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1.发明授权Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof 有权集成电路封装系统，具有整体内部引线和焊盘及其制造方法公开(公告)号：US08633062B2
公开(公告)日：2014-01-21
申请号：US12823079
申请日：2010-06-24
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L23/49548 , H01L23/49503 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4943 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.
摘要翻译： 一种制造集成电路封装系统的方法包括：在所述板和所述外引线之间形成桨，外引线和内引线; 形成所述桨叶的非垂直桨叶边缘和所述内部导杆的面向所述非垂直桨叶边缘的非垂直前缘; 并将集成电路管芯封装在所述桨上。
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公开(公告)号：US08207597B2
公开(公告)日：2012-06-26
申请号：US11670899
申请日：2007-02-02
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L21/4828 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.
摘要翻译： 提供了一种集成电路封装系统，包括形成引线框架，该引线框架包括形成具有平坦表面的内引线，该内引线从引线框架向内延伸并形成与引线框架一体的加强结构，用于保持平面; 将内部引线封装到集成电路管芯的电连接处，并且内部引线的第一内部引线体被暴露; 并从引线框架中分离出内引线。
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3.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PROTECTIVE COATING AND METHOD OF MANUFACTURE THEREOF 有权具有保护涂层的集成电路包装系统及其制造方法公开(公告)号：US20110079888A1
公开(公告)日：2011-04-07
申请号：US12889911
申请日：2010-09-24
CPC分类号： H01L23/49582 , H01L21/4832 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/484 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48699 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/73265 , H01L2224/83 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.
摘要翻译： 一种制造集成电路封装系统的方法，包括：形成具有管芯连接板和通过连接件连接的接触焊盘的引线框架; 在芯片附接板上安装集成电路管芯; 在所述引线框架和所述集成电路管芯上形成封装主体，所述封装主体包括从所述封装主体露出的所述管芯附接焊盘，所述接触焊盘和所述连接部分的部分; 通过蚀刻掉接触垫和管芯附接板之间的连接来形成暴露的边缘; 以及在暴露的边缘上沉积耐焊层。
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4.发明授权Integrated circuit package system with interconnection support and method of manufacture thereof 有权具有互连支持的集成电路封装系统及其制造方法公开(公告)号：US07901996B2
公开(公告)日：2011-03-08
申请号：US12484131
申请日：2009-06-12
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L2224/10175 , H01L2224/16 , H01L2224/16245 , H01L2924/3841 , Y10T29/49121 , Y10T29/49169 , Y10T29/49181
摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路上的芯片支持。
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公开(公告)号：US07871863B2
公开(公告)日：2011-01-18
申请号：US12237291
申请日：2008-09-24
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L21/568 , H01L23/3135 , H01L23/495 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a lead from a padless lead frame, and encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.
摘要翻译： 提供了一种集成电路封装系统，其从无铅引线框架形成引线，并且封装所述引线以将第一模塑料与第二模塑料一起封装，用于支撑集成电路模具。
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公开(公告)号：US20090250798A1
公开(公告)日：2009-10-08
申请号：US12484131
申请日：2009-06-12
IPC分类号： H01L23/495 , H01L21/56 , H01L23/498 , H01L23/28
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L2224/10175 , H01L2224/16 , H01L2224/16245 , H01L2924/3841 , Y10T29/49121 , Y10T29/49169 , Y10T29/49181
摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。
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公开(公告)号：US20090085178A1
公开(公告)日：2009-04-02
申请号：US11864826
申请日：2007-09-28
申请人： Jong-Woo Ha , Koo Hong Lee , Soo Won Lee , JuHyun Park , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
发明人： Jong-Woo Ha , Koo Hong Lee , Soo Won Lee , JuHyun Park , Zigmund Ramirez Camacho , Jeffrey D. Punzalan , Lionel Chien Hui Tay , Jairus Legaspi Pisigan
IPC分类号： H01L23/495 , H01L23/02
CPC分类号： H01L23/3121 , H01L24/48 , H01L24/73 , H01L25/03 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06558 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.
摘要翻译： 一种集成电路封装系统，包括：形成具有开口的基座结构; 将基座结构装置安装在开口中; 将集成电路装置连接在所述基座结构装置上; 以及在所述基座结构，所述基座结构装置和所述集成电路装置上模制密封剂。
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8.发明申请公开(公告)号：US20090072412A1
公开(公告)日：2009-03-19
申请号：US11855114
申请日：2007-09-13
CPC分类号： H01L23/3135 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16245 , H01L2224/32225 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1029 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external interconnect exposed by the recess; and connecting an integrated circuit device and the external interconnect in the recess.
摘要翻译： 集成电路封装系统包括：形成外部互连; 连接集成电路管芯和外部互连; 形成具有凹部的封装封装，用所述凹部暴露的外部互连部分覆盖所述集成电路管芯; 并将集成电路器件和外部互连件连接在凹槽中。
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公开(公告)号：US20090072363A1
公开(公告)日：2009-03-19
申请号：US11854934
申请日：2007-09-13
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49551 , H01L23/3135 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.
摘要翻译： 集成电路封装包装系统包括：形成集成电路封装系统，包括：连接第一集成电路管芯和引线，以及形成覆盖所述第一集成电路管芯和所述引线的一部分的内部封装; 将第二集成电路管芯安装到所述集成电路封装系统; 连接第二集成电路管芯和引线; 以及形成覆盖所述集成电路封装系统的封装封装和所述引线暴露的所述第二集成电路管芯。
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公开(公告)号：US20090002961A1
公开(公告)日：2009-01-01
申请号：US11769520
申请日：2007-06-27
IPC分类号： H05K7/00 , H01L23/495
CPC分类号： H01L23/49551 , H01L23/047 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01014 , H01L2924/01028 , H01L2924/01033 , H01L2924/01046 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H04R31/00 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.
摘要翻译： 一种包装系统，包括：形成端子引线; 通过用化合物部分地封装端子引线来配置空腔; 在空腔中附接集成电路器件，微机电系统，微机械系统或其组合; 以及将盖结合到用于封闭空腔的端子引线。
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