Abstract:
A microsystem with an integrated energy source serves as a platform and ecosystem for a variety of microsystems for implanting into human tissue. The microsystem includes a flexible battery located in an enclosed void. The enclosed void is formed by joining a first dielectric element with a second dielectric element.
Abstract:
A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.
Abstract:
An electrically conductive paste providing low alpha particle emission is provided. A resin and conductive particles are mixed, and a curing agent is added. A solvent is subsequently added. The electrically conductive paste including a resin compound is formed by mixing the mixture in a high shear mixer. The electrically conductive paste can be applied to a surface of an article to form a coating, or can be molded into an article. The solvent is evaporated, and the electrically conductive paste is cured to provide a graphite-containing resin compound. The graphite-containing resin compound is electrically conductive, and provides low alpha particle emission at a level suitable for a low alpha particle emissivity coating.
Abstract:
A battery, comprising a cathode comprising a cathode material in contact with a cathode current collector. The battery also comprises an electrolyte. The battery also comprises an anode comprising an electroplated homogeneous solid metallic alloy comprising 100 ppm to 1000 ppm Bi and 100 ppm to 1000 ppm In, and a remainder Zn.
Abstract:
A method for providing a matrix material between a bonded pair of substrates with a homogeneous distribution of anisotropic filler particles is provided. Functionalized anisotropic filler particles are mixed uniformly with a matrix material to form a homogenous mixture. A bonded assembly of a first substrate and a second substrate with an array of electrical interconnect structures is placed within a vacuum environment. The homogenous mixture of the matrix material and the anisotropic filler particles is dispensed around the array of electrical interconnect structures. A gas is abruptly introduced into the vacuum environment to induce an implosion of the homogenous mixture. The implosion causes the homogenous mixture to fill the cavity between the first and second substrates without causing agglomeration of the anisotropic filler particles. The mixture filling the space between the first and second substrates has a homogenous distribution of the anisotropic filler particles.
Abstract:
A method for providing a matrix material between a bonded pair of substrates with a homogeneous distribution of anisotropic filler particles is provided. Functionalized anisotropic filler particles are mixed uniformly with a matrix material to form a homogenous mixture. A bonded assembly of a first substrate and a second substrate with an array of electrical interconnect structures is placed within a vacuum environment. The homogenous mixture of the matrix material and the anisotropic filler particles is dispensed around the array of electrical interconnect structures. A gas is abruptly introduced into the vacuum environment to induce an implosion of the homogenous mixture. The implosion causes the homogenous mixture to fill the cavity between the first and second substrates without causing agglomeration of the anisotropic filler particles. The mixture filling the space between the first and second substrates has a homogenous distribution of the anisotropic filler particles.