01L23/12
CPC分类号： H01L23/49575 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01027 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system comprising forming a first device unit, having a first external interconnect, and a second device unit, having a second external interconnect, in an array configuration; mounting an integrated circuit die over the first device unit; connecting the integrated circuit die and the first external interconnect; and encapsulating the integrated circuit die, the first device unit, and the second device unit with both the first external interconnect and the second external interconnect partially exposed.
摘要翻译： 一种集成电路封装系统，包括以阵列配置形成具有第一外部互连的第一器件单元和具有第二外部互连的第二器件单元; 在第一设备单元上安装集成电路管芯; 连接集成电路管芯和第一外部互连件; 并且将所述第一外部互连和第二外部互连部分地暴露在一起，封装所述集成电路管芯，所述第一器件单元和所述第二器件单元。
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公开(公告)号：US20080251901A1
公开(公告)日：2008-10-16
申请号：US12111183
申请日：2008-04-28
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/565 , H01L23/49575 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked integrated circuit package system is provided providing a lead frame having a die paddle, attaching a first integrated circuit on the die paddle of the lead frame, connecting first electrical interconnects between the first integrated circuit and the lead frame, encapsulating the first integrated circuit and the first electrical interconnects with the lead frame directly on a bottom mold and clamped by a top mold, attaching a second integrated circuit on the die paddle of the first integrated circuit, connecting second electrical interconnects between the second integrated circuit and the lead frame, and encapsulating the second integrated circuit and the second electrical interconnects.
摘要翻译： 提供一种堆叠集成电路封装系统，其提供具有管芯焊盘的引线框架，将引线框架的管芯焊盘上的第一集成电路连接到第一集成电路和引线框架之间，将第一集成电路封装在第一集成电路 并且与引线框架的第一电互连直接在底模上并由顶模夹紧，将第二集成电路连接到第一集成电路的管芯焊盘上，连接第二集成电路和引线框架之间的第二电互连， 并封装第二集成电路和第二电互连。
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公开(公告)号：US20080006929A1
公开(公告)日：2008-01-10
申请号：US11766785
申请日：2007-06-21
IPC分类号： H01L23/52
CPC分类号： H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/8314 , H01L2924/00014 , H01L2924/01027 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system comprising: forming leads adjacent a die paddle having a die pad extension; forming a region having one of the leads depopulated for the die pad extension; and connecting an integrated circuit die to the die pad extension.
摘要翻译： 一种集成电路封装系统，包括：在具有管芯焊盘延伸部的管芯焊盘上形成引线; 形成具有用于芯片焊盘延伸的人造丝的一个引线的区域; 以及将集成电路管芯连接到管芯焊盘延伸部。
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34.发明授权Integrated circuit packaging system with protective coating and method of manufacture thereof 有权具有保护涂层的集成电路封装系统及其制造方法公开(公告)号：US08803300B2
公开(公告)日：2014-08-12
申请号：US12889911
申请日：2010-09-24
IPC分类号： H01L23/495
CPC分类号： H01L23/49582 , H01L21/4832 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/484 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48699 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/73265 , H01L2224/83 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.
摘要翻译： 一种制造集成电路封装系统的方法，包括：形成具有管芯连接板和通过连接件连接的接触焊盘的引线框架; 在芯片附接板上安装集成电路管芯; 在所述引线框架和所述集成电路管芯上形成封装主体，所述封装主体包括从所述封装主体露出的所述管芯附接板，所述接触焊盘和所述连接部分的部分; 通过蚀刻掉接触垫和管芯附接板之间的连接来形成暴露的边缘; 以及在暴露的边缘上沉积耐焊层。
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35.发明授权Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof 有权集成电路封装系统，具有整体内部引线和焊盘及其制造方法公开(公告)号：US08633062B2
公开(公告)日：2014-01-21
申请号：US12823079
申请日：2010-06-24
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L23/49548 , H01L23/49503 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4943 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.
