Low alpha particle emission electrically-conductive coating
    33.
    发明授权
    Low alpha particle emission electrically-conductive coating 有权
    低α粒子发射导电涂层

    公开(公告)号:US09181440B2

    公开(公告)日:2015-11-10

    申请号:US14013390

    申请日:2013-08-29

    CPC classification number: C09D5/24 H01B1/20 H01B1/22 H01B1/24 Y10T428/1372

    Abstract: An electrically conductive paste providing low alpha particle emission is provided. A resin and conductive particles are mixed, and a curing agent is added. A solvent is subsequently added. The electrically conductive paste including a resin compound is formed by mixing the mixture in a high shear mixer. The electrically conductive paste can be applied to a surface of an article to form a coating, or can be molded into an article. The solvent is evaporated, and the electrically conductive paste is cured to provide a graphite-containing resin compound. The graphite-containing resin compound is electrically conductive, and provides low alpha particle emission at a level suitable for a low alpha particle emissivity coating.

    Abstract translation: 提供了提供低α粒子发射的导电膏。 混合树脂和导电颗粒,并加入固化剂。 随后加入溶剂。 通过在高剪切混合器中混合该混合物来形成包含树脂化合物的导电糊料。 导电性糊料可以施加到制品的表面以形成涂层,或者可以模制成制品。 蒸发溶剂,使导电糊固化,得到含石墨的树脂化合物。 含石墨的树脂化合物是导电的,并且在适于低α粒子​​发射率涂层的水平下提供低的α粒子发射。

    INJECTION OF A FILLER MATERIAL WITH HOMOGENEOUS DISTRIBUTION OF ANISOTROPIC FILLER PARTICLES THROUGH IMPLOSION
    36.
    发明申请
    INJECTION OF A FILLER MATERIAL WITH HOMOGENEOUS DISTRIBUTION OF ANISOTROPIC FILLER PARTICLES THROUGH IMPLOSION 有权
    注射通过腐蚀的均质填料颗粒均质分布的填料

    公开(公告)号:US20140377571A1

    公开(公告)日:2014-12-25

    申请号:US13925050

    申请日:2013-06-24

    Abstract: A method for providing a matrix material between a bonded pair of substrates with a homogeneous distribution of anisotropic filler particles is provided. Functionalized anisotropic filler particles are mixed uniformly with a matrix material to form a homogenous mixture. A bonded assembly of a first substrate and a second substrate with an array of electrical interconnect structures is placed within a vacuum environment. The homogenous mixture of the matrix material and the anisotropic filler particles is dispensed around the array of electrical interconnect structures. A gas is abruptly introduced into the vacuum environment to induce an implosion of the homogenous mixture. The implosion causes the homogenous mixture to fill the cavity between the first and second substrates without causing agglomeration of the anisotropic filler particles. The mixture filling the space between the first and second substrates has a homogenous distribution of the anisotropic filler particles.

    Abstract translation: 提供了一种在粘合的一对基板之间提供具有各向异性填料颗粒的均匀分布的基质材料的方法。 官能化的各向异性填料颗粒与基体材料均匀混合以形成均匀的混合物。 将第一基板和具有电互连结构阵列的第二基板的接合组件放置在真空环境内。 基体材料和各向异性填料颗粒的均匀混合物分布在电互连结构阵列周围。 气体突然引入真空环境以引起均匀混合物的内爆。 内爆使均匀混合物填充第一和第二基底之间的空腔,而不会引起各向异性填料颗粒的团聚。 填充第一和第二基板之间的空间的混合物具有各向异性填料颗粒的均匀分布。

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