摘要:
An on-chip sensor measures dynamic power supply noise, such as voltage droop, on a semiconductor chip. In-situ logic is employed, which is sensitive to noise present on the power supply of functional logic of the chip. Exemplary functional logic includes a microprocessor, adder, and/or other functional logic of the chip. The in-situ logic performs some operation, and the amount of time required for performing that operation (i.e., the operational delay) is sensitive to noise present on the power supply. Thus, by evaluating the operational delay of the in-situ logic, the amount of noise present on the power supply can be measured.
摘要:
A semiconductor packaging system has a packaging substrate into which inductors and/or capacitors are partially or completely embedded. An active portion of a voltage regulator is mounted on the packaging substrate and supplies regulated voltage to a die also mounted on the packaging substrate. Alternatively, the active portion of the voltage regulator is integrated into the die the voltage regulator supplies voltage to. The voltage regulator cooperates with the inductors and/or capacitors to supply voltage to the die. The inductors may be through vias in the packaging substrate. For additional inductance, through vias in a printed circuit board on which the packaging substrate is mounted may couple to the through vias in the packaging substrate.
摘要:
Electronic circuits use latches including a magnetic tunnel junction (MTJ) structure and logic circuitry arranged to produce a selective state in the MTJ structure. Because the selective state is maintained magnetically, the state of the latch or electronic circuit can be maintained even while power is removed from the electronic device.
摘要:
A re-programmable gate logic includes a plurality of non-volatile re-configurable resistance state-based memory circuits in parallel, wherein the circuits are re-configurable to implement or change a selected gate logic, and the plurality of non-volatile re-configurable resistance state-based memory circuits are each adapted to receive a logical input signal. An evaluation switch in series with the plurality of parallel non-volatile re-configurable resistance state-based memory circuits is configured to provide an output signal based on the programmed states of the memory circuits. A sensor is configured to receive the output signal and provide a logical output signal on the basis of the output signal and a reference signal provided to the sensor. The reconfigurable logic may be implemented based on using spin torque transfer (STT) magnetic tunnel junction (MTJ) magnetoresistance random access memory (MRAM) as the re-programmable memory elements. The logic configuration is retained without power.
摘要:
A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps, couples the first tier IC to the second tier IC. An active portion of a voltage regulator is integrated in the first semiconductor IC and coupled to passive components (for example a capacitor or an inductor) embedded in a packaging substrate on which the stacked IC is mounted. The passive components may be multiple through vias in the packaging substrate providing inductance to the active portion of the voltage regulator. The inductance provided to the active portion of the voltage regulator is increased by coupling the through via in the packaging substrate to through vias in a printed circuit board that the packaging substrate is mounted on.
摘要:
A stacked integrated circuit (IC) device includes a semiconductor IC having an active face, and an interconnect structure. The active face receives a regulated voltage from a voltage regulator (MEG). An active portion of the VREG, which supplies the regulated voltage to the semiconductor IC is coupled to the interconnect structure. A packaging substrate includes one or more inductors including a first set of through vias. The first set of through vias are coupled to the interconnect structure and cooperate with the active portion to provide the regulated voltage for the semiconductor IC. The IC also includes a printed circuit board (PCB) coupled to the packaging substrate. The PCB includes a second set of through vias coupled to the first set of through vias. The IC also includes one or more conducting paths on the PCB. The conducting path(s) couple together at least two through vias of the second set of through vias.
摘要:
A semiconductor device having an on-chip voltage regulator to control on-chip voltage regulation and methods for on-chip voltage regulation are disclosed. A semiconductor device includes a circuit positioned between a ground bus and a power bus. A power switch array is positioned between the circuit and one of the ground bus or the power bus to generate a virtual voltage across the circuit. A monitor is positioned between the ground bus and the power bus. The monitor is configured to simulate a critical path of the circuit and to output a voltage adjust signal based on an output of the simulated critical path. A controller is configured to receive the voltage adjust signal and to output a control signal to the power switch array to control the virtual voltage.
摘要:
A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps, couples the first tier IC to the second tier IC. An active portion of a voltage regulator is integrated in the first semiconductor IC and coupled to passive components (for example a capacitor or an inductor) embedded in a packaging substrate on which the stacked IC is mounted. The passive components may be multiple through vias in the packaging substrate providing inductance to the active portion of the voltage regulator. The inductance provided to the active portion of the voltage regulator is increased by coupling the through via in the packaging substrate to through vias in a printed circuit board that the packaging substrate is mounted on.
摘要:
In one embodiment, an apparatus for reducing leakage in an electronic circuit (e.g., a CMOS circuit) includes a power switch transistor configured to selectively couple or decouple a voltage to a logic portion of the electronic circuit. The power switch transistor receives a first voltage during an active mode of the electronic circuit and receives a second voltage during a sleep mode of the electronic circuit. The power switch transistor has a bulk region that is biased using the first voltage during sleep mode. The power switch transistor has a gate region that is biased using the first voltage during sleep mode.
摘要:
A method of multiplying 32-bit values includes decomposing each multiplicand into its 16-bit components. This approach leads to a processor core design which permits re-use of much of the logic in the multiplication unit. The multiplication unit includes a selector which can feed various-sized data formats to the same multiplier circuits. Multiple data transformation paths are provided and feed into a single compression circuit and a single configurable full adder circuit.