公开(公告)号：US11851322B2

公开(公告)日：2023-12-26

申请号：US17249853

申请日：2021-03-16

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Jochen Dangelmaier

IPC: B81B7/00 ,  G01L9/08 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81C1/00301 ,  G01L9/08 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/095 ,  B81C2203/0154 ,  B81C2203/0792

Abstract: A sensor package comprises a MEMS sensor chip, a cover arranged over a first main surface of the MEMS sensor chip, said cover being fabricated from a mold compound, and an electrical through contact extending through the cover and to electrically couple the sensor package to a circuit board arranged over the cover.

公开(公告)号：US20210082861A1

公开(公告)日：2021-03-18

申请号：US17090941

申请日：2020-11-06

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Michael Bauer ,  Jochen Dangelmaier ,  Reimund Engl ,  Johann Gatterbauer ,  Frank Hille ,  Michael Huettinger ,  Werner Kanert ,  Heinrich Koerner ,  Brigitte Ruehle ,  Francisco Javier Santos Rodriguez ,  Antonio Vellei

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L21/02 ,  H01L23/495

Abstract: In various embodiments, a method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.

公开(公告)号：US20210028125A1

公开(公告)日：2021-01-28

申请号：US16935459

申请日：2020-07-22

Applicant: Infineon Technologies AG

Inventor： Jochen Dangelmaier ,  Klaus Elian

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, and an encapsulant encapsulating at least part of the electronic component and only part of the carrier so that another exposed part of the carrier is exposed with regard to the encapsulant. The exposed part of the carrier comprises an electric connection structure and a corrosion protection structure. One of the electric connection structure and the corrosion protection structure is selectively formed on only a sub-portion of the other one of the electric connection structure and the corrosion protection structure outside of the encapsulant.

公开(公告)号：US10781095B2

公开(公告)日：2020-09-22

申请号：US16222589

申请日：2018-12-17

Applicant: Infineon Technologies AG

Inventor： Jochen Dangelmaier ,  Manfred Schindler ,  Horst Theuss ,  Mathias Vaupel

IPC: B81B7/00 ,  B81C1/00

Abstract: Examples provided herein are associated with a molded lead frame of a sensor package. An example sensor package may include a molded lead frame that includes an opening in the molded lead frame, wherein the opening extends from a mount-side of the molded lead frame to a chip-side of the molded lead frame, wherein the chip-side of the molded lead frame is opposite the mount-side; and a sensor mounted to the chip-side of the molded lead frame.

公开(公告)号：US09658296B2

公开(公告)日：2017-05-23

申请号：US13939113

申请日：2013-07-10

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner ,  Volker Strutz ,  Jochen Dangelmaier ,  Rainer Steiner

IPC: G01R33/00 ,  B29C70/74 ,  G01R15/20 ,  H01L23/00

CPC classification number: G01R33/0047 ,  B29C70/745 ,  G01R15/20 ,  H01L24/48 ,  H01L2224/4809 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A current sensor device includes a casing having a cavity and a conductor fixedly mounted to the casing. A semiconductor chip configured to sense a magnetic field is arranged in the cavity. An electrically insulating medium is configured to at least partially fill the cavity of the casing.

公开(公告)号：US20160282212A1

公开(公告)日：2016-09-29

申请号：US14667858

申请日：2015-03-25

Applicant: Infineon Technologies AG

Inventor： Sebastian Beer ,  Helmut Wietschorke ,  Jochen Dangelmaier ,  Horst Theuss ,  Bernhard Knott ,  Thomas Mueller ,  Andreas Allmeier

IPC: G01L19/14 ,  H01L25/18 ,  H01L21/52 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: G01L19/147 ,  G01L19/0084 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49586 ,  H01L25/18 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012

Abstract: A molded semiconductor package includes a substrate having opposing first and second main surfaces, a semiconductor die attached to the first main surface of the substrate, an adhesion adapter attached to the second main surface of the substrate or a surface of the semiconductor die facing away from the substrate, and a mold compound encapsulating the semiconductor die, the adhesion adapter and at least part of the substrate. The adhesion adapter is configured to adapt adhesion properties of the mold compound to adhesion properties of the substrate or semiconductor die to which the adhesion adapter is attached, such that the mold compound more strongly adheres to the adhesion adapter than directly to the substrate or semiconductor die to which the adhesion adapter is attached. The adhesion adapter has a surface feature which strengthens the adhesion between the adhesion adapter and the mold compound.

Abstract translation: 模制的半导体封装包括具有相对的第一和第二主表面的基板，附接到基板的第一主表面的半导体管芯，附接到基板的第二主表面的粘合适配器或半导体管芯的远离 衬底和封装半导体管芯，粘合适配器和至少部分衬底的模具化合物。 粘合适配器被配置成使得模制化合物的粘合性能适应于粘合适配器所附着的基底或半导体管芯的粘合性能，使得模制化合物比直接连接到基底或半导体模具更强烈地粘附到粘合适配器 附着适配器附接到该装置。 粘合适配器具有加强粘合适配器和模具化合物之间的粘附的表面特征。

公开(公告)号：US09013013B1

公开(公告)日：2015-04-21

申请号：US14098585

申请日：2013-12-06

Applicant: Infineon Technologies AG

Inventor： Sebastian Beer ,  Helmut Wietschorke ,  Jochen Dangelmaier ,  Horst Theuss

IPC: H01L29/84 ,  G01L19/00 ,  H01L25/00

CPC classification number: G01L19/0069 ,  G01L19/141 ,  H01L23/24 ,  H01L23/3135 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/371 ,  H01L2224/40145 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the pressure sensor has a first side attached to the second side of the pressure sensor and a second side opposite the first side with electrical contacts. The logic die is laterally offset from the electrical contacts of the pressure sensor and operable to process signals from the pressure sensor. Electrical conductors connect the electrical contacts of the pressure sensor to the electrical contacts of the logic die. Molding compound encapsulates the pressure sensor, the logic die and the electrical conductors, and has an opening defining an open passage to the pressure sensor port. External electrical contacts are provided at a side of the pressure sensor package.

Abstract translation: 压力传感器组件包括压力传感器，该压力传感器具有第一侧，其具有压力传感器端口，与第一侧相对的第二侧和电触头。 堆叠在压力传感器上的逻辑管芯具有附接到压力传感器的第二侧的第一侧和具有电触点的与第一侧相对的第二侧。 逻辑管芯从压力传感器的电触头侧向偏移并可操作以处理来自压力传感器的信号。 电导体将压力传感器的电触点连接到逻辑管芯的电触头。 成型复合物封装压力传感器，逻辑管芯和电导体，并且具有限定到压力传感器端口的开放通道的开口。 外部电触头设置在压力传感器封装的一侧。