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公开(公告)号：US07868471B2
公开(公告)日：2011-01-11
申请号：US11854934
申请日：2007-09-13
申请人： Zigmund Ramirez Camacho , Arnel Trasporto , Jeffrey D. Punzalan , Abelardo Hadap Advincula, Jr.
发明人： Zigmund Ramirez Camacho , Arnel Trasporto , Jeffrey D. Punzalan , Abelardo Hadap Advincula, Jr.
IPC分类号： H01L23/495
CPC分类号： H01L23/49551 , H01L23/3135 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.
摘要翻译： 集成电路封装包装系统包括：形成集成电路封装系统，包括：连接第一集成电路管芯和引线，以及形成覆盖所述第一集成电路管芯和所述引线的一部分的内部封装; 将第二集成电路管芯安装到所述集成电路封装系统; 连接第二集成电路管芯和引线; 以及形成覆盖所述集成电路封装系统的封装封装和所述引线暴露的所述第二集成电路管芯。
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公开(公告)号：US08629537B2
公开(公告)日：2014-01-14
申请号：US11339176
申请日：2006-01-23
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports.
摘要翻译： 提供了一种集成电路封装系统，其从具有管芯支撑件的无衬垫引线框架形成管芯支撑系统，每个管芯支架各自与另一个基本上等间隔开，并且在管芯支撑件上附接具有周边区域的集成电路管芯。
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公开(公告)号：US20090079096A1
公开(公告)日：2009-03-26
申请号：US11858588
申请日：2007-09-20
IPC分类号： H01L23/12
CPC分类号： H01L23/49575 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01027 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system comprising forming a first device unit, having a first external interconnect, and a second device unit, having a second external interconnect, in an array configuration; mounting an integrated circuit die over the first device unit; connecting the integrated circuit die and the first external interconnect; and encapsulating the integrated circuit die, the first device unit, and the second device unit with both the first external interconnect and the second external interconnect partially exposed.
摘要翻译： 一种集成电路封装系统，包括以阵列配置形成具有第一外部互连的第一器件单元和具有第二外部互连的第二器件单元; 在第一设备单元上安装集成电路管芯; 连接集成电路管芯和第一外部互连件; 并且将所述第一外部互连和第二外部互连部分地暴露在一起，封装所述集成电路管芯，所述第一器件单元和所述第二器件单元。
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公开(公告)号：US20080251901A1
公开(公告)日：2008-10-16
申请号：US12111183
申请日：2008-04-28
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/565 , H01L23/49575 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked integrated circuit package system is provided providing a lead frame having a die paddle, attaching a first integrated circuit on the die paddle of the lead frame, connecting first electrical interconnects between the first integrated circuit and the lead frame, encapsulating the first integrated circuit and the first electrical interconnects with the lead frame directly on a bottom mold and clamped by a top mold, attaching a second integrated circuit on the die paddle of the first integrated circuit, connecting second electrical interconnects between the second integrated circuit and the lead frame, and encapsulating the second integrated circuit and the second electrical interconnects.
摘要翻译： 提供一种堆叠集成电路封装系统，其提供具有管芯焊盘的引线框架，将引线框架的管芯焊盘上的第一集成电路连接到第一集成电路和引线框架之间，将第一集成电路封装在第一集成电路 并且与引线框架的第一电互连直接在底模上并由顶模夹紧，将第二集成电路连接到第一集成电路的管芯焊盘上，连接第二集成电路和引线框架之间的第二电互连， 并封装第二集成电路和第二电互连。
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公开(公告)号：US20090072363A1
公开(公告)日：2009-03-19
申请号：US11854934
申请日：2007-09-13
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49551 , H01L23/3135 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.
摘要翻译： 集成电路封装包装系统包括：形成集成电路封装系统，包括：连接第一集成电路管芯和引线，以及形成覆盖所述第一集成电路管芯和所述引线的一部分的内部封装; 将第二集成电路管芯安装到所述集成电路封装系统; 连接第二集成电路管芯和引线; 以及形成覆盖所述集成电路封装系统的封装封装和所述引线暴露的所述第二集成电路管芯。
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公开(公告)号：US20070170559A1
公开(公告)日：2007-07-26
申请号：US11307128
申请日：2006-01-24
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L23/49548 , H01L24/81 , H01L2224/16 , H01L2224/16237 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81385 , H01L2224/81801 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip hole of the lead finger.
摘要翻译： 提供一种集成电路封装系统，从无铅引线框架形成引线指，在引线指中形成引线尖端孔，将具有焊料凸点的集成电路芯片安装在引线指状物上，并将引线尖端上的焊料凸点回流 导针的孔。
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公开(公告)号：US07977579B2
公开(公告)日：2011-07-12
申请号：US11278070
申请日：2006-03-30
IPC分类号： H05K1/16
CPC分类号： H05K1/183 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L23/49822 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06589 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/141 , H05K3/3436 , H05K2201/09845 , H05K2201/10515 , H05K2201/10674 , H05K2201/10689 , Y10T29/4913 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.
摘要翻译： 一种集成电路封装系统，包括形成多层衬底，以及在多层衬底上附着多个集成电路。
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公开(公告)号：US07541221B2
公开(公告)日：2009-06-02
申请号：US11307386
申请日：2006-02-04
CPC分类号： H01L23/49548 , H01L23/49579 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/1601 , H01L2224/81141 , H01L2224/81192 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15151
摘要： An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.
摘要翻译： 一种集成电路封装系统，包括形成具有预定高度的引线支架的引线的引线框架，并且以由引导板支撑件的预定高度确定的预定的折叠高度将集成电路管芯与电互连件连接。
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公开(公告)号：US07365417B2
公开(公告)日：2008-04-29
申请号：US11306693
申请日：2006-01-06
IPC分类号： H01L23/02
CPC分类号： H01L23/3107 , H01L23/49513 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/27013 , H01L2224/2919 , H01L2224/32014 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83194 , H01L2224/83385 , H01L2224/8385 , H01L2224/85 , H01L2924/00014 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided attaching a film to a die paddle, applying an adhesive to the film, and attaching an integrated circuit die over the adhesive and the film to the die paddle.
摘要翻译： 提供了一种集成电路封装系统，其将膜连接到管芯焊盘，向膜施加粘合剂，以及将集成电路管芯粘合到粘合剂和膜上并附接到管芯焊盘。
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公开(公告)号：US08633578B2
公开(公告)日：2014-01-21
申请号：US13196279
申请日：2011-08-02
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base includes: a base package including: a laminate substrate strip, an integrated circuit on the laminate substrate strip, a molded cover over the integrated circuit and the laminate substrate strip, and a strip test of the base package; a bare die on the base package; the bare die electrically connected to the laminate substrate strip; and the bare die and the base package encapsulated.
摘要翻译： 一种具有层压基座的集成电路封装系统，包括：基座封装，包括：叠层基板条，叠层基板条上的集成电路，集成电路上的模制盖和叠层基板条，以及基板封装 ; 在基础包上裸露的裸片; 所述裸模与所述层叠基板条电连接; 并封装了裸芯片和基底封装。
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