公开(公告)号：US4389432A

公开(公告)日：1983-06-21

申请号：US386230

申请日：1982-06-08

申请人： Yoshio Inoue ,  Hisashi Shimizu

发明人： Yoshio Inoue ,  Hisashi Shimizu

IPC分类号： C08J7/04 ,  B05D1/36 ,  B05D7/02 ,  B05D7/24 ,  C08L43/04 ,  C08L83/04 ,  C09D5/00 ,  C09D125/06 ,  C09D127/06 ,  C09D131/04 ,  C09D133/12 ,  C09D137/00 ,  C09D143/04 ,  C09J5/00 ,  C09J5/02 ,  C09J133/04 ,  C08L31/02

CPC分类号： B05D7/54 ,  C09D125/06 ,  C09D127/06 ,  C09D131/04 ,  C09D133/12 ,  C09D143/04 ,  C09D5/002 ,  B05D2518/10 ,  C08L43/04 ,  C08L83/04 ,  Y10T428/31663

摘要： The invention provides a novel means for solving the problem of poor adhesion between the surface of a substrate of a metal or a plastic resin, e.g. polycarbonate resin, and a cured coating film of an organopolysiloxane formed thereon to impart good surface properties, e.g. hardness and weathering resistance, to the substrate surface by use of an adhesion improver as a primer which comprises a copolymer of an organosilicon compound having a hydrolyzable group and an ethylenic unsaturation in the molecule, glycidyl methacrylate and an organic monomer, e.g. methyl methacrylate and vinyl acetate, a reaction product of an aminoalkyl-containing organosilane compound and an acid anhydride and, optionally, an ultra-violet light absorber in a limited proportion.

摘要翻译： 本发明提供了解决金属或塑料树脂的基材表面之间的粘合性差的新颖方法，例如， 聚碳酸酯树脂和其上形成的有机聚硅氧烷的固化涂膜以赋予良好的表面性质，例如。 硬度和耐候性，通过使用粘合改进剂作为底漆，其包含分子中具有可水解基团和烯属不饱和键的有机硅化合物的共聚物，甲基丙烯酸缩水甘油酯和有机单体，例如， 甲基丙烯酸甲酯和乙酸乙烯酯，含氨基烷基的有机硅烷化合物与酸酐的反应产物和任选的有限比例的紫外光吸收剂。

公开(公告)号：US4332012A

公开(公告)日：1982-05-25

申请号：US96230

申请日：1979-11-20

申请人： Yoshitada Sekine ,  Hiroshi Imaizumi ,  Shoji Katagi ,  Kazunori Obata ,  Kazuyoshi Abe ,  Hisashi Shimizu

发明人： Yoshitada Sekine ,  Hiroshi Imaizumi ,  Shoji Katagi ,  Kazunori Obata ,  Kazuyoshi Abe ,  Hisashi Shimizu

IPC分类号： B23P21/00 ,  B62D65/00 ,  B62D65/02 ,  B62D65/18 ,  G05B19/12 ,  G05B19/418 ,  G06K7/10 ,  B07C3/14

CPC分类号： B62D65/02 ,  B62D65/18 ,  G05B19/128 ,  G05B19/4182 ,  G05B2219/23363 ,  Y02P90/04 ,  Y02P90/083 ,  Y02P90/10

摘要： Control of an automotive vehicle component assembling system having one or more series of assembly lines used in common for assembling various models, standards and/or specifications of vehicle component is provided by converting information and instructions relating to various models, standards and/or specifications of vehicle component into a sign. The sign is fitted onto one of the part of the component. Information and instructions from the sign are detected automatically to control picking up of parts and assembling operations in each assembly line.

摘要翻译： 具有通常用于组装车辆部件的各种型号，标准和/或规格的一个或多个组合线的车辆部件组装系统的控制通过转换与各种型号，标准和/或规格有关的信息和指令来提供 车辆部件成一个标志。 符号被安装在部件的一部分上。 自动检测符号的信息和指示，以控制零件的拾取和组装操作。

公开(公告)号：USD539884S1

公开(公告)日：2007-04-03

申请号：US29257353

申请日：2006-04-04

申请人： Hisashi Shimizu

设计人： Hisashi Shimizu

公开(公告)号：US06489637B1

公开(公告)日：2002-12-03

申请号：US09536730

申请日：2000-03-28

申请人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

发明人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

IPC分类号： H01L3300

CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. Flow-stopping means 36 made of a brazing material is formed around each of the light emitting diodes 10. Also the surface of the brazing material is used as a reflecting surface.