摘要翻译： 一种制造集成电路封装系统的方法包括：在所述板和所述外引线之间形成桨，外引线和内引线; 形成所述桨叶的非垂直桨叶边缘和所述内部导杆的面向所述非垂直桨叶边缘的非垂直前缘; 并将集成电路管芯封装在所述桨上。
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36.发明授权公开(公告)号：US08278148B2
公开(公告)日：2012-10-02
申请号：US11854989
申请日：2007-09-13
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/85001 , H01L2224/92247 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit package system is provided including forming a leadframe having a frame and a die paddle having leads thereon. The leads are held with respect to the die paddle. The leads are separated from the die paddle, and a die is attached to the die paddle. Bond wires are bonded between the leads and the die. The die and bond wires are encapsulated. The leadframe is singulated to separate the frame and the die paddle.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有框架的引线框架和在其上具有引线的管芯焊盘。 导线相对于芯片被保持。 引线与管芯分离，并且管芯附接到管芯焊盘。 接合线结合在引线和芯片之间。 管芯和接合线被封装。 引导框架被单独分离框架和模具桨。
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公开(公告)号：US07915724B2
公开(公告)日：2011-03-29
申请号：US11864826
申请日：2007-09-28
申请人： Jong-Woo Ha , Koo Hong Lee , Soo Won Lee , JuHyun Park , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
发明人： Jong-Woo Ha , Koo Hong Lee , Soo Won Lee , JuHyun Park , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
CPC分类号： H01L23/3121 , H01L24/48 , H01L24/73 , H01L25/03 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06558 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.
摘要翻译： 一种集成电路封装系统，包括：形成具有开口的基座结构; 将基座结构装置安装在开口中; 将集成电路装置连接在所述基座结构装置上; 以及在所述基座结构，所述基座结构装置和所述集成电路装置上模制密封剂。
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公开(公告)号：US07868471B2
公开(公告)日：2011-01-11
申请号：US11854934
申请日：2007-09-13
申请人： Zigmund Ramirez Camacho , Arnel Trasporto , Jeffrey D. Punzalan , Abelardo Hadap Advincula, Jr.
发明人： Zigmund Ramirez Camacho , Arnel Trasporto , Jeffrey D. Punzalan , Abelardo Hadap Advincula, Jr.
IPC分类号： H01L23/495
CPC分类号： H01L23/49551 , H01L23/3135 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.
摘要翻译： 集成电路封装包装系统包括：形成集成电路封装系统，包括：连接第一集成电路管芯和引线，以及形成覆盖所述第一集成电路管芯和所述引线的一部分的内部封装; 将第二集成电路管芯安装到所述集成电路封装系统; 连接第二集成电路管芯和引线; 以及形成覆盖所述集成电路封装系统的封装封装和所述引线暴露的所述第二集成电路管芯。
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公开(公告)号：US07777310B2
公开(公告)日：2010-08-17
申请号：US11670862
申请日：2007-02-02
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/49503 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4943 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.
摘要翻译： 提供一种集成电路封装系统，包括在所述桨和所述外引线之间形成桨，外引线和内引线; 形成所述桨叶的非垂直桨叶边缘和所述内部导杆的面向所述非垂直桨叶边缘的非垂直前缘; 并将集成电路管芯封装在所述桨上。
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公开(公告)号：US07759806B2
公开(公告)日：2010-07-20
申请号：US11858588
申请日：2007-09-20
IPC分类号： H01L23/28
CPC分类号： H01L23/49575 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01027 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system comprising forming a first device unit, having a first external interconnect, and a second device unit, having a second external interconnect, in an array configuration; mounting an integrated circuit die over the first device unit; connecting the integrated circuit die and the first external interconnect; and encapsulating the integrated circuit die, the first device unit, and the second device unit with both the first external interconnect and the second external interconnect partially exposed.
摘要翻译： 一种集成电路封装系统，包括以阵列配置形成具有第一外部互连的第一器件单元和具有第二外部互连的第二器件单元; 在第一设备单元上安装集成电路管芯; 连接集成电路管芯和第一外部互连件; 并且将所述第一外部互连和第二外部互连部分地暴露在一起，封装所述集成电路管芯，所述第一器件单元和所述第二器件单元。
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