公开(公告)号：US09070615B2

公开(公告)日：2015-06-30

申请号：US14289512

申请日：2014-05-28

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Guenther Ruhl ,  Horst Theuss ,  Irmgard Escher-Poeppel

IPC: H01L29/06 ,  H01L29/16 ,  G01N27/12 ,  H01L23/31 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/00 ,  G01N33/00

CPC classification number: H01L29/1606 ,  G01N27/127 ,  G01N33/0059 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.

Abstract translation: 在基板上产生石​​墨烯层。 在石墨烯层上沉积塑料材料以至少部分地覆盖石墨烯层。 将基板分成至少两个基片。

公开(公告)号：US20150061144A1

公开(公告)日：2015-03-05

申请号：US14476241

申请日：2014-09-03

Applicant: Infineon Technologies AG

Inventor： Gottfried Beer ,  Irmgard Escher-Poeppel ,  Juergen Hoegerl ,  Olaf Hohlfeld ,  Peter Kanschat

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/528 ,  H01L25/07 ,  H01L25/00

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/24 ,  H01L24/33 ,  H01L24/72 ,  H01L24/82 ,  H01L24/90 ,  H01L24/96 ,  H01L24/97 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/03002 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/29011 ,  H01L2224/33181 ,  H01L2224/82039 ,  H01L2224/96 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/35 ,  H01L2924/00

Abstract: A semiconductor arrangement includes upper and lower contact plates and basic chip assemblies. Each chip assembly has a semiconductor chip having a semiconductor body with upper and lower spaced apart sides. An individual upper main electrode and an individual control electrode are arranged on the upper side. The chip assemblies have either respectively a separate lower main electrode arranged on the lower side of the semiconductor chip of the corresponding basic chip assembly, or a common lower main electrode, which for each of the chip assemblies is arranged on the lower side of the semiconductor body of that chip assembly. An electrical current between the individual upper main electrode and the individual or common lower main electrode is controllable by its control electrode. The chip assemblies are connected to one another with a material bonded connection by a dielectric embedding compound, forming a solid assembly.

Abstract translation: 半导体装置包括上和下接触板和基本芯片组件。 每个芯片组件具有半导体芯片，半导体芯片具有上部和下部间隔开的侧面的半导体本体。 单独的上主电极和单独的控制电极设置在上侧。 芯片组件分别具有布置在相应的基本芯片组件的半导体芯片的下侧上的单独的下部主电极或共同的下部主电极，其中每个芯片组件布置在半导体的下侧 该芯片组件的主体。 各个上主电极和单个或公共下主电极之间的电流可由其控制电极控制。 芯片组件通过电介质嵌入化合物的材料结合连接彼此连接，形成固体组件。

公开(公告)号：US20150061048A1

公开(公告)日：2015-03-05

申请号：US14011566

申请日：2013-08-27

Applicant: Infineon Technologies AG

Inventor： Irmgard Escher-Poeppel ,  Edward Fuergut ,  Alfons Dehe

IPC: H04R1/02 ,  H04R31/00 ,  H04R19/00

CPC classification number: H04R1/021 ,  H04R1/086 ,  H04R19/005 ,  H04R31/006 ,  H04R2201/003 ,  H04R2201/02 ,  H04R2231/003

Abstract: A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding arrangement and acoustically coupled to the MEMS device, and a grille within the sound port. Some embodiments relate to a sound transducer component including an embedding material and a substrate-stripped MEMS die embedded into the embedding material. The MEMS die may comprise a diaphragm for sound transduction. The sound transducer component may further comprise a sound port within the embedding material in fluidic or acoustic contact with the diaphragm. Further embodiments relate to a method for packaging a MEMS device or to a method for manufacturing a sound transducer component.

Abstract translation: 封装的MEMS器件可以包括嵌入布置，布置在嵌入布置中的MEMS器件，布置在嵌入布置中并声耦合到MEMS器件的声音端口和声音端口内的格栅。 一些实施例涉及包括嵌入材料和嵌入到嵌入材料中的剥离衬底的MEMS芯片的声音传感器部件。 MEMS管芯可以包括用于声音传递的隔膜。 声音传感器部件还可以包括与隔膜流体或声学接触的嵌入材料内的声音端口。 另外的实施例涉及用于封装MEMS装置的方法或用于制造声换能器部件的方法。

公开(公告)号：US20150021792A1

公开(公告)日：2015-01-22

申请号：US13944927

申请日：2013-07-18

Applicant: Infineon Technologies AG

Inventor： Irmgard Escher-Poeppel ,  Eduard KNAUER ,  Thomas KUNSTMANN ,  Peter SCHERL ,  Raimund FOERG

IPC: H01L23/00 ,  H01L23/373

CPC classification number: H01L24/29 ,  H01L23/3736 ,  H01L24/27 ,  H01L24/743 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/27332 ,  H01L2224/27848 ,  H01L2224/29247 ,  H01L2224/29647 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/83011 ,  H01L2224/83065 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2224/85547 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/01001 ,  H01L2924/20106 ,  H01L2924/00

Abstract: An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and connecting the metal layers such that a single metal layer is formed.

Abstract translation: 用于制造具有通过金属层连接的两个部件的电子器件的实施例方法包括将金属层施加到每个部件并连接金属层，使得形成单个金属层。

公开(公告)号：US20140327003A1

公开(公告)日：2014-11-06

申请号：US13886283

申请日：2013-05-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Edward FUERGUT ,  Irmgard Escher-Poeppel ,  Manfred Engelhardt ,  Hans-Joerg Timme ,  Hannes Eder

IPC: H01L21/66 ,  H01L21/67

CPC classification number: H01L22/24 ,  H01L21/568 ,  H01L21/67069 ,  H01L21/67253 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/784 ,  H01L22/12 ,  H01L22/26 ,  H01L22/30 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/94 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate is provided, wherein the method comprises etching the electronic chips, detecting information indicative of an at least partial removal of an indicator structure following an exposure of the indicator structure embedded within at least a part of the electronic chips and being exposed after the etching has removed chip material above the indicator structure, and adjusting the processing upon detecting the information indicative of the at least partial removal of the indicator structure.

Abstract translation: 提供一种处理在公共基板中彼此连接的多个封装电子芯片的方法，其中所述方法包括蚀刻所述电子芯片，检测指示在所述指示符的曝光之后至少部分移除指示符结构的信息 嵌入在电子芯片的至少一部分内并且在蚀刻之后暴露出指示器结构之上的芯片材料的结构，以及在检测到指示结构的至少部分移除的信息时调整处理。