摘要翻译： 在其中发光元件附着在印刷电路板上的光照射装置中，散热性能得到提高，并且实现了发光效率的提高和尺寸和重量的降低。 在金属基板11上形成覆盖有Ni的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。在每个发光二极管10周围形成由钎焊材料制成的阻流装置36.此外，钎焊材料的表面 用作反射面。

公开(公告)号：US5242044A

公开(公告)日：1993-09-07

申请号：US925575

申请日：1992-08-04

申请人： Shoichi Yamaguchi ,  Hisashi Shimizu

发明人： Shoichi Yamaguchi ,  Hisashi Shimizu

IPC分类号： B05B13/02 ,  B05C13/00 ,  B05D1/00 ,  B65G19/02 ,  B65G47/52

CPC分类号： B05B13/0221 ,  B05D1/002 ,  B05B13/0452

摘要： In a carriage for conveying an article such as an automobile body on a coating line, a sprocket on the carriage engages an endless chain running along the path of carriage movement. The sprocket causes the article to rotate on an axis parallel to the direction of movement of the carriage. A pendulum weight is provided to cause the article normally to assume an upright condition. A lever on the sprocket shaft engages a cam as the sprocket approaches engagement with the endless chain, and causes the weight to swing in one direction. When the lever clears the cam, the weight returns by gravity, causing the sprocket to begin rotating so that it smoothly engages the chain without shock. The operation of the lever, cam and weight also impart rotation to article to be painted before the sprocket engages the chain, thereby eliminating shocks in the rotating movement of the article, which could otherwise cause sagging or running of the paint.

摘要翻译： 在用于在涂布线上输送诸如汽车车身的物品的托架中，托架上的链轮接合沿着托架移动路径延伸的环形链。 链轮使得物品在平行于托架移动方向的轴线上旋转。 提供摆锤重量以使制品通常呈现直立状态。 当链轮与环形链接合时，链轮轴上的杠杆接合凸轮，并使重量在一个方向上摆动。 当杠杆清除凸轮时，重量由重力返回，导致链轮开始旋转，使其平滑地与链条啮合而不受冲击。 杠杆，凸轮和重量的操作还在链轮接合链条之前使待涂漆的物品旋转，从而消除制品旋转运动中的冲击，否则可能导致油漆下垂或运行。

公开(公告)号：US5159433A

公开(公告)日：1992-10-27

申请号：US510468

申请日：1990-04-18

申请人： Akira Kazami ,  Osamu Nakamoto ,  Hisashi Shimizu ,  Katsumi Ohkawa ,  Yasuhiro Koike ,  Koji Nagahama ,  Masao Kaneko ,  Masakazu Ueno ,  Yasuo Saitou

发明人： Akira Kazami ,  Osamu Nakamoto ,  Hisashi Shimizu ,  Katsumi Ohkawa ,  Yasuhiro Koike ,  Koji Nagahama ,  Masao Kaneko ,  Masakazu Ueno ,  Yasuo Saitou

IPC分类号： H01L21/00 ,  H01L25/16 ,  H05K1/14 ,  H05K1/18

CPC分类号： H01L21/67126 ,  H01L21/67121 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/09701 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/18

摘要： In a position closest to the mounting position of a microcomputer in a casing of a hybrid integrated circuit device on which is mounted the microcomputer and its peripheral circuit elements, an insertion hole is formed for a non-volatile memory which feeds data to the microcomputer. A socket for connecting the non-volatile memory is provided at the bottom of this insertion hole. Because of this configuration it is possible to connect the microcomputer and the non-volatile memory at an extremely short distance and the mounting efficiency of the integrated circuit device is increased. In addition, the non-volatile memory can detachably be mounted. Furthermore, the external shape of the insertion hole for the non-volatile memory is essentially the same as the external shape of the non-volatile memory so that when the non-volatile memory is inserted, the entire surface of this hybrid integrated circuit device is almost flat, providing excellent handling characteristics.

公开(公告)号：US4678688A

公开(公告)日：1987-07-07

申请号：US834906

申请日：1986-02-28

申请人： Kunio Itoh ,  Shohei Kozakai ,  Yoshinori Hida ,  Hiroshige Okinoshima ,  Fumio Okada ,  Toshio Oba ,  Hisashi Shimizu ,  Yuji Hinoto ,  Hiroshi Yoshioka

发明人： Kunio Itoh ,  Shohei Kozakai ,  Yoshinori Hida ,  Hiroshige Okinoshima ,  Fumio Okada ,  Toshio Oba ,  Hisashi Shimizu ,  Yuji Hinoto ,  Hiroshi Yoshioka

IPC分类号： C08G77/54 ,  C09D183/14 ,  B05D3/02

CPC分类号： C08J7/047 ,  C08G77/54 ,  C09D183/14 ,  C08J2483/00

摘要： The inventive method for forming a cured film on a substrate surface comprises coating the surface with a room temperature curable organosiloxazane polymer comprising, in a molecule, (a) at least one organosiloxane unit represented by the unit formula (a) at least one organosiloxane unit represented by the unit formulaR.sup.1.sub.a SiO.sub.(4-a)/2,and (b) at least one organosilazane unit represented by the unit formulaR.sup.2.sub.b Si(NR.sup.3).sub.(4-b)/2,in which R.sup.1, R.sup.2 and R.sup.3 are each a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, not all of them being simultaneously hydrogen atoms, and the subscripts a and b are each a positive integer of 1, 2 or 3 with the proviso that a and b cannot be simultaneously equal to 3, in a molecule and subjecting the coating film to exposure to a moisture-containing atmosphere. The method is useful for forming a surface-protecting film or for imparting surface releasability.

摘要翻译： 用于在基材表面上形成固化膜的本发明方法包括用室温可固化的有机硅氮烷聚合物涂覆表面，所述室温可固化的有机硅氮烷聚合物在分子中包含（a）至少一个由式（a）表示的有机硅氧烷单元，至少一个有机硅氧烷单元 由式R1aSiO（4-a）/ 2表示的至少一种有机硅氮烷单元，（b）由单元式R2bSi（NR3）（4-b）/ 2表示的至少一种有机硅氮烷单元，其中R1，R2和R3各自为 氢原子或取代或未取代的一价烃基，并不全部同时为氢原子，下标a和b各自为正整数1,2或3，条件是a和b不能同时为3 在分子中并使涂膜暴露于含水气氛。 该方法可用于形成表面保护膜或赋予表面剥离性。

公开(公告)号：USD550822S1

公开(公告)日：2007-09-11

申请号：US29268739

申请日：2006-11-13

申请人： Hisashi Shimizu

设计人： Hisashi Shimizu

公开(公告)号：US06730933B1

公开(公告)日：2004-05-04

申请号：US09536898

申请日：2000-03-28

申请人： Hisashi Shimizu ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi

发明人： Hisashi Shimizu ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi

IPC分类号： H01L2715

CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency, reduction of the size and weight, and prevention of temporal changes are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. A transparent substrate 50 is bonded via a seal 51, and temporal changes of a light emitting element 10 and electrodes which are sealed therein are suppressed.

摘要翻译： 在其中将发光元件附着在印刷电路板上的光照射装置中，提高了散热性能，并且实现了发光效率的提高，尺寸和重量的减小以及防止时间变化。 在金属基板11上形成被Ni覆盖的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。透明基板50通过密封件51接合，发光元件10的时间变化和密封在其中的电极被抑制 。

公开(公告)号：US06548832B1

公开(公告)日：2003-04-15

申请号：US09536921

申请日：2000-03-28

申请人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

发明人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

IPC分类号： H01L3300

CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/52 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48472 ,  H01L2924/12041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. When a circuit is configured in one region of a hybrid integrated circuit substrate, a position recognition mark 53 and a flow stop 57 are disposed in the open region. Also the region is covered with Ni so as to function as reflecting means.

摘要翻译： 在其中发光元件附着在印刷电路板上的光照射装置中，散热性能得到提高，并且实现了发光效率的提高和尺寸和重量的降低。 在金属基板11上形成覆盖有Ni的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。当在混合集成电路基板的一个区域中配置电路时，将位置识别标记53和流动停止器57设置在 开放区域。 此外，该区域被Ni覆盖，以起到反射装置的作用。